U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Icon_funbox Bizarre Patents

Patent No. 6055910

/patents/6055910.html

A gun that fires a missile, powered by gas "discharged by the operator of the toy."

Newsletter  PatentStorm News

Make the Most of Our Site

See this month's Top Inventors and Most Cited Patents.

Stay on top of the latest innovations by subscribing to an RSS feed.

Registered users: Manage your profile.

 

Class 257/457 - With particular contact geometry (e.g., ring or grid)


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the device has a specific geometrical
No. of patents: 128
Last issue date: 03/30/2010


1        
NumberTitleIssue Date
7687873Photodiode and photo integrated circuit having the same
A photodiode comprises a support substrate, an insulating layer formed over the support substrate, a silicon semiconductor layer formed over the insulating layer and having a device forming area and device isolation areas which surround the device forming area, a de...
03/30/2010
7423254High responsivity high bandwidth metal-semiconductor-metal optoelectronic device
An optical device for sensing an incident optical wave within a wavelength range includes a first array and a second array of electrodes superposed on a substrate, and a sensor connected to the contacts. The arrays are interdigitated. Each array includes its own par...
09/09/2008
7420215Transparent conductive film, semiconductor device and active matrix display unit
A transparent conductive film substantially made from In2O3, SnO2 and ZnO, having a molar ratio In/(In+Sn+Zn) of 0.65 to 0.8 and also a molar ratio Sn/Zn of 1 or less: The transparent conductive film has a favorable electric contact ...
09/02/2008
7394139Optical modulator module package using flip-chip mounting technology
Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environmen...
07/01/2008
7342268CMOS imager with Cu wiring and method of eliminating high reflectivity interfaces therefrom
An image sensor and method of fabrication wherein the sensor includes Copper (Cu) metallization levels allowing for incorporation of a thinner interlevel dielectric stack to result in a pixel array exhibiting increased light sensitivity. The image sensor includes st...
03/11/2008
7309854Photo-detectors and optical devices incorporating same
An opto-electronic device comprising a plurality of photo-detectors, each said photo-detector comprises a plurality of optical detection segments which are connected in parallel, the optical detection segments of said plurality of optical-detectors are interposed so...
12/18/2007
7276699Absorptance enhancing coating for MWIR detectors
Provided is an infrared radiation detector comprising an active layer having a front side and a back side. An anti-reflective coating is disposed on the front side and is configured to minimize reflection of incident light within a wavelength band of interest upon t...
10/02/2007
7259377Diode design to reduce the effects of radiation damage
A photodetector for X-ray applications includes a photodiode at each pixel location that is gated to reduce leakage of charge from the photodiode. A gate layer may be disposed around the entire peripheral edge of the detector, and maintained at a common potential wi...
08/21/2007
7233046Semiconductor device and fabrication method thereof
A semiconductor device and fabrication method thereof restrains an amplified current between input voltage Vin and ground voltage Vss, and first and second n-wells are biased into internal voltage sources, whereby the current-voltage characteristic of the input pad ...
06/19/2007
7230272Active matrix substrate and display device
An active matrix substrate of the present invention includes a TFT and a substrate. The TFT formed on a substrate includes, when viewed in a normal direction of the substrate: a first region in which a gate electrode overlaps a source electrode via a semiconductor l...
06/12/2007
7199437Fabrication process for embedding optical band gap structures in a low temperature co-fired ceramic substrate
A method for embedding optical band gap (OBG) devices in a ceramic substrate (100). The method includes the step (320) of pre-forming an OBG structure (105). The OBG structure can be a micro optical electromechanical systems (MOEMS) device. Furt...
04/03/2007
7187050Optical sensor and method of manufacturing the same
A cubic element of photonic crystal is integrally formed on the surface of a photo-detection element, and a portion of the photonic crystal cubic element is irradiated with ultraviolet rays thereby to change the refractive index of the portion of the cubic element t...
03/06/2007
7180147Microelectronic structure with a high germanium concentration silicon germanium alloy including a graded buffer layer
