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...that the first rickshaw was invented in 1869 by an American Baptist minister, the Rev. E. Jonathan Scobie, to transport his invalid wife around the streets of Yokohama?
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| Number | Title | Issue Date |
| 8174094 | Bonded structures formed by plasma enhanced bonding An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding the second surface of the substrate and the second surface of the subst... | 05/08/2012 |
| 8106486 | Electronic apparatus with an electrical conductor in the form of a liquid and an electrical insulator with a light-curing property In a method of making an electronic apparatus, electronic devices and a mold are placed in a package such that pads of electronic devices are covered with the mold. An electrical insulator is poured into the package, in which the mold is placed, to fill the package.... | 01/31/2012 |
| 7952173 | Nanometric device with a hosting structure of nanometric elements A nanometric device comprising a substrate; a plurality of conductive spacers of a conductive material, each conductive spacer being arranged on top of and transverse to the substrate, the conductive spacers including respective pairs of conductive spacers defining ... | 05/31/2011 |
| 7400029 | LED illumination system The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 1... | 07/15/2008 |
| 7368801 | Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same A fuse link is formed between first and second terminals. The first and second terminals and fuse link have a polysilicon layer and a layer formed on the polysilicon layer and containing a metal element. At least a portion of the fuse link is an amorphous silicon la... | 05/06/2008 |
| 7361978 | Laser diode packaging A laser diode package includes a heat sink, a laser diode, and an electrically nonconductive (i.e. insulative) substrate. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode further has first and second sid... | 04/22/2008 |
| 7321161 | LED package assembly with datum reference feature An LED package includes a datum reference feature that is external to the insulating body of the LED package and has a known, fixed relationship to the heat sink. The LED die is mounted to the heat sink such that the LED die has a fixed relationship to the heat sink... | 01/22/2008 |
| 7320904 | Manufacturing method for non-active electrically structures in order to optimize the definition of active electrically structures in an electronic circuit integrated on a semiconductor substrate and corresponding circuit A method for manufacturing electrically non-active structures for an electronic circuit integrated on a semiconductor substrate is provided, with the electronic circuit including first and second electrically active structures. The method includes inserting the elec... | 01/22/2008 |
| 7288828 | Metal oxide semiconductor transistor device A metal-oxide-semiconductor (MOS) transistor device is provided. The MOS transistor device includes a substrate, a gate structure, a spacer, a source/drain region and a barrier layer. The gate structure is disposed on the substrate. The gate structure includes a gat... | 10/30/2007 |
| 7288438 | Solder deposition on wafer backside for thin-die thermal interface material A solder is deposited on the backside of a wafer. The wafer can be pre-deposited with a barrier layer such as a titanium base and other materials. Deposition is carried out by electroplating, electroless plating, chemical vapor deposition, and physical vapor deposit... | 10/30/2007 |
| 7235875 | Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections... | 06/26/2007 |
| 7211891 | Electronic heat pump device, laser component, optical pickup and electronic equipment There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically a... | 05/01/2007 |
| 7202469 | Solid-state imaging device with molded resin ribs and method of manufacturing A solid-state imaging device includes a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal ... | 04/10/2007 |
| 7196403 | Semiconductor package with heat spreader A semiconductor package with heat spreader is disclosed. In one embodiment, the semiconductor package comprises a device carrier having a plurality of contact areas and a semiconductor die having a plurality of die pads of an active surface, the semiconductor die be... | 03/27/2007 |
| 7166914 | Semiconductor package with heat sink A packaged semiconductor chip including the chip, and a package element such as a heat sink is made by connecting flexible leads between contacts on the chip and terminals on a dielectric element such as a sheet or plate and moving the sheet or plate away from the c... | 01/23/2007 |
| 7091603 | Semiconductor device In a semiconductor device having semiconductor chips, a lower heat sink which is joined on the principal rear surface side of the semiconductor chips and an upper heat sink which is joined on the principal front surface side of the semiconductor chips, wherein subst... | 08/15/2006 |
| 7091602 | Miniature moldlocks for heatsink or flag for an overmolded plastic package A system of mold locks (28, 30) is formed on a heatsink (2) of a packaged semiconductor to prevent/mitigate delamination. The mold locks (4, 12) anchor a plastic mold compound (34) that forms the protective cover for the packaged semicond... | 08/15/2006 |
| 7084495 | Electroosmotic pumps using porous frits for cooling integrated circuit stacks A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integra... | 08/01/2006 |
| 7067903 | Heat spreader and semiconductor device and package using the same A semiconductor device and package has a heat spreader directly disposed on the reverse surface of the semiconductor device. This heat spreader includes a diamond layer or a layer containing diamond and ceramics such as silicon carbide and aluminum nitride. The heat... | 06/27/2006 |
| 7060515 | Method of manufacturing a laser diode package A laser diode package includes a heat sink, a laser diode, and an electrically nonconductive (i.e. insulative) substrate. The laser diode has an emitting surface and a reflective surface opposing the emitting surface. The laser diode further has first and second sid... | 06/13/2006 |
| 7057298 | Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material A switching chip using silicon as the base material is located on the upper surface of a cooling mechanism formed of a heat sink, an insulating substrate and a conductive plate, with a first conductive layer sandwiched in between. Further, a diode chip having a smal... | 06/06/2006 |
