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...When G.G. Hubbard learned of his future son-in-law's invention, he called it "only a toy." His daughter was engaged to a young man named Alexander Graham Bell.
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| Number | Title | Issue Date |
| 8148795 | Functional device A functional device includes plural substrates, an encapsulant arranged between the plurality of substrates, and a functional material arranged between the plural of substrates and encapsulated with the encapsulant. The functional device further includes an insulati... | 04/03/2012 |
| 8097929 | Electronics device package and fabrication method thereof Embodiments provide an electronic device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and... | 01/17/2012 |
| 8049290 | Integrated circuit package Package (1) having a sensor assembly (2) with at least one sensitive surface (21) and an attachment surface (22), a carrier element (3) with a sensor attachment area (31), and a sensor attach material (4) for attachin... | 11/01/2011 |
| 8030722 | Reversible top/bottom MEMS package A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. A cover substrate having a plurality of metal traces and a plurality of cover vias is provided. A first die ... | 10/04/2011 |
| 7994599 | Device for the detection of electromagnetic waves and method for producing such a device Device for the detection of electromagnetic waves with a first plate that contains a membrane and a detector structure fixed at least partially to the membrane, a second plate attached to the first plate, ... | 08/09/2011 |
| 7977759 | Fingerprint sensor chip package method and the package structure thereof A fingerprint sensor chip package method and the package structure thereof are disclosed. The invention includes: providing a substrate; arranging a sensor chip on the substrate, with an active surface of the sensor chip facing upward; forming a patterned conductive... | 07/12/2011 |
| 7968962 | Semiconductor fabrication method and system A semiconductor device is disclosed. In one embodiment, a device includes a substrate having one or more vias and a carrier coupled to the substrate to form a sealed cavity between the carrier and the substrate. In some embodiments, the sealed cavity may be pressuri... | 06/28/2011 |
| 7968961 | Solid-state image pickup device and method for manufacturing the same A solid-state image pickup device which includes a solid-state image pickup chip, a transparent plate disposed to face a light-receiving surface of the solid-state image pickup chip, a frame-like spacer disposed on a peripheral portion of the light-receiving surface... | 06/28/2011 |
| 7939901 | Optical device for reducing disturbance light and manufacturing method thereof An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface o... | 05/10/2011 |
| 7936032 | Film type package for fingerprint sensor A thin-film fingerprint sensor package primarily comprises a fingerprint sensor chip, a plurality of bumps, a wiring film with a plurality of leads and at least an encapsulant to encapsulate the bumps. A sensing area is formed on an active surface of the fingerprint... | 05/03/2011 |
| 7936033 | Micro-optical device packaging system According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent a... | 05/03/2011 |
| 7923800 | Semiconductor device and electronic device The present invention has a photodiode and a circuit used to amplify the output of the photodiode. Two terminals are formed over the photodiode and circuit with an insulating layer interposed therebetween, and a dummy electrode with a larger area than that of either... | 04/12/2011 |
| 7911018 | Optical device and method of manufacturing the same An optical device includes a semiconductor substrate (11) on which a light receiving part (12) (or a light emitting part) and electrodes (13) are formed, and a translucent plate (2) bonded on the light receiving part (12) with a tr... | 03/22/2011 |
| 7893514 | Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package An image sensor package, a method of manufacturing the same, and an image sensor module including the image sensor package are provided. In the image sensor package, an image sensor chip is installed onto a depression of a transmissive substrate. An adhesive bonds t... | 02/22/2011 |
| 7888758 | Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure A carrier wafer for wafer level fabrication of imager structures comprising a substrate with trenches corresponding to locations of imager arrays on an imager wafer. A method of fabricating such a carrier wafer and a method of fabricating an imager module employing ... | 02/15/2011 |
| 7855425 | Semiconductor device and method of manufacturing the same The invention is directed to providing a smaller semiconductor device having a light emitting element with a low manufacturing cost and a method of manufacturing the same. An adhesive layer 9 and conductive pastes 10a, 10b are sele... | 12/21/2010 |
| 7829967 | Resin for optical-semiconductor-element encapsulation containing polyimide and optical semiconductor device obtained with the same The present invention relates to a resin for optical-semiconductor-element encapsulation containing a polyimide which is produced by imidizing a polyimide precursor obtained by subjecting 5-norbornene-2,3-dicarboxylic anhydride or maleic anhydride, an aliphatic tetr... | 11/09/2010 |
| 7816750 | Thin semiconductor die packages and associated systems and methods Thin semiconductor die packages and associated systems and methods are disclosed. A package in accordance with a particular embodiment includes a semiconductor die having die bond sites, a conductive structure positioned proximate to the semiconductor die and having... | 10/19/2010 |
| 7812422 | Film type package for fingerprint sensor A thin-film fingerprint sensor package primarily comprises a fingerprint sensor chip, a plurality of bumps, a wiring film, an encapsulant and a metal base to mechanically hold the fingerprint sensor chip. A sensing area is formed on the active surface of the fingerp... | 10/12/2010 |
| 7804147 | Light emitting diode package element with internal meniscus for bubble free lens placement A method for fabricating a light emitting diode (LED) package comprising providing an LED chip and covering at least part of the LED chip with a liquid encapsulant having a radius of curvature. An optical element is provided having a bottom surface with at least a p... | 09/28/2010 |
