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Class 257/470 - Pn junction adapted as temperature sensor


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the active junction is a pn junction
No. of patents: 130
Last issue date: 01/03/2012


1        
NumberTitleIssue Date
8089134Semiconductor device
A semiconductor device equipped with a primary semiconductor element and a temperature detecting element for detecting a temperature of the primary semiconductor element. The device includes a first semiconductor layer of a first conductivity type that forms the pri...
01/03/2012
8018019Space-charge-free semiconductor and method
A semiconductor having a an n-type material and a p-type material, wherein the n-type material and p-type material are joined to form a space-charge-free p-n junction. The energy of the Fermi-level of the n-type material is equal to the energy of the Fermi-level of ...
09/13/2011
7598584Infrared solid-state image pickup apparatus and a production method thereof
An infrared solid-state image pickup apparatus includes an SOI substrate having a silicon oxide film layer and an SOI layer on a silicon substrate, a detecting portion which is provided with a PN junction diode formed on the SOI substrate and converts a temperature ...
10/06/2009
7545017Wafer level package for surface acoustic wave device and fabrication method thereof
A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top surface of a device wafer, a cap wafer which is bonded with a top surf...
06/09/2009
7462922Semiconductor device provided with temperature detection function
A semiconductor device provided with a temperature detection function having a high temperature detection accuracy for improving the ESD resistance of a temperature detection diode. The semiconductor device has a semiconductor element. A temperature detection diode ...
12/09/2008
7352045Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
A SiC die with Os and/or W/WC/TiC contacts and metal conductors is encapsulated either alone or on a ceramic substrate using a borosilicate (BSG) glass that is formed at a temperature well below upper device operating temperature limits but serves as a stable protec...
04/01/2008
7342169Phonon-blocking, electron-transmitting low-dimensional structures
A thermoelectric structure and device including at least first and second material systems having different lattice constants and interposed in contact with each other, and a physical interface at which the at least first and second material systems are joined with ...
03/11/2008
7312509Digital temperature sensing device using temperature depending characteristic of contact resistance
A digital temperature sensing device uses temperature depending characteristic of contact resistance of a MOS transistor and a self-refresh driving device adjusts its self-refresh period depending on temperature using the digital temperature sensing device. The self...
12/25/2007
7274867System and method for determining the temperature of a semiconductor wafer
A system and method for determining the temperature of a semiconductor wafer at the time of thermal contact of the semiconductor wafer with a temperature sensing element. According to the invention, a temperature profile of the temperature sensing element is recorde...
09/25/2007
7243850Data reader for multi-mode operation
A data reader and method for data reading, such as a barcode scanner, wherein the scan pattern generating optics and other features are optimized for different modes of operation. In a preferred embodiment, different patterns are projected from different apertures i...
07/17/2007
7239002Integrated circuit device
In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided on regions of the multi-layer wiring layer which covers the vias. An ...
07/03/2007
7224910Direct attach optical receiver module and method of testing
Optical receiver modules are used for receiving high-speed optical data signals. Unfortunately, these optical receiver modules are often tested for the first time after they are packaged in a housing. Thus significant costs are associated with those packaged devices...
05/29/2007
7190250Encapsulation with oxide bond to borosilicate mixture
Environmental sensors and other bodies, together with associated lead wires, are mounted to a oxidizable substrate for high temperature applications by means of a reacted borosilicate mixture (RBM) that secures the body relative to the substrate via of an oxide inte...
03/13/2007
7187053Thermal sensing method and system
The present invention provides an integrated circuit. The integrated circuit has a plurality of chip areas. The integrated circuit also has a plurality of temperature sensors, at least one per chip area. The temperature sensors generate a voltage proportional to the...
03/06/2007
7184122Lithographic apparatus and device manufacturing method
In a lithographic projection apparatus, a liquid supply system maintains liquid in a space between a projection system of the lithographic projection apparatus and a substrate. A sensor positioned on a substrate table, which holds the substrate, is configured to be ...
02/27/2007
7166796Method for producing a device for direct thermoelectric energy conversion
In devices used for the direct conversion of heat into electricity, or vice versa, known in the art as thermoelectric power generators, thermoelectric refrigerators and thermoelectric heat pumps, the efficiency of energy conversion and/or coefficient of performance ...
01/23/2007
7129557Autonomic thermal monitor and controller for thin film devices
A thermal monitor diode is provided that comprises a silicon thin film on an insulator mounted on a silicon substrate. An opening extends through the silicon thin film and through the insulator and partially into the silicon substrate and terminates at an end wall. ...
10/31/2006
7118273System for on-chip temperature measurement in integrated circuits
A thermal sensor providing simultaneous measurement of two diodes. A first diode and a second diode are coupled to a first current source and a second current source, respectively. The ratio of the currents provided by the two sources is accurately known. The voltag...
10/10/2006
7109408Solid state energy converter
A solid-state energy converter with a semiconductor or semiconductor-metal implementation is provided for conversion of thermal energy to electric energy, or electric energy to refrigeration. In n-type heat-to-electricity embodiments, a highly doped n* emitter regio...
09/19/2006
7106167Stable high temperature sensor system with tungsten on AlN
A sensor system has an AlN substrate, a W layer on the substrate, a signal source adapted to apply an electrical actuating signal to the W layer, and a sensor adapted to sense the response of the W layer. The W layer can comprise a thin film, with various types of o...
