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| Number | Title | Issue Date |
| 7948058 | Semiconductor device and semiconductor integrated circuit device for driving plasma display using the semiconductor device A lateral IGBT structure having an emitter terminal including two or more base layers of a second conductivity-type for one collector terminal, in which the base layers of a second conductivity-type in emitter regions are covered with a first conductivity-type layer... | 05/24/2011 |
| 7859082 | Lateral bipolar transistor and method of production Emitter and collector regions of the bipolar transistor are formed by doped regions of the same type of conductivity, which are separated by doped semiconductor material of an opposite type of conductivity, the separate doped regions being arranged at a surface of a... | 12/28/2010 |
| 7633139 | Semiconductor diode device with lateral transistor The invention is directed to a semiconductor device having a diode element which prevents a leakage current due to a vertical parasitic bipolar transistor and enhances current efficiency. An element isolation insulation film is provided on an N well layer, and a fir... | 12/15/2009 |
| 7422952 | Method of forming a BJT with ESD self protection A ballasting region is placed between the base region and the collector contact of a bipolar junction transistor to relocate a hot spot away from the collector contact of the transistor. Relocating the hot spot away from the collector contact prevents the collector ... | 09/09/2008 |
| 7355263 | Semiconductor device and manufacturing method thereof A semiconductor device and method of manufacturing the same includes an n−-single crystal silicon substrate, with an oxide film selectively formed thereon. On the oxide film, gate polysilicon is formed. The surface of the gate polysilicon is covered wit... | 04/08/2008 |
| 7342293 | Bipolar junction transistors (BJTS) with second shallow trench isolation (STI) regions, and methods for forming same The present invention relates to bipolar junction transistors (BJTS). The collector region of each BJT is located in a semiconductor substrate surface and adjacent to a first shallow trench isolation (STI) region. A second STI region is provided, which extends betwe... | 03/11/2008 |
| 7329925 | Device for electrostatic discharge protection A device for electrostatic discharge (ESD) protection is disclosed. The device for electrostatic discharge protection includes a lateral bipolar transistor and a diode. The semiconductor transistor has an emitter, a base and a collector electrically connected to a f... | 02/12/2008 |
| 7326642 | Method of fabricating semiconductor device using low dielectric constant material film The semiconductor device is capable of coping with speedup of operation using a low dielectric constant material film other than silicon. The base (10) formed by the substrate (11) and the low dielectric constant material film (12) whose relativ... | 02/05/2008 |
| 7301220 | Semiconductor device and method of forming a semiconductor device A bipolar high voltage/power semiconductor device has a low voltage terminal and a high voltage terminal. The device has a drift region of a first conductivity type and having first and second ends. In one example, a region of the second conductivity type is provide... | 11/27/2007 |
| 7297607 | Device and method of performing a seasoning process for a semiconductor device manufacturing apparatus A method of performing a seasoning process for a semiconductor device processing apparatus is provided by the present invention. The method includes: forming a material layer on a test wafer; coating a photoresist on the material layer; patterning the photoresist so... | 11/20/2007 |
| 7288816 | Semiconductor device According to a semiconductor device of an embodiment of the present invention, a P-type buried diffusion layer is formed across a substrate and an epitaxial layer. An N-type buried diffusion layer is formed in the P-type buried diffusion layer. An overvoltage protec... | 10/30/2007 |
| 7286637 | Optical thin film and mirror using the same To provide an optical thin film structure capable of efficiently dissipating heat in an optical thin film which is generated upon irradiating a surface of an X-ray mirror made up of the optical thin film with an X-ray. The optical thin film having an isotope purity ... | 10/23/2007 |
| 7276744 | Semiconductor device and method of manufacturing the same This invention is intended to provide an HBT capable of achieving, if the HBT is a collector-up HBT, the constriction of the emitter layer disposed directly under an external base layer, and reduction in base-emitter junction capacity, or if the HBT is an emitter-up... | 10/02/2007 |