| 7795697 | Method and device for integrating an illumination source and detector into the same IC package that allows angular illumination with a common planar leadframe An optical navigation device includes an integrated package. The integrated package includes a planar leadframe, a light source die mounted on the leadframe, and a sensor die mounted on the leadframe to be coplanar with the light source die. The integrated package m... | 09/14/2010 |
| 7781854 | Image sensor chip package structure and method thereof An image sensor chip package structure includes a transparent substrate, a chip, a sealing ring, a number of conductive posts, and a number of conductive bumps. The transparent substrate has a number of through holes. The through holes pass through the transparent s... | 08/24/2010 |
| 7759753 | Integrated circuit die, integrated circuit package, and packaging method An integrated circuit package includes an integrated circuit die 1 having a plurality of optical elements 5 sensitive to and/or capable of generating light, whereby data communication to circuitry of the integrated circuit die can be effected using a d... | 07/20/2010 |
| 7745897 | Methods for packaging an image sensor and a packaged image sensor An image sensor is packaged by attaching the image sensor to a substrate, forming metallic bumps on either the image sensor or a transparent cover, where the metallic bumps are formed in a pattern around the perimeter of the active area of the image sensor. The tran... | 06/29/2010 |
| 7745898 | Multichip package, methods of manufacture thereof and articles comprising the same Disclosed herein is a multichip package comprising an optoelectronics assembly; a socket that houses the optoelectronics assembly; the socket being in electrical communication with the optoelectronics assembly; a plate having a first surface and a second surface; th... | 06/29/2010 |
| 7709916 | Optical semiconductor device having photosensitive diodes and process for fabricating such a device An optical semiconductor device includes, in a zone (5), a structure of photosensitive diodes including a matrix (6) of lower electrodes (7), an intermediate layer (9) made of a photosensitive material formed on the matrix of lower electr... | 05/04/2010 |
| 7667284 | Method of manufacturing organic electroluminescent device and organic electroluminescent device An organic electroluminescent device, which, on a substrate, has a plurality of first electrodes, and a second electrode opposing the plurality of first electrodes. The organic electroluminescent device also including a light-emitting functional layer between the se... | 02/23/2010 |
| 7663199 | High power light emitting diode package and fabrication method thereof The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part f... | 02/16/2010 |
| 7629660 | Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof A semiconductor sensor component including a sensor chip and methods for the manufacturing thereof is disclosed. In one embodiment, the semiconductor sensor component includes a package which itself includes a transparent plastic material. The sensor chip has an act... | 12/08/2009 |
| 7615837 | Lithography device for semiconductor circuit pattern generation General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 11/10/2009 |
| 7564112 | Semiconductor device, radiographic imaging apparatus, and method for manufacturing the same A semiconductor device or a radiographic imaging apparatus includes a substrate and a supporting member, the substrate having a semiconductor element or a conversion element and being bonded to the supporting member with a laminating member. The semiconductor device... | 07/21/2009 |
| 7541658 | Optically interactive device package array An image sensor package and methods for simultaneously fabricating a plurality of such packages. A layer of barrier material comprising a matrix of raised walls is formed around chip attachment areas located in an array on a carrier substrate to create chip cavities... | 06/02/2009 |
| 7498647 | Packaged microelectronic imagers and methods of packaging microelectronic imagers Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microe... | 03/03/2009 |
| 7492025 | Photo coupler A photo coupler includes a semiconductor laser, a semiconductor light-receiver, a resin protector, a reflective film, a light pipe, and electrodes. The light pipe is made of resin, has a rectangular parallelepiped shape, and is provided so as to surround an outer ci... | 02/17/2009 |
| 7489015 | Magnetic shielding for magnetic random access memory A memory assembly comprises a substrate that incorporates magnetic shielding, a magnetic random access memory die supported by the substrate, and an encapsulation matrix that includes magnetic shielding that is disposed over the magnetic random access memory die. | 02/10/2009 |
| 7482666 | Apparatus and method for optical isolation An optoisolator device is shown having a die attachment device with a planar surface. A first circuit die has first and second planar surfaces and a first side surface. A receiver circuit and a first photodiode are formed on the first planar surface of the first cir... | 01/27/2009 |
| 7456483 | Semiconductor device, manufacturing method of semiconductor device and module for optical device A bond portion for bonding the principal plane of a solid-state imaging element with a transparent covering portion and configuring a hollow portion therebetween is provided with: a first opening end portion on the hollow portion side; a second opening end portion o... | 11/25/2008 |
| 7443024 | Micro-electro-mechanical system (MEMS) package having side double-sealing member and method of manufacturing the same A micro-electro-mechanical system (MEMS) package having a side double-sealing member and method of manufacturing the MEMS package is disclosed. The MEMS package is formed by forming a metal layer on a base substrate by patterning so that the metal layer surrounds an... | 10/28/2008 |
| 7439598 | Microelectronic imaging units Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes coupling a plurality of singulated imaging dies to a support member. The individua... | 10/21/2008 |
| 7439094 | Method of manufacturing a semiconductor package Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter... | 10/21/2008 |
