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| Number | Title | Issue Date |
| 8164168 | Semiconductor package A semiconductor package including a semiconductor chip; a base member on which the semiconductor chip is mounted; a plurality of leads formed on the base member, the leads including inner ends electrically connected to the semiconductor chip and outer ends; and an i... | 04/24/2012 |
| 8129825 | IC chip package employing substrate with a device hole In one embodiment of the present invention, an IC chip mounting package includes a film base member and an IC chip connected via an interposer. Connecting terminals on the film base member side of the interposer are provided so as to have a pitch larger than that of... | 03/06/2012 |
| 8093692 | Semiconductor device packaging including a power semiconductor element A portion of a frame body is fixed on a surface of a heat-radiating plate, and on frame body, a semiconductor chip is die-bonded. Next, a prescribed electrode of semiconductor chip and corresponding lead terminal and the like are electrically connected by a prescrib... | 01/10/2012 |
| 8089139 | Small outline package in which MOSFET and Schottky diode being co-packaged A TSOP (Thin Small Outline Package) contains a MOSFET and a Schottky diode. The MOSFET has a source terminal a gate terminal and a drain terminal. The Schottky diode has a cathode terminal, a anode terminal. The TSOP contains the MOSFET and the Schottky diode with a... | 01/03/2012 |
| 8072052 | Trench substrate Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy r... | 12/06/2011 |
| 8058713 | COF package and tape substrate used in same A COF package having a tape substrate including external input terminals and external output terminals provided in a chip non-mounting area, input wirings connected to the external input terminals respectively, output wirings connected to the external output termina... | 11/15/2011 |
| 8022513 | Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same A packaging substrate structure with electronic components embedded therein and a method for fabricating the same are disclosed. The packaging substrate structure comprises a core board with a wiring layer on the two opposite surfaces thereof; a first built-up struc... | 09/20/2011 |
| 7982290 | Contact spring application to semiconductor devices A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact ... | 07/19/2011 |
| 7968980 | Support member for mounting a semiconductor device, conductive materials, and its manufacturing method A semiconductor device comprises a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating substrate, and a sealing member covering a semiconductor element arranged on the support member, wherein the supp... | 06/28/2011 |
| 7928543 | Tape wiring substrate and tape package using the same A tape wiring substrate may have dispersion wiring patterns. The dispersion wiring patterns may be provided between input/output wiring pattern groups to compensate for the intervals therebetween. Connecting wiring patterns may be configured to connect the dispersio... | 04/19/2011 |
| 7915718 | Apparatus for flip-chip packaging providing testing capability A method and apparatus for increasing the integrated circuit density in a flip-chip semiconductor device assembly including an interposer substrate facilitating use with various semiconductor die conductive bump arrangements. The interposer substrate includes a plur... | 03/29/2011 |
| 7911038 | Wiring board, semiconductor device using wiring board and their manufacturing methods A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface... | 03/22/2011 |
| 7902647 | TAB package connecting host device element A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a... | 03/08/2011 |
| 7880277 | Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate ar... | 02/01/2011 |
| 7868430 | Semiconductor device This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads. ... | 01/11/2011 |
| 7868429 | Micro-sensor and manufacturing method thereof The micro-sensor for a micro image pick-up device includes a flexible circuit board and a circuit substrate. The flexible circuit board has an opening exposing an end of a plurality of metal wires. An image sensing device that electrically connected to a plurality o... | 01/11/2011 |
| 7851896 | Quad flat non-leaded chip package A Quad Flat Non-leaded (QFN) chip package including a patterned conductive layer, a first solder resist layer, a chip, a plurality of bonding wires and a molding compound is provided. The patterned conductive layer has a first surface and a second surface opposite t... | 12/14/2010 |
| 7825500 | Manufacturing process and structure for embedded semiconductor device A manufacturing process for an embedded semiconductor device is provided. In the manufacturing process, at least one insulation layer and a substrate are stacked to each other, and a third metal layer is laminated on the insulation layer to embed a semiconductor dev... | 11/02/2010 |
| 7821115 | Tape carrier package including a heat dissipation element A semiconductor device on a tape carrier package with improved heat dissipation, as provided. The number of outputs of the semiconductor device has been increased for implementing a multi-channel configuration, and narrower pitches are employed. Included are a tape ... | 10/26/2010 |
| 7772681 | Semiconductor die package and method for making the same Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die. ... | 08/10/2010 |
| 7759777 | Semiconductor module A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second mai... | 07/20/2010 |
