Did You Know...
...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 8076759 | Semiconductor package with a controlled impedance bus and method of forming same An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data cond... | 12/13/2011 |
| 8018035 | Semiconductor device and semiconductor integrated circuit The present invention provides a semiconductor device, including: a semiconductor substrate having a circuit formed thereon; a mounting substrate cemented to a rear face of the semiconductor substrate; a plurality of pads arranged in a linearly juxtaposed relationsh... | 09/13/2011 |
| 7626248 | Semiconductor package with a controlled impedance bus An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data cond... | 12/01/2009 |
| 7411279 | Component interconnect with substrate shielding An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive la... | 08/12/2008 |
| 7245192 | Coupler with edge and broadside coupled sections Couplers are disclosed that include first and second mutually coupled conductors. The coupled conductors may be regular or irregular in configuration, and for example, may be linear, including rectilinear or with one or more curves, bends or turns, such as forming a... | 07/17/2007 |
| 7230266 | Conditional Rabi oscillation readout for quantum computing A method for determining whether a first state of a quantum system is occupied is provided. A driving signal is applied to the system at a frequency corresponding to an energy level separation between a first and second state of the system. The system produces a rea... | 06/12/2007 |
| 7230319 | Electronic substrate A substrate for mounting a device is disclosed. The substrate includes at least one transition for providing an RF connection to a lead of the device, the lead extending from a device input to an otherwise free end. The transition comprises two spaced apart electric... | 06/12/2007 |
| 7211887 | connection arrangement for micro lead frame plastic packages A connection arrangement for a micro lead frame plastic (MLP) package is provided that includes a paddle configured to be connected to a circuit board and a first ground pad and a second ground pad each connected to the paddle. The first and second ground pads toget... | 05/01/2007 |
| 7187061 | Use of a down-bond as a controlled inductor in integrated circuit applications A Radio Frequency (RF) device includes a semi conductive die and a package in which the semi conductive die mounts. The semi conductive die includes a first portion of an RF circuit and a plurality of die pads formed thereon. The package includes a heat slug upon wh... | 03/06/2007 |
| 7169621 | Ferroelectric memory device A ferroelectric memory device of the present invention includes a memory cell array in which memory cells are arranged in a matrix having first signal electrodes, second signal electrodes arranged in a direction intersecting the first signal electrodes, and a ferroe... | 01/30/2007 |
| 7138887 | Coupler with lateral extension A coupler is disclosed that includes first and second mutually coupled spirals or loops disposed on opposite sides of a dielectric substrate. The substrate may be formed of one or more layers and the loops may have a number of turns appropriate for a given applicati... | 11/21/2006 |
| 7135717 | Semiconductor switches and switching circuits for microwave The purpose of the present invention is to provide a small-sized switch attaining high isolation of not less than 80 dB, maintaining low insertion loss also in high frequencies not less than 60 GHz. A semiconductor switch according to the present invention utilizes ... | 11/14/2006 |
| 7129534 | Magneto-resistive memory and method of manufacturing the same A method of forming a magneto-resistive memory element includes forming a groove in a layer of insulating material. A liner is formed conformably within the groove and the groove is filled with copper and then planarized. The electrically conductive material is prov... | 10/31/2006 |
| 7112870 | Semiconductor integrated circuit device including dummy patterns located to reduce dishing A large area dummy pattern DL is formed in a layer underneath a target T2 region formed in a scribe region SR of a wafer. A small area dummy pattern in a lower layer and a small area dummy pattern Ds2 in an upper layer are disposed in a region where th... | 09/26/2006 |
| 7105928 | Copper wiring with high temperature superconductor (HTS) layer Semiconductor devices and methods of forming the semiconductor devices using an HTS (High Temperature Superconductor) layer in combination with a typical diffusion layer between the dielectric material and the copper (or other metal) conductive wiring. The HTS layer... | 09/12/2006 |
| 7095042 | Electrode structure, semiconductor light-emitting device having the same and method of manufacturing the same A semiconductor light emitting device including a p-type electrode structure and having a low contact resistance and high reflectance is provided. The semiconductor light emitting device includes a transparent substrate, an electron injection layer having first and ... | 08/22/2006 |
| 7075171 | Superconducting system, superconducting circuit chip, and high-temperature superconducting junction device with a shunt resistor A superconducting system that includes an interface circuit capable of making the best use of a high-speed superconducting circuit and a high-speed semiconductor circuit. A multi-chip module in which an Nb superconducting circuit having josephson junctions formed by... | 07/11/2006 |
| 7042103 | Low stress semiconductor die attach A semiconductor device (121) is provided which comprises a substrate and a die (123) having a first surface which is attached to the substrate by way of a die attach material. At least a portion (127) of the perimeter of the die is resistant to ... | 05/09/2006 |
| 7042309 | Phase inverter and coupler assembly A circuit assembly may include one or more coupler sections, and may include a phase inverter and/or a phase shifter. A coupler section may include a phase inverter. A coupler may include first and second mutually coupled spirals disposed on opposite sides of a diel... | 05/09/2006 |
| 7015585 | Packaged integrated circuit having wire bonds and method therefor An integrated circuit is packaged using a package substrate that has a bottom side with a regular array of connection points and a top side with the integrated circuit on it. The package substrate also has vias that are present to provide electrical connection betwe... | 03/21/2006 |
| 7002238 | Use of a down-bond as a controlled inductor in integrated circuit applications A Radio Frequency (RF) device includes a semi conductive die and a package in which the semi conductive die mounts. The semi conductive die includes a first portion of an RF circuit and a plurality of die pads formed thereon. The package includes a heat slug upon wh... | 02/21/2006 |
