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| Number | Title | Issue Date |
| 8115284 | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes on a w... | 02/14/2012 |
| 7968981 | Inline integrated circuit system An integrated circuit package system including: providing a leadframe with an integrated circuit mounted thereover; encapsulating the integrated circuit with an encapsulation; mounting an etch barrier below the leadframe; and etching the leadframe. ... | 06/28/2011 |
| 7911039 | Component arrangement comprising a carrier A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier... | 03/22/2011 |
| 7888782 | Apparatus and method configured to lower thermal stresses An apparatus and a method configured to lower thermal stress is disclosed. One embodiment provides a semiconductor chip, a lead frame and a layer structure. The layer structure includes at least a diffusion solder layer and a buffer layer. The layer structure is arr... | 02/15/2011 |
| 7880278 | Integrated circuit having stress tuning layer Warpage and breakage of integrated circuit substrates is reduced by compensating for the stress imposed on the substrate by thin films formed on a surface of the substrate. Particularly advantageous for substrates having a thickness substantially less than about 150... | 02/01/2011 |
| 7859089 | Copper straps A copper strap for a semiconductor device package having a contact electrically connected to a die electrode, a leg portion electrically connected to a lead frame, a web portion positioned between the contact and the leg portion and connected to the leg portion and ... | 12/28/2010 |
| 7808086 | Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion ... | 10/05/2010 |
| 7786554 | Stress-free lead frame The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (... | 08/31/2010 |
| 7745912 | Stress absorption layer and cylinder solder joint method and apparatus An apparatus, method, and system for providing a stress absorption layer for integrated circuits includes a stiffening layer adapted to limit flexing. A compliance layer is physically associated with the stiffening layer, with the compliance layer adapted to absorb ... | 06/29/2010 |
| 7714417 | Substrate for mounting semiconductor element and method of manufacturing the same The present invention provides a semiconductor element mounting substrate 101 including: a base substrate 1 having a region 2 for mounting a semiconductor element 11, the region 2 being set on the major surface of the base substrat... | 05/11/2010 |
| 7709936 | Module with carrier element The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connect... | 05/04/2010 |
| 7598602 | Controlling warping in integrated circuit devices Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to com... | 10/06/2009 |
| 7576416 | Chip package having with asymmetric molding and turbulent plate downset design A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having inner lead portions and outer lead portions. The turbulent plate is ben... | 08/18/2009 |
| 7518219 | Integrated heat spreader lid A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation regions are located between the center region and the outer periphery re... | 04/14/2009 |
| 7511362 | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is a step of forming electrodes (12 | 03/31/2009 |
| 7470979 | Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument A semiconductor device with its package size close to its chip size has a stress absorbing layer, allows a patterned flexible substrate to be omitted, and allows a plurality of components to be fabricated simultaneously. There is: a step of forming electrodes (12... | 12/30/2008 |
| 7453139 | Compliant terminal mountings with vented spaces and methods A compliant structure is provided on a semiconductor wafer. The compliant structure includes cavities. The compliant structure and the wafer seal the cavities during process steps used to form conductive elements on the compliant structure. After processing, vents a... | 11/18/2008 |
| 7446399 | Pad structures to improve board-level reliability of solder-on-pad BGA structures The present invention is directed to a new bonding pad structure having a rugged contact interface that makes it more difficult for a crack to grow from the peripheral edge of the bonding pad. The rugged contact interface also helps to accumulate more solder paste o... | 11/04/2008 |
| 7439611 | Circuit board with auxiliary wiring configuration to suppress breakage during bonding process A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconduc... | 10/21/2008 |
| 7420266 | Circuit device and manufacturing method thereof Provided is a circuit device having conductive patterns which are equally spaced apart and a manufacturing method thereof. A method for manufacturing a circuit device of the present invention includes the steps of: preparing a conductive foil; forming conductive pat... | 09/02/2008 |
| 7414302 | Flashless lead frame with horizontal singulation A lead frame is configured for use with a singulation apparatus that eliminates flash. A die pad is attached to sides of the frame by tie bars and peripheral portions. The peripheral portions have cutout sections defining openings that are bridged by lead frame segm... | 08/19/2008 |
| 7408246 | Controlling warping in integrated circuit devices Techniques for integrated circuit device fabrication are provided. In one aspect, an integrated circuit device comprises a base, at least one die attached to the base, and a counterbalancing layer on at least a portion of at least one side of the base adapted to com... | 08/05/2008 |
| 7408242 | Carrier with reinforced leads that are to be connected to a chip This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing the fraction of defects, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a... | 08/05/2008 |
| 7402894 | Integrated circuit carrier The present invention relates to an integrated circuit carrier. The integrated circuit carrier includes a receiving plate to which an integrated circuit can be mounted and a plurality of electrical connection islands surrounding the receiving plate. A plurality of r... | 07/22/2008 |
| 7388295 | Multi-chip module A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for ... | 06/17/2008 |
| 7365429 | Semiconductor device and method for manufacturing the same A semiconductor device, comprising: a semiconductor substrate in which an integrated circuit is formed, the semiconductor substrate having an electrode electrically connected to the integrated circuit; a resin layer formed on a face in which the electrode of the sem... | 04/29/2008 |
| 7364947 | Method for cutting lead terminal of package type electronic component In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse surface of each lead terminal before molding the molded part while lea... | 04/29/2008 |
| 7361977 | Semiconductor assembly and packaging for high current and low inductance A device comprising a semiconductor chip (110) having a side edge (111) and a plurality of metal bond pads (120, 121) near the edge; the pads are aligned to form rows (130, 131) parallel to the edge. The device further includes a leadfram... | 04/22/2008 |
| 7361533 | Stacked embedded leadframe A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of leads, each lead having a lower mounting portion; encapsulating the elec... | 04/22/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7345356 | Optical package with double formed leadframe Packages for an optical integrated circuit die and a method for making such packages are disclosed. The package includes a die, a die pad, a plurality of lead fingers, and an encapsulating dielectric material. The downward second pad surface of the die pad bearing a... | 03/18/2008 |
| 7342318 | Semiconductor package free of substrate and fabrication method thereof A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in t... | 03/11/2008 |
| 7342294 | SOI bipolar transistors with reduced self heating A bipolar transistor includes a collector located over a substrate; and a heat conductive path connecting the substrate to the collector. The heat conductive path is filled with a heat conductive material such as metal or polysilicon. In one embodiment the heat cond... | 03/11/2008 |
| 7339797 | Chip mount, methods of making same and methods for mounting chips thereon The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a plurality of tabs. The mount also includes a plurality of inner leads in ele... | 03/04/2008 |
| 7339259 | Semiconductor device A semiconductor device has an improved mounting reliability and has external terminals formed by exposing portions of leads from a back surface of a resin sealing member. End portions on one side of the leads are fixed to a back surface of a semiconductor chip, and ... | 03/04/2008 |
| 7339262 | Tape circuit substrate and semiconductor apparatus employing the same A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a substrate or apparatus which can supply a more stable power supply vol... | 03/04/2008 |
| 7339258 | Dual row leadframe and fabrication method A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substant... | 03/04/2008 |
| 7338838 | Resin-encapsulation semiconductor device and method for fabricating the same A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and ... | 03/04/2008 |
| 7332376 | Method of encapsulating packaged microelectronic devices with a barrier Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attache... | 02/19/2008 |
| 7332430 | Method for improving the mechanical properties of BOC module arrangements The invention relates to a method for improving the mechanical properties of BOC module arrangements in which chips have 3D structures, solder balls, μ springs or soft bumps which are mechanically and electrically connected by means of solder connections to termina... | 02/19/2008 |
