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Class 257/581 - Thin film ballasting means (e.g., polysilicon resistor)


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the ballasting means comprises thin
No. of patents: 35
Last issue date: 08/19/2008


NumberTitleIssue Date
7414298Super self-aligned collector device for mono-and hetero bipolar junction transistors, and method of making same
The invention relates to a process of forming a compact bipolar junction transistor (BJT) that includes forming a self-aligned collector tap adjacent the emitter stack and an isolation structure. A base layer is formed from epitaxial silicon that is disposed in the ...
08/19/2008
7365397Semiconductor device
The semiconductor device comprises a resistance element 26 formed of polysilicon film formed on a silicon substrate 10, which includes a resistor part 26a having a resistance value set at a prescribed value, contact parts 26b
04/29/2008
7323762Semiconductor package substrate with embedded resistors and method for fabricating the same
A semiconductor package substrate with embedded resistors and a method for fabricating the same are proposed. Firstly, an inner circuit board having a first circuit layer thereon is provided, and a plurality of resistor electrodes are formed in the fist circuit laye...
01/29/2008
7268413Bipolar transistors with low-resistance emitter contacts
Many integrated circuits include a type of transistor known as a bipolar junction transistor, which has an emitter contact formed of polysilicon. Unfortunately, polysilicon has a relatively high electrical resistance that poses an obstacle to improving switching spe...
09/11/2007
7250348Apparatus and method for packaging semiconductor devices using a patterned photo sensitive film to reduce stress buffering
A method and apparatus for packaging semiconductor devices using patterned laminate films to reduce stress buffering. The method includes fabricating a semiconductor die having thin film resistors and bond pads formed on an active surface. A film layer is formed ont...
07/31/2007
7180139Pixel structure
A pixel structure controlled by a scan line and a data line on a substrate is provided. The pixel structure comprises a thin film transistor, a resistance wire, a first pixel electrode, and a second pixel electrode, which are disposed on the substrate. Additionally,...
02/20/2007
7019337Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods of forming a power transistor
Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device p...
03/28/2006
6897545Lateral operation bipolar transistor and a corresponding fabrication process
The transistor includes an emitter region 17 disposed in a first isolating well 11, 150 formed in a semiconductor bulk. An extrinsic collector region 16 is disposed in a second isolating well 3, 150 formed in the semiconductor bulk SB and...
05/24/2005
6858917Metal oxide semiconductor (MOS) bandgap voltage reference circuit
A metal oxide semiconductor (MOS) bandgap voltage reference circuit with a plurality of dummy bipolar junction transistors (BJTs) coupled to the mismatched parasitic substrate BJTs for improving parasitic capacitance matching, thereby improving startup behavior of t...
02/22/2005
6767781Structure and method of forming bitline contacts for a vertical DRAM array using a line bitline contact mask
A bitline contact and method of forming bitline contact for a vertical DRAM array using a bitline contact mask. In the method, gate conductor lines are formed. An oxide layer is deposited over the gate conductor lines, and a bitline contact mask is formed over porti...
07/27/2004
6703685Super self-aligned collector device for mono-and hetero bipolar junction transistors
The invention relates to a process of forming a compact bipolar junction transistor (BJT) that includes forming a self-aligned collector tap adjacent the emitter stack and an isolation structure. A base layer is formed from epitaxial silicon that is dispo...
03/09/2004
6690082High dopant concentration diffused resistor and method of manufacture therefor
The present invention provides a high dopant concentration diffused resistor, a method of manufacture therefor, and an integrated circuit including the same. In one embodiment of the invention, the high dopant concentration diffused resistor includes a do...
02/10/2004
6656812Vertical bipolar transistor having little low-frequency noise and high current gain, and corresponding fabrication process
A vertical bipolar transistor includes a semiconductor substrate, an extrinsic collector layer in the semiconductor substrate, an intrinsic collector on the extrinsic collector, a lateral isolating region surrounding an upper part of the intrinsic collect...
12/02/2003
6482710Bipolar transistor and manufacting method thereof
A bipolar transistor according to the invention is provided with structure that an intrinsic base made of single crystal Si--Ge and a base leading-out electrode are connected via a link base made of polycrystal Si--Ge by doping at high concentration, furt...
11/19/2002
6437419Emitter ballast resistor with enhanced body effect to improve the short circuit withstand capability of power devices
A power semiconductor device has an integral source/emitter ballast resistor. The gate has partial gate structures spaced apart from each other. Emitter resistors are provided beneath sidewall spacers on the ends of the gate structures. The emitter resist...
08/20/2002
6211562Homojunction semiconductor devices with low barrier tunnel oxide contacts
A homojunction bipolar transistor with performance characteristics similar to more costly heterojunction or retrograde base transistors. The high emitter resistivity found in prior homojunction devices is circumvented using a low work function material la...
04/03/2001
6130471Ballasting of high power silicon-germanium heterojunction biploar transistors
A ballasted transistor structure reduces thermal runaway. A heterojunction bipolar junction transistor array includes a plurality of transistors, each having an emitter, a base and a collector. Each of the bases is an alloy of silicon and germanium and ea...