| 7759776 | Space transformer having multi-layer pad structures Pad structures and methods for forming such pad structures are provided. For the pad structure, the first conductive material layer has a first hardness over about 200 kg/mm2. The second conductive material layer is over the first conductive material laye... | 07/20/2010 |
| 7696613 | Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same A multilayered wiring substrate is constructed by stacking wiring layers 105, 108, 110, 112 and insulating layers 104, 106, 107, 109 in predetermined number, with at least one of the wiring layers being formed as a reinforcing wiring layer 103 w... | 04/13/2010 |
| 7679170 | Electronic apparatus with wiring plates fixed directly to columns to space wiring circuit from base An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. ... | 03/16/2010 |
| 7671453 | Semiconductor device and method for producing the same A semiconductor device in which chips are resin-molded, including: frames having front and back surfaces and die pads; power chips mounted on the surfaces of the die pads; an insulation resin sheet having a first and a second surfaces which are opposed against each ... | 03/02/2010 |
| 7671454 | Tape carrier, semiconductor apparatus, and semiconductor module apparatus A tape carrier of the present invention includes an insulating tape and a wiring pattern formed on the insulating tape. The wiring pattern includes a connecting section via which the wiring pattern is connected to a bump electrode. The connecting section is provided... | 03/02/2010 |
| 7667306 | Leadframe-based semiconductor package A leadframe-based semiconductor package is revealed, primarily comprising a chip, a plurality of leads of a leadframe, a multi-layer tape, and an encapsulant. The multi-layer tape is attached to the chip and includes an adhesive layer disposed on a dielectric core l... | 02/23/2010 |
| 7667305 | Semiconductor device A semiconductor device according to the present invention includes a base tape (film carrier tape); a semiconductor chip mounted on the base tape; conducting leads formed on the base tape to be connected to the semiconductor chip; input terminals and output terminal... | 02/23/2010 |
| 7663209 | Inlet for an electronic tag Provided are an inlet for an electronic tag comprising an insulating film, antennas each made of a conductor layer and formed over one surface of the insulating film, a slit formed in a portion of each of the antennas and having one end extending toward the outer ed... | 02/16/2010 |
| 7656012 | Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another A chip-scale or wafer-level-package, having passivation layers on substantially all surfaces thereof to form a hermetically sealed-package, is provided. The package may be formed by disposing a first passivation layer on the passive or backside surface of a semicond... | 02/02/2010 |
| 7649246 | Tab package connecting host device element A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a... | 01/19/2010 |
| 7633142 | Flexible core for enhancement of package interconnect reliability An IC package is disclosed that comprises a core region disposed between upper and lower build-up layer regions. In one embodiment, the core region comprises a low modulus material. In an alternative embodiment the core region comprises a medium modulus material. In... | 12/15/2009 |
| 7582955 | Semiconductor device manufacturing method and manufacturing apparatus A method for manufacturing a semiconductor device is provided including: providing a reinforcing member on one surface of a wiring substrate that has a first region where a semiconductor chip is mounted and a second region around the first region, and has terminals ... | 09/01/2009 |
| 7569917 | Semiconductor device A semiconductor device includes a semiconductor chip, an insulating base film and first projecting electrodes. The first projecting electrodes are formed in a single row on one face of the semiconductor chip along the edge of the semiconductor chip. This face of the... | 08/04/2009 |
| 7521779 | Roughened printed circuit board A multi-layer structure including a base insulating layer and a thin metal film layer (seed layer) is prepared. A plating resist layer is formed to have a prescribed pattern on the upper surface of the thin metal film layer. A metal plating layer is formed on the th... | 04/21/2009 |
| 7514768 | Package structure for a semiconductor device incorporating enhanced solder bump structure A package structure for a semiconductor device comprises a substrate having a main surface and a back surface, a semiconductor chip formed on the main surface of the substrate, a package covering the semiconductor chip, radiation protrude electrodes and connection p... | 04/07/2009 |
| 7504715 | Packaging of a microchip device The present invention is directed to an interposer for packaging a microchip device, which includes a plurality of electrical contacts on an outer side of the interposer, for electrically contacting the packaged microchip device and to be electrically connected with... | 03/17/2009 |
| 7485951 | Modularized die stacking system and method An IC die and a flexible circuit structure are integrated into a lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in any of a variety of package types. The present invention may be employe... | 02/03/2009 |
| 7473987 | Semiconductor device According to the present invention, there is provided a semiconductor device comprising: a current driver which is connected to a power supply terminal, and supplies a predetermined current; a first wiring layer wh... | 01/06/2009 |
| 7473988 | Wiring board construction including embedded ceramic capacitors(s) A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such t... | 01/06/2009 |
