Did You Know...
...that power steering was invented by independent inventor Francis W. Davis? As chief engineer in the 1920s of the truck division of the Pierce Arrow Motor Car Company, he saw how hard it was to steer heavy vehicles. So that he would be able to keep the profits from his future invention, Davis left his job, rented a small engineering shop in Waltham, Mass., and developed a hydraulic power steering system that led to power steering.
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| Number | Title | Issue Date |
| 8106429 | Image sensor and manufacturing method thereof Disclosed is an image sensor. The image sensor includes a semiconductor substrate including a lower interconnection, a plurality of upper interconnection sections protruding upward from the semiconductor substrate, a first trench disposed between the upper interconn... | 01/31/2012 |
| 8101979 | Organic light-emitting display apparatus An organic light-emitting display apparatus includes a plurality of pixels arranged on a substrate, each pixel includes: a display region including at least one pixel thin film transistor and an organic light-emitting device electrically connected to the pixel thin ... | 01/24/2012 |
| 8093633 | Method and device for wavelength-sensitive photo-sensing A semiconductor device includes a conducting channel (130) formed beneath a substrate surface with a pre-determined photo-conductivity spectral response. The channel is formed between two pn-junctions (126, 128) defining first and third photo-electric ... | 01/10/2012 |
| 8017980 | Liquid crystal display apparatus An illumination apparatus includes a plurality of light emitting diode devices mounted therein and the light emitting diode device includes a substrate, a light emission area having a light emitting layer and a clad layer formed by growing crystal on the substrate, ... | 09/13/2011 |
| 7834382 | Nitride read-only memory cell and method of manufacturing the same A nitride read-only memory cell and a method of manufacturing the same are provided. First, a substrate is provided, and a first oxide layer is formed on the substrate. Next, a nitride layer is deposited on the first oxide layer via a first gas and a second gas. The... | 11/16/2010 |
| 7816710 | Packaging for an interferometric modulator with a curved back plate A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modul... | 10/19/2010 |
| 7755113 | Semiconductor device, semiconductor display device, and manufacturing method of semiconductor device To achieve high performance of a semiconductor integrated circuit depending on not only a microfabrication technique but also another way. In addition, to achieve low power consumption of a semiconductor integrated circuit. A semiconductor device is provided in whic... | 07/13/2010 |
| 7615810 | Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus An electro-optical device includes first and second substrates that are bonded to each other, the first substrate having an extended portion extended from the second substrate on a first side thereof in plan view, a plurality of pixel units that are disposed in a pi... | 11/10/2009 |
| 7612393 | Active photosensitive structure with buried depletion layer An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes depending on the level of accumulated charge in the accumulation region. Du... | 11/03/2009 |
| 7589365 | Dual capacitor structure for imagers CMOS and CCD imaging devices comprising different in-pixel capacitors and peripheral capacitors and methods of formation are disclosed. The capacitors used in periphery circuits have different requirements from the capacitors used in the pixel itself. Dual stack cap... | 09/15/2009 |
| 7521739 | Illuminating device and method of fabricating the same The illuminating device includes a lens formed of a resin mold and having a portion for receiving an LED which is formed on one surface thereof, the LED received in the receiving portion, and a wiring member deposited on the receiving-portion-forming surface of the ... | 04/21/2009 |
| 7495270 | Plasma display panel Provided is a plasma display panel (PDP), which minimizes an elevation in reflection brightness caused by reflection of external light and improves in contrast and discharge efficiency. The PDP includes a front substrate transmitting visible rays; a rear substrate d... | 02/24/2009 |
| 7442970 | Active photosensitive structure with buried depletion layer An imager pixel has a photosensitive JFET structure having a channel region located above a buried charge accumulation region. The channel region has a resistance characteristic that changes depending on the level of accumulated charge in the accumulation region. Du... | 10/28/2008 |
| 7439479 | Photonic crystal-based filter for use in an image sensor The invention, in various exemplary embodiments, incorporates a photonic crystal filter into an image sensor. The photonic crystal filter comprises a substrate and a plurality of pillars forming a photonic crystal structure over the substrate. The pillars are spaced... | 10/21/2008 |
| 7432576 | Grid metal design for large density CMOS image sensor A new grid metal design for image sensors is disclosed which is comprised of a semiconductor image sensor chip having a pixel region covering most of the chip and a logic circuit region on the chip periphery. The pixel region contains, an array of image pixels where... | 10/07/2008 |
| 7425734 | Thin-film transistor array with ring geometry An improved transistor array for a display or sensor device is described. The display or sensor device includes a plurality of pixels. Each pixel includes a width and a length. Each pixel is addressed by a transistor. The transistor addressing each pixel has a chann... | 09/16/2008 |
| 7425728 | Surface light source control device A surface light source control device has a plane light source control circuit for setting a current amount to a plurality of diode arrays. The light source control circuit comprises a constant current circuit for holding currents respectively flowing in the plurali... | 09/16/2008 |
| 7408211 | Transfer transistor of CMOS image sensor A transfer transistor of a CMOS image sensor is described, including a substrate of a first type, a gate dielectric layer on the substrate, a gate on the gate dielectric layer, a first doped region of the first type, a buried channel region of the first or second ty... | 08/05/2008 |
| 7408207 | Device manufacturing method and device, electro-optic device, and electronic equipment A device manufacturing method, including: a first process for providing the plural elements on the original substrate via a separation layer in a condition where terminal sections are exposed to a surface on an opposite side to the separation layer; a second process... | 08/05/2008 |