| 7053426 | Semiconductor device with heat sink A semiconductor device includes a glass substrate, a heat sink formed on the glass substrate and a transistor formed on the heat sink. The transistor includes an active layer formed on the heat sink and having a source region, a channel region and a drain region. A ... | 05/30/2006 |
| 7053417 | Semiconductor led device and producing method The present invention provides a semiconductor device with InxGa1-xN crystal passivation layer and manufacturing method thereof which effectively blocks the leakage current between the surface & boundary of a device and a pn-junction boundary, and enhances the light... | 05/30/2006 |
| 7030501 | Semiconductor device and switching element A conventional one-chip dual MOSFET has a structure in which two chips are arranged side by side and drain electrodes are short-circuited. Therefore, the mounting area thereof is large, and the resistance between the drain electrodes cannot be reduced. Accordingly, ... | 04/18/2006 |
| 7015073 | Method of forming heat spreader with down set leg attachment feature Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are disclosed, as well as novel apparatus and methods for attaching the he... | 03/21/2006 |
| 7001800 | Manufacturing method for non-active electrically structures in order to optimize the definition of active electrically structures in an electronic circuit integrated on a semiconductor substrate and corresponding circuit A method for manufacturing electrically non-active structures for an electronic circuit integrated on a semiconductor substrate is provided, with the electronic circuit including first and second electrically active structures. The method includes inserting the elec... | 02/21/2006 |
| 7002247 | Thermal interposer for thermal management of semiconductor devices A thermal interposer is provided for attachment to the back surface of a semiconductor device so as to give a very low thermal resistance. In one preferred embodiment, the thermal interposer has two plates containing wick structures such as grooves. The thermal inte... | 02/21/2006 |
| 6995467 | Semiconductor component A semiconductor component contains two semiconductor bodies, which are spatially separated from one another and electrically interconnected. A compensation MOS field effect transistor is provided as the first semiconductor body, and a silicon carbide Schottky diode ... | 02/07/2006 |
| 6977424 | Electrically pumped semiconductor active region with a backward diode, for enhancing optical signals An electrically pumped optical device includes a semiconductor active region and a backward diode. Both of these structures are located in the current path of the optical device, which is oriented primarily vertically. The active region has a finite extent along at ... | 12/20/2005 |
| 6972443 | Structure and method of forming a bipolar transistor having a self-aligned raised extrinsic base using link-up region formed from an opening therein A bipolar transistor is provided which includes a collector region, an intrinsic base layer including a single-crystal semiconductor overlying the collector region, and an emitter disposed within a first opening overlying the intrinsic base layer. The bipolar transi... | 12/06/2005 |
| 6946686 | Method of fabricating semiconductor device and semiconductor device A first conductive type layer having a band gap energy smaller than that of an under growth layer formed on a substrate is formed by selective growth from an opening portion formed in the under growth layer, and an active layer and a second conductive type layer are... | 09/20/2005 |
| 6940720 | Integrated circuit having a thermally shielded electric resistor trace An integrated circuit includes an electric resistor trace, a substrate and a thermally conductive structure arranged above or below the electric resistor trace for dissipating heat from the electric resistor trace to the substrate. The present invention is based on ... | 09/06/2005 |
| 6936868 | Sequential mesa avalanche photodiode capable of realizing high sensitization and method of manufacturing the same A sequential mesa type avalanche photodiode (APD) includes a semiconductor substrate and a sequential mesa portion formed on the substrate. In the sequential mesa portion, a plurality of semiconductor layers, including a light absorbing layer and a multiplying layer... | 08/30/2005 |
| 6933606 | Semiconductor device whose semiconductor chip has chamfered backside surface edges and method of manufacturing the same A semiconductor element is formed in the major surface of a semiconductor chip. Curved surfaces having a radius of curvature of 0.5 to 50 μm are formed at at least some of edges where the side surfaces and backside surface of the semiconductor chip cross. ... | 08/23/2005 |
| 6919630 | Semiconductor package with heat spreader A semiconductor package with an embedded heat spreader (EHS) is proposed, which can be used for the fabrication of a semiconductor package, such as a FCBGA (Flip-Chip Ball Grid Array) package with a heat spreader, and which is characterized by the provision of a plu... | 07/19/2005 |
| 6888178 | Method and system for magnetically assisted statistical assembly of wafers A wafer having heterostructure therein is formed using a substrate with recesses formed within a dielectric layer. A magnetized magnetic layer or a polarized electret material is formed at the bottom of each recess. The magnetized magnetic layer or a polarized elect... | 05/03/2005 |
| 6876061 | Chip scale surface mount package for semiconductor device and process of fabricating the same A semiconductor package by which contacts are made to both sides of the dice is manufactured on a wafer scale. The back side of the wafer is attached to a metal plate. The scribe lines separating the dice are saw cut to expose the metal plate but the cuts do not ext... | 04/05/2005 |
| 6861730 | Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material A switching chip (101) using silicon as the base material is located on the upper surface of a cooling mechanism formed of a heat sink (115), an insulating substrate (114) and a conductive plate (108), with a first conductive layer (10... | 03/01/2005 |
| 6844214 | Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication A microelectromechanical system (MEMS) based sensor comprises: a substrate defining a plane; a first conductive material layer having a first stress, a first portion of the first conductive material layer being connected to the substrate and extending in a substanti... | 01/18/2005 |
| 6831351 | Semiconductor device with semiconductor chip formed by using wide gap semiconductor as base material A switching chip (101) using silicon as the base material is located on the upper surface of a cooling mechanism formed of a heat sink (115), an insulating substrate (114) and a conductive plate (108), with a first conductive layer (10... | 12/14/2004 |