A method of forming a high germanium concentration, low defect density silicon germanium film and its associated structures is described, comprising forming a dielectric layer on a substrate, patterning the dielectric layer to form a silicon region and at least one ...
02/20/2007
7176542Photo induced-EMF sensor shield
A photo-EMF detector including a shield to prevent a portion of the detector from illumination. The shield prevents the generation of unwanted noise-currents, thus increasing the performance of the photo-EMF detector. ...
02/13/2007
7151302Method and apparatus for maintaining topographical uniformity of a semiconductor memory array
A semiconductor device includes a memory array having a plurality of non-volatile memory cells. Each non-volatile memory cell of the plurality of non-volatile memory cells has a gate stack. The gate stack includes a control gate and a discrete charge storage layer s...
12/19/2006
7145211Seal ring for mixed circuitry semiconductor devices
In mixed-component, mixed-signal, semiconductor devices, selective seal ring isolation from the substrate and its electrical potential is provided in order to segregate noise sensitive circuitry from electrical noise generated by electrically noisy circuitry. Approp...
12/05/2006
7135750Photodiode array having reduced dead space
A photodiode array includes a first photodiode and at least a second photodiode. The first photodiode includes a first active area, a first anti-reflective coating area, and a first residual polysilicon ring. The first anti-reflective coating area and the first resi...
11/14/2006
7094664Method for fabricating semiconductor photodetector
Multilayer films (2 to 7 ) containing a light absorption layer (4) are formed on a GaAs substrate. After laminating the GaAs substrate (1) and a glass substrate (8) so that an uppermost surface film (7) of the multilayer fil...
08/22/2006
7084471Photosensitive device
A photosensitive device for enabling high speed detection of electromagnetic radiation. The device includes recessed electrodes for providing a generally homogeneous electric field in an active region. Carriers generated in the active region are detected using the r...
08/01/2006
7084406Detector arrangement and detection method
A detector arrangement for detecting position information contained in a beam (5) of charged particles is provided, comprising a plurality of position-sensitive detectors (17), each for supplying an image containing the position information of a positi...
08/01/2006
7045872Semiconductor light receiving device and manufacturing method for the same
An object of the present invention is to provide a highly sensitive semiconductor light receiving device wherein the efficiency of light convergence into the light receiving region has been increased. The semiconductor light receiving device includes a light receivi...
05/16/2006
7038288Front side illuminated photodiode with backside bump
This invention relates to a novel optoelectronic chip with one or more optoelectronic devices, such as photodiodes, fabricated on a front side of a semiconductor wafer and contacts on a backside of the semiconductor wafer. The backside contacts can be contact bumps,...
05/02/2006
7023017Thin film transistor substrate of horizontal electric field type liquid crystal display device and fabricating method thereof
A thin film transistor substrate of horizontal electric field type includes: a gate line and a first common line formed on a substrate to be in parallel to each other; a data line crossing the gate line and the first common line with a gate insulating film therebetw...
04/04/2006
7015560Light-receiving device, method for manufacturing the same, and optoelectronic integrated circuit comprising the same
A light-receiving device, a method for manufacturing the same, and an optoelectronic integrated circuit including the same are provided. The light-receiving device includes a substrate; an intrinsic region formed on the substrate; a first region formed to a shallow ...
03/21/2006
7012314Semiconductor devices with reduced active region defects and unique contacting schemes
A method of making a semiconductor device having a predetermined epitaxial region, such as an active region, with reduced defect density includes the steps of: (a) forming a dielectric cladding region on a major surface of a single crystal body of a first material; ...
03/14/2006
6995407Photonic digital-to-analog converter employing a plurality of heterojunction thyristor devices
A photonic digital-to-analog converter employing a plurality of heterojunction thyristor devices that are configured to convert a digital word encoded by a parallel digital optical signal (e.g., a plurality of synchronous optical bits) to an output analog electrical...
02/07/2006
6980748SiGe or germanium flip chip optical receiver
