Quotables
"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8188561 | Integral topside vacuum package An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be... | 05/29/2012 |
| 8138565 | Lateral double diffused metal oxide semiconductor device and method of making the same An LDMOS device and method for making the same are disclosed. The LDMOS device comprises a first well, a second well, a third well, a first ion implantation region, and a second ion implantation region. The first well is in a semiconductor substrate. The second well... | 03/20/2012 |
| 8125042 | Semiconductor package and method of manufacturing the same Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent... | 02/28/2012 |
| 8115267 | Semiconductor device and fabrication method of the same A semiconductor device which comprises an SOI substrate having an insulating layer between a semiconductor substrate layer and a semiconductor layer in a surface of which a semiconductor element is formed, and at least one external terminal provided, via an insulati... | 02/14/2012 |
| 8093674 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the perip... | 01/10/2012 |
| 8076744 | Photosensitizing chip package and manufacturing method thereof A photosensitizing chip package construction and manufacturing method thereof is comprised of photosensitizing chips constructed on one side of a wafer using a bonding layer; a color attachment array being disposed over those photosensitizing chips; a glass substrat... | 12/13/2011 |
| 8076745 | Imaging photodetection device An imaging photodetection device includes a plurality of photodetectors (6) arrayed on a substrate (5) one-dimensionally or two-dimensionally, a low refractive index transparent layer (12) formed above the plural photodetectors, and a plurality ... | 12/13/2011 |
| 8063462 | Semiconductor device and method of manufacturing the same A semiconductor device includes a semiconductor substrate having a first surface in which a light-receiving portion and electrodes are provided. The semiconductor substrate has a penetrating wiring layer connecting the first surface and the second surface. A light-t... | 11/22/2011 |
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers Methods for forming electrically conductive through-wafer interconnects in microelectronic devices and microelectronic devices are disclosed herein. In one embodiment, a microelectronic device can include a monolithic microelectronic substrate with an integrated cir... | 11/08/2011 |
| 8039915 | Solid-state image sensor A solid-state image sensor (1) includes: an imaging device wafer (2A); a plurality of imaging devices (3) which are formed on the imaging device wafer (2A); a spacer (5) which surrounds the imaging devices (3) on the imaging... | 10/18/2011 |
| 8035179 | Packaged microelectronic imagers and methods of packaging microelectronic imagers Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microe... | 10/11/2011 |
| 7956431 | Method of manufacturing an image sensing micromodule A method of manufacturing a micromodule including the steps of: producing an integrated circuit on an active face of a chip made of a semi-conductive material, making a via passing through the chip, electrically linked to the integrated circuit, and inserting the ch... | 06/07/2011 |
| 7880254 | Semiconductor light receiving device and method for manufacturing same A semiconductor light receiving device includes a light receiving section made of a semiconductor provided on a substrate, an electrode provided on the substrate and configured to apply an electric field to the light receiving section, a resin layer provided above t... | 02/01/2011 |
| 7875944 | Integral topside vacuum package An integrated vacuum package having an added volume on a perimeter within the perimeter of a bonding seal between two wafers. The added volume of space may be an etching of material from the inside surface of the top wafer. This wafer may have vent holes that may be... | 01/25/2011 |
| 7859073 | Back-illuminated type solid-state image pickup device and camera module using the same The present invention provides a solid-state image pickup device including an image pickup pixel section which is provided on a semiconductor substrate and in which a plurality of pixels each having a photoelectric conversion element and a field-effect transistor ar... | 12/28/2010 |
| 7855426 | Optical sensor assemblage and corresponding manufacturing method An optical sensor assemblage, in particular a thermopile sensor assemblage, comprising a sensor chip assemblage having an optically transparent irradiation region, a mounting region surrounding the latter, and a wire-bond region; an optically isolating mounting fram... | 12/21/2010 |
| 7781855 | Optical device An optical device includes a metal film that has a first plane and a second plane electrically connected to the first plane. For example, the second plane is integrally formed with the first plane. The second plane is arranged at an obtuse angle θ (90° | 08/24/2010 |
| 7768086 | Backside-illuminated photodetector The present invention is directed to provide a back illuminated photodetector having a sufficiently small package as well as being capable of suppressing the scattering of to-be-detected light. A back illuminated photodiode 1 comprises an N-type semiconductor... | 08/03/2010 |
| 7763949 | MEMS device with controlled gas space chemistry A process for protecting a MEMS device used in a UV illuminated application from damage due to a photochemical activation between the UV flux and package gas constituents, formed from the out-gassing of various lubricants and passivants put in the device package to ... | 07/27/2010 |