| 7405432 | Exposure device, exposure method and method of manufacturing semiconductor device The present invention provides a highly controllable device for exposure from the back side and an exposure method, and also provides a method of manufacturing a semiconductor device using the same. The present invention involves exposure with the use of the back si... | 07/29/2008 |
| 7402851 | Phase changeable memory devices including nitrogen and/or silicon and methods for fabricating the same Phase-changeable memory devices and method of fabricating phase-changeable memory devices are provided that include a phase-changeable material pattern of a phase-changeable material that may include nitrogen atoms and/or silicon atoms. First and second electrodes a... | 07/22/2008 |
| 7397067 | Microdisplay packaging system Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to the... | 07/08/2008 |
| 7368757 | Compound semiconductor and compound semiconductor device using the same A back electrode 6 is formed in the back of a Si single crystal substrate 2 of a compound semiconductor in which an n-type 3C-SiC single crystal buffer layer 3 having a thickness of 0.05-2 μm, a carrier concentration of 1016-102... | 05/06/2008 |
| 7348609 | Thin film transistor and method of forming thin film transistor The thin film transistor has a non-transparent structure besides and insulated with the gate. Hence, the light transmitted from the substrate is blocked and the light current induced in the thin film transistor is negligible. The method uses a mask with a slit patte... | 03/25/2008 |
| 7348539 | Image sensor for semiconductor light-sensing device and image processing apparatus using the same An image sensor for an image processing apparatus having a color filter array with open window cells alternating with single color filter cells includes a lens array containing a plurality of microlenses, a color filter array having a plurality of open window cells ... | 03/25/2008 |
| 7342276 | Method and apparatus utilizing monocrystalline insulator A semiconductor device, including: a semiconductor material; a conductive element; and a substantially monocrystalline insulator disposed between the semiconductor material and the conductive eleme... | 03/11/2008 |
| 7338872 | Method of depositing a layer of a material on a substrate The present invention makes it possible to precisely deposit a material adjacent a feature on a substrate. A layer of the material is deposited on the substrate. The layer is planarized and exposed to an etchant. The etchant is adapted to selectively remove the mate... | 03/04/2008 |
| 7335968 | High permeability composite films to reduce noise in high speed interconnects A transmission line circuit provides a structure for improved transmission line operation on integrated circuits. The transmission line circuit includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed ... | 02/26/2008 |
| 7335914 | Display, array substrate, and display manufacturing method Each pixel of a display includes a first thin film transistor whose source is connected to a first power supply terminal, a second thin film transistor which is different in conduction type from the first thin film transistor and whose source and drain are connected... | 02/26/2008 |
| 7326965 | Surface-emitting type device and its manufacturing method A surface-emitting type device includes a substrate including a first face, a second face that is tilted with respect to the first face and has a plane index different from a plane index of the first face, and a third face that is tilted with respect to the second f... | 02/05/2008 |
| 7312508 | Optical element, and its manufacturing method To provide an optical element including a surface-emitting type semiconductor laser and an photodetector element, having a desired plurality of dielectric layers, and its manufacturing method. An optical element in accordance with the present invention includes a su... | 12/25/2007 |
| 7312484 | Pixel having an oxide layer with step region A semiconductor structure, having a doped well region being formed in a substrate layer and a transistor having a terminal provided within said doped well region. The semiconductor structure also includes an oxide layer formed over the substrate layer, the doped wel... | 12/25/2007 |
| 7304381 | Package and method for attaching an integrated heat spreader In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached t... | 12/04/2007 |
| 7301170 | Thin film transistor array panel and method for manufacturing the same The present invention provides a TFT array panel and a manufacturing method of the same, which has signal lines including a lower layer of an Al containing metal and an upper layer of a molybdenum alloy (Mo-alloy) comprising molybdenum (Mo) and at least one of niobi... | 11/27/2007 |
| 7301171 | Display device and electronic device The invention provides a display device and an electronic device, each of which has one of a structure in which a substrate provided with a light emitting element which performs bottom light emission and a substrate provided with a light emitting element which perfo... | 11/27/2007 |
| 7294873 | X-Y address type solid state image pickup device and method of producing the same In an X-Y address type solid state image pickup device represented by a CMOS image sensor, a back side light reception type pixel structure is adopted in which a wiring layer is provided on one side of a silicon layer including photo-diodes formed therein. and visib... | 11/13/2007 |
| 7294874 | Laser irradiation method, method for manufacturing a semiconductor device, and a semiconductor device The present invention discloses the semiconductor device having the substrate that reflects the laser beam on a surface; that absorbs the laser beam therein; or that partially reflects the laser beam on the surface and partially absorbs the laser beam in the laser a... | 11/13/2007 |
| 7282375 | Wafer level package design that facilitates trimming and testing A wafer level method of packaging, trimming and testing integrated circuits is described. A wafer having trim pads is bumped before the wafer is trimmed. After the bumping, the dice on the wafer are trimmed and tested using standard trim probing and test probing tec... | 10/16/2007 |
| 7276749 | Image sensor with microcrystalline germanium photodiode layer A microcrystalline germanium image sensor array. The array includes a number of pixel circuits fabricated in or on a substrate. Each pixel circuit comprises a charge collecting electrode for collecting electrical charges and a readout means for reading out the charg... | 10/02/2007 |
| 7274054 | Dual capacitor structure for imagers and method of formation CMOS and CCD imaging devices comprising different in-pixel capacitors and peripheral capacitors and methods of formation are disclosed. The capacitors used in periphery circuits have different requirements from the capacitors used in the pixel itself. Dual stack cap... | 09/25/2007 |
