Did You Know...
...that the x-ray was discovered purely by accident? When German physicist Wilhelm Konrad von Roentgen was experimenting with cathode rays in 1895, he put an activated Crookes tube in a book and went out to lunch. When he returned, he discovered that a key that had also been placed in the book showed up as an image on the developed film!
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| Number | Title | Issue Date |
| 8174090 | Packaging structure The invention discloses a packaging structure and packaging method. The packaging structure includes a solder bump, a pad located on a front side of a chip, and an intermediate metal layer which connects the solder bump and the pad, wherein a through hole passing fr... | 05/08/2012 |
| 8169044 | Image sensor and method for manufacturing the same Embodiments provide an image sensor. The image sensor includes readout circuitry, an interlayer dielectric, an interconnection, and an image sensing device. The interconnection includes a lower barrier metal and a nitride barrier formed under the lower barrier metal... | 05/01/2012 |
| 8120132 | Holey electrode grids for photovoltaic cells with subwavelength and superwavelength feature sizes A photovoltaic cell and a method of forming an electrode grid on a photovoltaic semiconductor substrate of a photovoltaic cell are disclosed. In one embodiment, the photovoltaic cell comprises a photovoltaic semiconductor substrate; a back electrode electrically con... | 02/21/2012 |
| 8106474 | Semiconductor device A wiring electrically connected to a terminal to which a high power supply potential is applied and a wiring electrically connected to a terminal to which a low power supply potential is applied are formed adjacent to each other and are formed so as to surround the ... | 01/31/2012 |
| 8072041 | Passivated optical detectors with full protection layer In one example, an optoelectronic transducer includes a first contact, a second contact, a passivation layer, and a protection layer. The passivation layer is formed on top of the first contact and the second contact and is configured to substantially minimize dark ... | 12/06/2011 |
| 8044481 | Photodiode chip having a high limit frequency The invention relates to a photodiode chip which has a great limit frequency and a junction from the active photodiode area of a photodiode mesa to the output pad of the high-frequency output of the photodiode chip. The aim of the invention is to further increase th... | 10/25/2011 |
| 8044482 | Semiconductor device A semiconductor device includes an insulating film formed on a semiconductor substrate, a contact wiring formed in the insulating film, a protective film formed on the contact wiring and the insulating film, an opening portion formed in the protective film, the cont... | 10/25/2011 |
| 8030728 | Optical semiconductor device An optical semiconductor device includes a semiconductor substrate; a light receiving element formed on the semiconductor substrate; a light absorbing element formed on the semiconductor substrate and located adjacent to the light receiving element; and a semiconduc... | 10/04/2011 |
| 7999344 | Optoelectronic device with germanium photodetector An optoelectronic device comprises a photodetector feature, an interfacial layer disposed above at least a portion of the photodetector feature, and a vertical contact disposed on at least a portion of the interfacial layer. The photodetector feature comprises germa... | 08/16/2011 |
| 7989909 | Image sensor module and method of manufacturing the same An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electr... | 08/02/2011 |
| 7956435 | Semiconductor device In recent years, as electronic equipment becomes thinner, an area for mounting a semiconductor device used in the electronic equipment is required to be smaller, and a thickness of an encapsulating resin for encapsulating a semiconductor substrate having a circuit f... | 06/07/2011 |
| 7911019 | Reflowable camera module with improved reliability of solder connections A reflowable camera module has a set of solder joints formed on a bottom surface of the camera module that provide electrical signal and power connections between the camera module and a printed circuit substrate. The solder joints are susceptible to failure caused ... | 03/22/2011 |
| 7888762 | Infrared detector and fabricating method of infrared detector There is provided an infrared detector including: a silicon substrate provided with a concave portion; an infrared receiver having a polysilicon layer; and a beam that supports the infrared receiver above the concave portion, and extends along a side of the infrared... | 02/15/2011 |
| 7863705 | Semiconductor device having a bonding pad structure including an annular contact A bonding pad structure in a semiconductor device includes a contact pad connected to an interconnect, a bonding pad overlying the contact pad with an intervention of an insulating film and exposed from an opening of a passivation film, and an annular contact dispos... | 01/04/2011 |
| 7821092 | Semiconductor device An open portion is provided to an interlayer insulation film so as to correspond to a photoreceptor part of an optical detection device. A partition wall for surrounding the open portion (120) is formed by a metal material inside a wiring structure layer (... | 10/26/2010 |
| 7816754 | Ball grid array package construction with raised solder ball pads The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised BGA solder ball pad substantially co-planar with the outer conductiv... | 10/19/2010 |
| 7755158 | Image sensor and method for manufacturing thereof An image sensor includes a semiconductor substrate having a pixel region and a peripheral circuit region. An interlayer dielectric layer has metal wirings and a pad formed over the semiconductor substrate. A lower electrode is selectively formed over the metal wirin... | 07/13/2010 |
| 7696594 | Attachment of a QFN to a PCB Methods and arrangements to attach a QFN to a PCB, systems which include a QFN attached to a PCB, and apparatuses for controlling the deposit of solder upon a PCB are disclosed. Embodiments include transformations, code, state machines or other logic to calculate a ... | 04/13/2010 |
| 7683452 | Threshold voltage modulation image sensor An image sensor has a plurality of pixels each with a photoelectric conversion element and a detection transistor the threshold voltage of which fluctuates in accordance with electrical charge generated in the photoelectric conversion element. The image sensor inclu... | 03/23/2010 |