| 7759754 | Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules An economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules is provided. A manufactured item in accordance with this technology includes a substrate with an optoelectronic component contacted in a planar manner. ... | 07/20/2010 |
| 7728399 | Molded optical package with fiber coupling feature Apparatuses and methods directed to an integrated circuit package having an optical component are disclosed. The package may include an integrated circuit die having at least one light sensitive region disposed on a first surface thereof. By way of example, the die ... | 06/01/2010 |
| 7696590 | Diode housing A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting diodes. The housing includes a conductor strip that is punched into two ele... | 04/13/2010 |
| 7675132 | Surface mounting optoelectronic component and method for producing same A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, ... | 03/09/2010 |
| 7663200 | Integrated circuit device packaging structure and packaging method A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. A lead-mounted substrate is placed on the side of the light receiving surface of the integrated circuit device having a photo detecting part. The lead... | 02/16/2010 |
| 7646075 | Microelectronic imagers having front side contacts Microelectronic imager assemblies with front side contacts and methods for fabricating such microelectronic imager assemblies are disclosed herein. In one embodiment, a microelectronic imager assembly comprises a workpiece including a substrate having a front side a... | 01/12/2010 |
| 7635906 | Ultraviolet sensor The ultraviolet sensor has a ZnO layer composed of an oxide semiconductor including ZnO; a (Ni,Zn)O layer which is provided in contact with the ZnO layer and which is composed of an oxide semiconductor including NiO and ZnO solid-solved therein; a first terminal ele... | 12/22/2009 |
| 7633133 | Semiconductor device and manufacturing method of the same This invention provides a semiconductor device that solves a problem that a pattern of a wiring formed on a back surface of a semiconductor substrate is reflected on an output image. A light receiving element (e.g. a CCD, an infrared ray sensor, a CMOS sensor, or an... | 12/15/2009 |
| 7622786 | EMI shielding for imager devices A module that provides EMI shielding for imager devices is disclosed which includes a die comprising an imager device and a plurality of contact pads, a stack positioned above the imager device, the stack comprising at least one lens, a conductive layer positioned a... | 11/24/2009 |
| 7576403 | Method of manufacturing infrared rays receiver and structure thereof A method of manufacturing an infrared rays receiver comprises the steps of: chip attach; wire bonding; encapsulation; metal housing covering; encapsulation; pin cutting; and testing. A lead frame has several pins, wherein one pin has a coupling part. An infrared ray... | 08/18/2009 |
| 7560790 | Backside-illuminated photodetector The present invention provides a back illuminated photodetector having a sufficiently small package as well as being capable of suppressing the scattering of to-be-detected light and method for manufacturing the same. A back illuminated photodiode 1 comprises... | 07/14/2009 |
| 7535071 | System and method of integrating optics into an IC package An apparatus and method of integrating optics into an IC package is for detecting light from at least one light source is disclosed. The apparatus has a housing, which has a predetermined spectral transmittance. A sensor is positioned within the housing. An opaque m... | 05/19/2009 |
| 7525167 | Semiconductor device with simplified constitution An image-capturing semiconductor device is provided with a simplified constitution and by means of fewer steps than conventional techniques. In a semiconductor device which is packaged at substantially identical outer dimensions to the outer dimensions of a first se... | 04/28/2009 |
| 7476955 | Die package having an adhesive flow restriction area A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurali... | 01/13/2009 |
| 7443024 | Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an... | 10/28/2008 |
| 7439094 | Method of manufacturing a semiconductor package Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter... | 10/21/2008 |
| 7436053 | Optical device and method for fabricating the same An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an in... | 10/14/2008 |
| 7427784 | COB-typed LED package with phosphor A light emitting diode (LED) package unit, including a substrate having a concave, a LED chip, at least two electrodes, at least two wires, a gel and a first wavelength-converting material. The LED chip, disposed in the concave, including a top-face, a bottom-face f... | 09/23/2008 |
| 7427799 | Complementary metal oxide semiconductor image sensor and method for fabricating the same A CMOS image sensor and a method for fabricating the same is disclosed, to enhance the image-sensing efficiency by forming a concave lens area for improving the light-condensing efficiency in a planarization layer formed before a micro-lens array, in which the CMOS ... | 09/23/2008 |
| 7425750 | Snap lid camera module An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the moldin... | 09/16/2008 |
| 7425989 | Image-pickup unit including a flexible circuit board on a surface of which an image-pickup element is disposed There is disclosed an image-pickup unit which is capable of locating precisely an image-pickup element and capable of repressing a separation of a cover glass or the image-pickup element and the flexible circuit board. The image-pickup unit comprises an image-pickup... | 09/16/2008 |