| 7268413 | Bipolar transistors with low-resistance emitter contacts Many integrated circuits include a type of transistor known as a bipolar junction transistor, which has an emitter contact formed of polysilicon. Unfortunately, polysilicon has a relatively high electrical resistance that poses an obstacle to improving switching spe... | 09/11/2007 |
| 7265018 | Method to build self-aligned NPN in advanced BiCMOS technology The present invention provides a method of forming a self-aligned heterobipolar transistor (HBT) device in a BiCMOS technology. The method includes forming a raised extrinsic base structure by using an epitaxial growth process in which the growth rate between single... | 09/04/2007 |
| 7265434 | Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms of a lateral trench MOSFET, and a 30V lateral N-channel DMOS. Each o... | 09/04/2007 |
| 7262443 | Silicide uniformity for lateral bipolar transistors Method and apparatus for forming a semiconductor device. The method includes defining a plurality of rows in a semiconductor layer. Thereafter, on one or more of the plurality of rows, one or more bipolar junction devices are formed. Each of the bipolar junction dev... | 08/28/2007 |
| 7262478 | Semiconductor device and manufacturing method thereof A semiconductor device and method of manufacturing the same includes an n−-single crystal silicon substrate, with an oxide film selectively formed thereon. On the oxide film, gate polysilicon is formed. The surface of the gate polysilicon is covered wit... | 08/28/2007 |
| 7247926 | High-frequency switching transistor A high-frequency switching transistor comprises a collector area, which has a first conductivity type, a first barrier area bordering on the collector area, which has a second conductivity type which differs from the first conductivity type, and a semiconductor area... | 07/24/2007 |
| 7238971 | Self-aligned lateral heterojunction bipolar transistor A lateral heterojunction bipolar transistor (HBT) comprising a semiconductor substrate having having a first insulating layer over the semiconductor substrate. A base trench is formed in a first silicon layer over the first insulating layer to form a collector layer... | 07/03/2007 |
| 7221036 | BJT with ESD self protection A ballasting region is placed between the base region and the collector contact of a bipolar junction transistor to relocate a hot spot away from the collector contact of the transistor. Relocating the hot spot away from the collector contact prevents the collector ... | 05/22/2007 |
| 7217975 | Lateral type semiconductor device A lateral semiconductor device includes: a semiconductor substrate formed on a base region therein; a plurality of emitter regions with a triangle arrangement in an upper part of the base layer and collector regions surrounding the emitter regions, respectively, apa... | 05/15/2007 |
| 7186623 | Integrated semiconductor device and method of manufacturing thereof An integrated semiconductor device containing semiconductor elements that have respective desired on-resistances and breakdown voltages achieves appropriate characteristics as a whole of the integrated semiconductor element. The integrated semiconductor device inclu... | 03/06/2007 |
| 7173320 | High performance lateral bipolar transistor A lateral bipolar transistor includes an emitter region, a base region, a collector region, and a gate disposed over the base region. A bias line is connected to the gate for applying a bias voltage thereto during operation of the transistor. The polarity of the bia... | 02/06/2007 |
| 7173274 | Incorporation of carbon in silicon/silicon germanium epitaxial layer to enhance yield for Si-Ge bipolar technology A SiGe bipolar transistor containing substantially no dislocation defects present between the emitter and collector region and a method of forming the same are provided. The SiGe bipolar transistor includes a collector region of a first conductivity type; a SiGe bas... | 02/06/2007 |
| 7166232 | Method for producing a solid body including a microstructure According to a method for producing a solid body (1) including a microstructure (2), the surface of a substrate (3) is provided with a masking layer (6) that is impermeable to a substance to be applied. The substance is then incorporated ... | 01/23/2007 |
| 7161198 | Semiconductor integrated circuit device having MOS transistor An N-channel MOS transistor of a semiconductor device having a high withstand voltage employs a drain structure with a low concentration and a large diffusion depth, which causes a problem in that a sufficiently high withstand voltage cannot be obtained due to a par... | 01/09/2007 |