| 7671436 | Electronic packages Assemblies involving integrated circuit dies (e.g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying app... | 03/02/2010 |
| 7663201 | Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump The present invention provides a semiconductor device exhibiting an improved reliability. A semiconductor device comprises a semiconductor chip having an electrode on a surface thereof and a mounting substrate, and the electrode (aluminum electrode) of the semicondu... | 02/16/2010 |
| 7659595 | Embedded bonding pad for backside illuminated image sensor The present disclosure provide a microelectronic device. The microelectronic device includes a sensing element formed in the semiconductor substrate; a trench isolation feature formed in the semiconductor substrate; a bonding pad formed at least partially in the tre... | 02/09/2010 |
| 7626240 | Electro-optical apparatus and a circuit bonding detection device and detection method thereof This invention provides a circuit bonding detection device, a detection method thereof and an electro-optical apparatus incorporating the circuit bonding detection device. The circuit bonding detection device includes a substrate, a circuit module, a set of sensors,... | 12/01/2009 |
| 7592681 | Solid-state imaging apparatus A solid-state imaging apparatus including: a solid-state imaging device chip having an electrode pad provided on its front face; and a flexible board having a connecting electrode formed on an end face and being adhered at an end portion thereof to a side face of th... | 09/22/2009 |
| 7573115 | Structure and method for enhancing resistance to fracture of bonding pads The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in b... | 08/11/2009 |
| 7566944 | Package structure for optoelectronic device and fabrication method thereof A package structure for an optoelectronic device. The package structure comprises a device chip reversely disposed on a first substrate, which comprises a second substrate and a first dielectric layer between the first and second substrates. The first dielectric lay... | 07/28/2009 |
| 7508046 | Photodetector A photodetector having a mechanism of suppressing light crosstalk includes a plurality of photodiodes disposed on a common semiconductor substrate, each photodiode including an absorption layer epitaxially grown on the common semiconductor substrate and being provid... | 03/24/2009 |
| 7495307 | Columnar electric device A sensor whose size can be decreased without marring the performance and which can be installed in a narrow place, an electric device, and a method for easily manufacturing the electric device. By vacuum deposition of semiconductor on a columnar body or by applying ... | 02/24/2009 |
| 7443040 | Aluminum cap with electroless nickel/immersion gold A resulting solder bump structure comprising the following steps. A structure having a metal bond pad formed thereover is provided. A patterned cover layer is formed over the structure. The patterned cover layer including an opening exposing a portion of the metal b... | 10/28/2008 |
| 7442953 | Wavelength selective photonics device A device comprising a number of different wavelength-selective active-layers arranged in a vertical stack, having band-alignment and work-function engineered lateral contacts to said active-layers, consisting of a contact-insulator and a conductor-insulator. Photons... | 10/28/2008 |
| 7432540 | Dual conversion gain gate and capacitor combination A pixel cell array architecture having a dual conversion gain. A dual conversion gain element is coupled between a floating diffusion region and a respective storage capacitor. The dual conversion gain element having a control gate switches in the capacitance of the... | 10/07/2008 |
| 7417295 | Insulated gate semiconductor device and manufacturing method thereof Two metal electrode layers are provided. A first electrode layer is patterned with a minute separation distance according to an element region as in the case of the conventional case. Meanwhile, it suffices that a second electrode layer be in contact with the first ... | 08/26/2008 |
| 7397125 | Semiconductor device with bonding pad support structure A semiconductor device having bonding pads on a semiconductor substrate includes: an upper copper layer that is formed on the lower surface of the bonding pads with a barrier metal interposed and that has a copper area ratio that is greater than layers in which circ... | 07/08/2008 |
| 7365431 | Semiconductor device having multilayer structure and method for manufacturing thereof A semiconductor device having a first wiring layer including first wirings on a substrate, a contact layer on the first wiring layer and including contacts connected to the first wirings, and a second wiring layer on the contact layer and including second wirings co... | 04/29/2008 |
| 7364998 | Method for forming high reliability bump structure Methods for forming a bump on a semiconductor substrate, the substrate having a contact pad thereon, is provided. In one embodiment, the method comprises depositing a passivation layer over the substrate and the contact pad. The passivation layer is patterned and et... | 04/29/2008 |
| 7339273 | Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A semiconductor substrate is etched to form a via hole from a back surfac... | 03/04/2008 |
| 7339256 | Semiconductor device A semiconductor device includes a first insulating layer provided above a semiconductor substrate. The first insulating layer includes a layer consisting essentially of a material having a relative dielectric constant smaller than 3. The first insulating layer inclu... | 03/04/2008 |
| 7326594 | Connecting a plurality of bond pads and/or inner leads with a single bond wire An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least tw... | 02/05/2008 |
| 7327006 | Semiconductor package A semiconductor package includes a combination die embedded in a base. The combination die includes a plurality of functional blocks, where the functional blocks are insulated from one another on the combination die. Each functional block has plural die connectors. ... | 02/05/2008 |
| 7312097 | Method of fabricating an optical concentrator for a photovoltaic solar cell A method of fabricating a photovoltaic solar cell is provided. A plurality of generally spherical semiconductor elements are provided. Each of the semiconductor elements has a core and an outer surface surface forming a p-n junction. An anti-reflection coating is de... | 12/25/2007 |