| 6987282 | Quantum bit with a multi-terminal junction and loop with a phase shift A solid-state quantum computing qubit includes a multi-terminal junction coupled to a superconducting loop where the superconducting loop introduces a phase shift to the superconducting order parameter. The ground state of the supercurrent in the superconducting loo... | 01/17/2006 |
| 6972639 | Bi-level coupler A coupler is disclosed that includes first and second mutually coupled spirals disposed On opposite sides of a dielectric substrate. The substrate may be formed of one or more layers and the coils may have a number of turns appropriate for a given application. Condu... | 12/06/2005 |
| 6967393 | Semiconductor differential interconnect An interconnect is described including a semiconductor substrate having opposing surfaces, including first and second insulated conductors for transmitting signals. A third conductor substantially surrounds and is electrically insulated from the first and second ins... | 11/22/2005 |
| 6919579 | Quantum bit with a multi-terminal junction and loop with a phase shift A solid-state quantum computing qubit includes a multi-terminal junction coupled to a superconducting loop where the superconducting loop introduces a phase shift to the superconducting order parameter. The ground state of the supercurrent in the superconducting loo... | 07/19/2005 |
| 6911664 | Extra-substrate control system The present invention generally involves an extra-substrate control system comprising a first substrate, attached to which is at least one superconducting structure, and a second substrate, connected to which is at least one element of circuitry, wherein the superco... | 06/28/2005 |
| 6903447 | Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching An integrated circuit package houses and connects to a die to form an integrated circuit with internal matching. The package comprises a lead frame comprising at least one transmission line, a die paddle, and at least one input lead and at least one output lead. Bon... | 06/07/2005 |
| 6897548 | Semiconductor differential interconnect An interconnect is described including a semiconductor substrate having opposing surfaces, including first and second insulated conductors for transmitting signals. A third conductor substantially surrounds and is electrically insulated from the first and second ins... | 05/24/2005 |
| 6838749 | Structures for increasing the critical temperature of superconductors A method for increasing the critical temperature, Tc, of a high critical temperature superconducting (HTS) film (104) grown on a substrate (102) and a superconducting structure (100) made using the method. The HTS film has an a-b plan... | 01/04/2005 |
| 6838694 | Superconducting quantum-bit device based on Josephson junctions A superconducting quantum-bit device based on Josephson junction has a charge as a first principal degree of freedom assigned to writing and a phase as a second principal degree of freedom assigned to reading. The device comprises a Cooper-pair box comprising first ... | 01/04/2005 |
| 6828658 | Package for integrated circuit with internal matching An integrated circuit package houses and connects to a die to form an integrated circuit with internal matching. The package comprises a lead frame comprising at least one transmission line, a die paddle, and at least one input lead and at least one output lead. Bon... | 12/07/2004 |
| 6809403 | Fault tolerant electrical circuit and method An electrical circuit and method substantially to mitigate the effects of a current increase due to a fault within the circuit. In particular, where the electrical circuit (80) includes a laser diode it is desirable to create a fault tolerant circuit to avoid... | 10/26/2004 |
| 6806558 | Integrated segmented and interdigitated broadside- and edge-coupled transmission lines A combination edge- and broadside-coupled transmission line element formed in an integrated circuit chip, using semiconductor processes, in a stack of metal layers separated by dielectric layers. Each of the metal layers includes a number of transmission lines. Inte... | 10/19/2004 |
| 6787798 | Method and system for storing information using nano-pinned dipole magnetic vortices in superconducting materials A method includes providing a superconducting material having pinning sites that can pin magnetic vortices within the superconducting material. The method also includes pinning one or more magnetic vortices at one or more of the pinning sites. An information storage... | 09/07/2004 |
| 6784521 | Directional coupler A directional coupler that has a small package size and repeatable electrical characteristics. The directional coupler includes a low temperature co-fired ceramic (LTCC) substrate with several layers. Electrical components such as resistors and capacitors are integr... | 08/31/2004 |
| 6777808 | Capacitor for signal propagation across ground plane boundaries in superconductor integrated circuits The self inductance associated with a capacitance A52 in a superconductor integrated circuit (FIG. 1) is reduced by adding a layer of superconductor metal (A54) overlying the capacitor, effectively producing a negative inductance to counteract t... | 08/17/2004 |
| 6774463 | Superconductor gate semiconductor channel field effect transistor In a Field Effect Transistor (FET) with a semiconductor channel the use of a high Tc oxide superconductor material in the gate electrode provides both control of parasitic resistance and capacitance and a proper work function when operated at a temperatur... | 08/10/2004 |
| 6713853 | Electronic package with offset reference plane cutout An electronic package, such as a ball grid array (“BGA”) package, includes a high speed signal trace formed at a conductive layer and a corresponding reference plane formed at another conductive layer. The reference plane includes a cutout region formed therein;... | 03/30/2004 |
| 6642608 | MoNx resistor for superconductor integrated circuit A superconductor integrated circuit (10) includes a silicon substrate (12) a niobium ground layer (14), an anodized niobium first ground insulator layer (16), a second ground insulator layer (22), a molybdenum nitrogen (MoNx) resistor (18) prov... | 11/04/2003 |
| 6589810 | BGA package and method of fabrication A BGA package and a method for fabricating the package are provided. The package includes a semiconductor die, internal conductors wire bonded to bond pads on the die, external ball contacts attached to ball bonding pads formed on the conductors in a dens... | 07/08/2003 |