| 7145206 | MOS field effect transistor with reduced parasitic substrate conduction A MOS field effect transistor includes an auxiliary diffusion formed in the drain region where the auxiliary diffusion has a conductivity type opposite to the drain region and is electrically shorted to the drain region. The auxiliary diffusion region forms a parasi... | 12/05/2006 |
| 7138315 | Low thermal resistance semiconductor device and method therefor A semiconductor device is formed to have a shape that reduces the thermal resistance of the semiconductor device. ... | 11/21/2006 |
| 7126171 | Bipolar transistor A bipolar transistor of the present invention comprises a collector layer made of an n-type semiconductor and an emitter layer made of an n-type semiconductor provided on this collector layer. A gate layer for injecting p-type carriers (holes) into the emitter layer... | 10/24/2006 |
| 7126190 | Self-aligned gate and method A semiconductor structure includes a silicon substrate of a first conductivity type including wells of a second conductivity type formed on a surface thereof. The wells may be laterally isolated by shallow trench isolation. Transistors are formed in the wells by fir... | 10/24/2006 |
| 7115965 | Vertical bipolar transistor with a majority carrier accumulation layer as a subcollector for SOI BiCMOS with reduced buried oxide thickness for low-substrate bias operation The present invention provides a “subcollector-less” silicon-on-insulator (SOI) bipolar junction transistor (BJT) that has no impurity-doped subcollector. Instead, the inventive vertical SOI BJT uses a back gate-induced, majority carrier accumulation layer as th... | 10/03/2006 |
| 7098113 | Method and system for providing a power lateral PNP transistor using a buried power buss A power lateral PNP device is disclosed which includes an epitaxial layer; a first and second collector region embedded in the epitaxial layer; an emitter region between the first and second collector regions. Therefore slots are placed in each of the regions. Accor... | 08/29/2006 |
| 7084485 | Method of manufacturing a semiconductor component, and semiconductor component formed thereby A method of manufacturing a semiconductor component includes: providing a semiconductor substrate (210, 510); forming a trench (130, 430) in the semiconductor substrate to define a plurality of active areas separated from each other by the trench; form... | 08/01/2006 |
| 7081662 | ESD protection device for high voltage An electrostatic discharge (ESD) protection structure and a method for forming the same are provided. The structure includes a substrate having a buried layer, and a first and a second high-voltage well region on the buried layer. The first and second high-voltage w... | 07/25/2006 |
| 7077901 | Process for producing single crystal silicon wafers A process for producing a single crystal silicon wafer, comprising the steps of forming a porous layer on a single crystal silicon substrate comprising a silicon whose concentration of mass number 28 silicon isotope is less than 92.5% on an average; dissolving a sta... | 07/18/2006 |
| 7079829 | Semiconductor differential circuit, oscillation apparatus, switching apparatus, amplifying apparatus, mixer apparatus and circuit apparatus using same, and semiconductor differential circuit placement method A semiconductor differential circuit comprising a semiconductor substrate, a first semiconductor device on the semiconductor substrate having a gate electrode for having one of differential signals conveyed thereto and a drain electrode for outputting one of the dif... | 07/18/2006 |
| 7075156 | Collector structure for electrostatic discharge protection circuits Electrostatic discharge (ESD) devices for protection of integrated circuits are described. ESD devices may be configured to provide uniform breakdown of finger regions extending through a first region of a substrate having a first conductivity type and into a second... | 07/11/2006 |
| 7067899 | Semiconductor integrated circuit device A semiconductor integrated circuit device according to the invention includes an N-type embedded diffusion region between a substrate and a first epitaxial layer in island regions serving as small signal section. The substrate and the first epitaxial layer are thus ... | 06/27/2006 |
| 7067898 | Semiconductor device having a self-aligned base contact and narrow emitter A semiconductor structure having a self-aligned base contact and an emitter, where the base contact is electrically isolated from the emitter by a dielectric layer. The separation between the base contact and the emitter is determined by the thickness of the dielect... | 06/27/2006 |