A synchronized optical clocking signal is provided to a plurality of optical receivers by providing a layer of a high absorption coefficient material, such as SiGe or Ge, on a front surface of a low absorption coefficient substrate, such as silicon. Diodes are forme...
12/27/2005
6953949Electro-optical device and electronic apparatus
An electro-optical device according to the present invention includes, above a substrate, pixel electrodes, thin film transistors connected to the pixel electrodes, an upper light shielding film to cover the upper side of the channel regions of the thin film transis...
10/11/2005
6934658Computer chip heat responsive method and apparatus
Disclosed is an apparatus incorporating hardware based logic and a predetermined default list of software affecting responses to be taken in connection with temperatures sensed by thermal sensors checking the temperature of portions of computer logic. At the time ap...
08/23/2005
6924541Semiconductor photodetection device
A semiconductor photodetection device includes a semiconductor structure including an optical absorption layer having a photo-incidence surface on a first side thereof, a dielectric reflecting layer formed on a second side of the semiconductor structure opposite to ...
08/02/2005
6903432Photosensitive device
A photosensitive device for enabling high speed detection of electromagnetic radiation. The device includes recessed electrodes for providing a generally homogeneous electric field in an active region. Carriers generated in the active region are detected using the r...
06/07/2005
6897482Transistor and display comprising it
A transistor has a source electrode and a drain electrode formed with a predetermined interval secured in between on a semiconductor layer formed to perspectively overlap a gate electrode. The source and drain electrodes are each longer in their lengthwise direction...
05/24/2005
6879014Semitransparent optical detector including a polycrystalline layer and method of making
Materials suitable for fabricating optical monitors include amorphous, polycrystalline and microcrystalline materials. Semitransparent photodetector materials may be based on silicon or silicon and germanium alloys. Conductors for connecting to and contacting the ph...
04/12/2005
6846984Solar cell and method for making a solar cell
A solar cell with buried contacts in recesses (7) on a first surface (2). On a lateral face (4), a metal layer (12) is produced. The metal layer (12) extends into a lateral zone (9) of a second surface (3) opposite th...
01/25/2005
6828545Hybrid microelectronic array structure having electrically isolated supported islands, and its fabrication
A hybrid microelectronic array structure is fabricated from a readout integrated circuit array of microelectronic integrated circuits and a supported array of supported islands. The supported islands include one or more supported elements, with a respective supporte...
12/07/2004
6803513Series connected photovoltaic module and method for its manufacture
A photovoltaic module includes at least a first and a second photovoltaic cell each having a substrate electrode, a top electrode and a photovoltaic semiconductor body disposed therebetween in electrical communication with the substrate electrode and the top electro...
10/12/2004
6794725Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources
A hybrid structure or device is provided wherein carried on a single substrate is at least one micro-spring interconnect having an elastic material that is initially fixed to a surface of the substrate, an anchor portion which is fixed to the substrate surface and a...
09/21/2004
6780750Photodiode for ultra high speed optical communication and fabrication method therefor
Disclosed is a photodiode having a p-type electrode of a mushroom shape. The p-type electrode is formed in a mushroom shape, so that the contact area faced by the spreading region of a dopant for the photodiode and the electrode can be minimized and the capacitance ...
08/24/2004
6781211Photodiode having an active region shaped in a convex lens
Disclosed is a photodiode with improved light-receiving efficiency and coupling effect with an optical fiber, whose capacitance may be decreased. The inventive photodiode includes a substrate; a buffer layer and a light-absorbing layer laminated in sequence on the s...
08/24/2004
6777263Film deposition to enhance sealing yield of microcap wafer-level package with vias
A method for forming a wafer package includes forming a die structure, wherein the die structure includes a first wafer, a device mounted on the first wafer, a second wafer mounted atop the first wafer with a first seal ring around the device and a second seal ring ...
08/17/2004
1        
 
Sign InRegister
Username  
Password   
forgot password?