09/12/2006
7081368Method for detecting gas with the use of photocurrent amplification and the like and gas sensor
An indium electrode film (2) is formed closely adhering to one face of an organic semiconductor film (1) made of copper phthalocyanine while a gold electrode film (3) is formed on the other face. A voltage is applied to the organic semiconductor...
07/25/2006
7051940Data reader for multi-mode operation
A data reader and method for data reading, such as a barcode scanner, wherein the scan pattern generating optics and other features are optimized for different modes of operation. In a preferred embodiment, different patterns are projected from different apertures i...
05/30/2006
7049558Apparatus and method for heating microfluidic volumes and moving fluids
A device and method for the temperature control, concentration, volume measurement and transport of microfluidic volumes are provided. The device includes one or more heating elements having a resistive material that varies with temperature. The heating elements are...
05/23/2006
7030453Bolometric detector with an antenna
The invention relates to a bolometric detector comprising a receiving antenna (2a, 2b, 2c, 2d) for collecting electromagnetic waves and a resistive load for converting the power of electromagnetic waves into he...
04/18/2006
7018095Circuit for sensing on-die temperature at multiple locations
A circuit for sensing on-die temperature at multiple locations using a minimum number of pins is described. Thermal diodes coupled to pins are placed on a die to measure the temperature at various die locations. Voltage is applied to the pins to determine the temper...
03/28/2006
7017662High temperature environment tool system and method
In at least some embodiments, a tool may comprise a tool body and one or more tool components. The tool may further comprise tool electronics located within the tool body, wherein the tool electronics are operable to sense and store tool component characteristics an...
03/28/2006
7004622Systems and methods for determining conditions of articles and methods of making such systems
A system for measuring a condition of a turbine engine component comprises an assemblage of at least a film comprising an electrically conducting material disposed on a film of an electrically non-conducting material, the assemblage being disposed on a surface of th...
02/28/2006
6995691Bonded structure using reacted borosilicate mixture
Environmental sensors and other bodies, together with associated lead wires, are mounted to a oxidizable substrate for high temperature applications by means of a reacted borosilicate mixture (RBM) that secures the body relative to the substrate via of an oxide inte...
02/07/2006
6989574High temperature circuit structures with thin film layer
A high temperature hybrid-circuit structure includes a temperature sensitive device which comprises SiC, AlN and/or AlxGa1-xN(x>0.69) connected via electrodes to an electrically conductive mounting layer that is physically bonded to an AlN die....
01/24/2006
6958443Low power thermoelectric generator
Disclosed is a foil segment for a thermoelectric generator comprising a top plate disposed in spaced relation above a bottom plate. An array of the foil segments is perpendicularly disposed in side-by-side arrangement between and in thermal contact with the bottom a...
10/25/2005
6943838Active pixel sensor pixel having a photodetector whose output is coupled to an output transistor gate
An imaging device formed as a monolithic complementary metal oxide semiconductor integrated circuit in an industry standard complementary metal oxide semiconductor process, the integrated circuit including a focal plane array of pixel cells, each one of the cells in...
09/13/2005
6930371Temperature-sensing diode
A temperature-sensing diode has an anode and a cathode disposed on top and an isolated, metallization layer on bottom of a diode die. For example, the temperature-sensing diode is a Schottky diode without a guard ring and any passivation, making the temperature-sens...
08/16/2005
6911714Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
A SiC die with Os and/or W/WC/TiC contacts and metal conductors is encapsulated either alone or on a ceramic substrate using a borosilicate (BSG) glass that is formed at a temperature well below upper device operating temperature limits but serves as a stable protec...
06/28/2005
6894215Thermoelectric module
A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements (13, 14) which are alternately placed, and outer electrodes (15...
05/17/2005
6867470Multi-slope analog temperature sensor
The present invention provides a temperature sensor that has high sensitivity and operates in a wide range of temperatures and VDD levels. The temperature sensor may be tailored to the application according to the conditions of temperature and VDD. The temperature s...
03/15/2005
6861717Device for defecting a magnetic field, magnetic field measure and current meter
A device for detecting a magnetic field, e.g., a magnetic field meter and an ammeter are described, the device having a first lateral magnetotransistor and a second lateral magnetotransistor, and in which the first and the second lateral magnetotransistors are compl...
03/01/2005
6825543Semiconductor device, method for manufacturing the same, and liquid jet apparatus
A semiconductor device in which electro-thermal conversion elements and switching devices for flowing currents through the elements are integrated on a first conductive type semiconductor substrate. The switching devices are insulated gate type field effect transist...
11/30/2004
6800933Integrated circuit cooling device
Various embodiments of a semiconductor-on-insulator substrate incorporating a Peltier effect heat transfer device and methods of fabricating the same are provided. In one aspect, a circuit device is provided that includes an insulating substrate, a semiconductor str...
10/05/2004
6791150Optical module and optical transceiver apparatus
A thermoelectric semiconductor has a P-type semiconductor and an N-type semiconductor disposed in parallel. A heat absorbing side of the thermoelectric semiconductor and a substrate that has an optical element mounted on its upper surface are disposed on the same pl...
09/14/2004
6787870Semiconductor component with integrated circuit, cooling body, and temperature sensor
A semiconductor component with an integrated circuit has a cooling body as a heat sink and a temperature sensor thermally connected thereto, whose resistance is dependent on temperature. The temperature sensor contains a thin film measuring resistor, which is applie...
09/07/2004
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