10/10/2000
6013942Bipolar transistor structure
In order to avoid thermal runaway bipolar transistors, emitters are provided with ballast resistors. Elongate ballast resistors may be used, part of the lengths being connected for obtaining suitable resistance and design variability. The emitters are spl...
01/11/2000
5990539Transistor component having an integrated emitter resistor
A transistor component is suited for controlling large currents, even given high frequencies. The transistor component includes integrated emitter resistors which are arranged between partial-emitter regions and emitter-metal contacts. The integrated emit...
11/23/1999
5907180Ballast monitoring for radio frequency power transistors
The present invention, generally speaking, provides an apparatus and method whereby the current flow through an RF power transistor may be monitored without the use of any external parts. More particularly, in accordance with one embodiment of the inventi...
05/25/1999
5821602RF power transistor having improved stability and gain
Increased gain and improved stability are realized in using resistive emitter ballasting by including integrated capacitive elements in parallel with the resistive elements in the emitter circuit. A feature of the invention is an integrated capacitor stru...
10/13/1998
5798561Bipolar transistor with polysilicon base
A semiconductor device including a bipolar transistor is provided, which can reduce the base resistance of the transistor. This device includes a semiconductor base region having a first semiconductor active region of a first conductivity type in its insi...
08/25/1998
5760457Bipolar transistor circuit element having base ballasting resistor
A bipolar transistor circuit element includes a semiconductor substrate; successively disposed on the substrate, a base layer, an emitter layer, and a collector layer; a bipolar transistor formed from parts of the collector, base, and emitter layers and i...
06/02/1998
5684326Emitter ballast bypass for radio frequency power transistors
An apparatus and method are provided for bypassing the emitter ballast resistors of a power transistor, thereby increasing transistor gain. In a power transistor of the interdigitated type, bypassing the emitter ballast resistors requires bypassing each i...
11/04/1997
5594272Bipolar transistor with base and emitter contact holes having shorter central portions
An insulating film formed on a base region is patterned to form emitter contact holes and base contact holes arranged alternately in such a manner that those contact holes are short in the center portion and become longer toward the peripheral portions, a...
01/14/1997
5510642Semiconductor device
An insular shaped polycrystalline silicon film is formed by adhering its entire bottom face to the surface of a insulation film which is formed on the main face of a silicon substrate. A resistance element which contains designated impurities is formed in...
04/23/1996
5444292Integrated thin film approach to achieve high ballast levels for overlay structures
The ballast resistance of a semiconductor device is increased without decreasing the figure of merit of the device. The semiconductor device includes an emitter feeder, a first contact coupled to the emitter feeder, a second contact, a resistive medium co...
08/22/1995
5374844Bipolar transistor structure using ballast resistor
A transistor structure incorporates a polysilicon layer which is doped with N-type dopants and is used as an emitter ballast resistor in an array of NPN transistors. In one embodiment, the polysilicon layer is also used as a diffusion source to form N-typ...
12/20/1994
5298785Semiconductor device
A multi-emitter type semiconductor device having multiple transistors coupled in parallel which utilize a common substrate. Between a selected emitter electrode and a base contact, a stabilizing resistive region is formed in the common substrate. In order...
03/29/1994
4680608Semiconductor device
This application describes a semiconductor device having a power amplifier pattern consisting of a plurality of parallel-connected transistor unit cells with emitters thereof being arrayed like meshes, wherein the width of the emitter of each transistor u...
07/14/1987
4626886Power transistor
The invention relates to a power transistor with a semiconductor body. When shutting off a power transistor, local fusing of the semiconductor body may occur, if a characteristic power loss is exceeded for a certain period of time (second breakdown). This...
12/02/1986
4411708Method of making precision doped polysilicon vertical ballast resistors by multiple implantations
The structure and associated fabrication processes disclosed provide a resistive element directly over a specific semiconductor region. Use of such a structure in a high current device ballasts emitter fingers to improve the maximum current flow of the de...
10/25/1983
4243998Safety circuit for a semiconductor element
The negative temperature coefficient effect, which results in destructive current flow above a certain temperature in a semiconductor device is counteracted by a layer of conductive material that has low resistance at normal temperatures but has a positiv...
01/06/1981
4126879Semiconductor device with ballast resistor adapted for a transcalent device
An improvement for a transcalent semiconductor device includes a semiconductor ballast resistor in contact with the emitter regions of a semiconductor transistor. The semiconductor transistor with the ballast resistor in contact therewith is sandwiched be...
11/21/1978
4008484Semiconductor device having multilayered electrode structure
A semiconductor device wherein two conductive layers, insulated from one another, are laminated on one surface of a semiconductor wafer is described. The two conductive layers are in ohmic contact with two regions of the opposite conduction type to one an...
02/15/1977
 
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