Bizarre Patents
Pneumatic Shoe Lacing Apparatus
This invention provides a pneumatic shoe lacing apparatus for the pneumatic lacing of shoe.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8072006 | Double-gated sensor cell A high quality imager is constructed using a silicon-on-insulator (SOI) process with sensors fabricated in the SOI substrate and isolated by the buried oxide (BOX) from associated readout circuitry in the SOI layer. Handle windows are opened in the SOI device layer ... | 12/06/2011 |
| 8004021 | Microfabricated devices and method for fabricating microfabricated devices Microfabricated devices for operation in a fluid that include a substrate that has a first and second surface and a first electrode material layer located over the first surface of the substrate. The devices have a piezoelectric material layer located over the first... | 08/23/2011 |
| 7868362 | SOI on package hypersensitive sensor A hypersensitive semiconductor die structure is disclosed, in which flip-chip packaging is used in conjunction with a modified SOI die in which a thick silicon support substrate has been removed to increase sensitivity of the sensing device. Rather than being locate... | 01/11/2011 |
| 7763912 | Columnar electric device and production method thereof A sensor whose size can be decreased without marring the performance and which can be installed in a narrow place, an electric device, and a method for easily manufacturing the electric device. By vacuum deposition of semiconductor on a columnar body or by applying ... | 07/27/2010 |
| 7696538 | Sensor for measuring liquid contaminants in a semiconductor wafer fabrication process Liquid detection sensors are attached to both sides of a robotic arm end effector of a semiconductor wafer process system. The sensor mechanism or probe is situated on the front side and backside of the end effector, designed with electrical lines that are traced on... | 04/13/2010 |
| 7592650 | High density hybrid MOSFET device A hybrid semiconductor power device that includes a plurality of closed power transistor cells each surrounded by a first and second trenched gates constituting substantially a closed cell and a plurality of stripe cells comprising two substantially parallel trenche... | 09/22/2009 |
| 7459732 | Gas-sensitive field-effect transistor with air gap A gas-sensitive field-effect transistor may be formed from a substrate with a gas-sensitive layer and a transistor processed separately and then assembled. The substrate may be patterned to form spacers by which the height of an air gap between the transistor and th... | 12/02/2008 |
| 7420235 | Solid-state imaging device and method for producing the same In the solid-state imaging device of the present invention having a photoelectric conversion section and a charge transfer section equipped with a charge transfer electrode for transferring an electric charge generated in the photoelectric conversion section, the ch... | 09/02/2008 |
| 7402849 | Parallel, individually addressable probes for nanolithography A microfabricated probe array for nanolithography and process for designing and fabricating the probe array. The probe array consists of individual probes that can be moved independently using thermal bimetallic actuation or electrostatic actuation methods. The prob... | 07/22/2008 |
| 7397072 | Structure for and method of using a four terminal hybrid silicon/organic field effect sensor device A four terminal field effect device comprises a silicon field effect device with a silicon N-type semiconductor channel and an N+ source and drain region. An insulator is deposited over the N-type semiconductor channel. An organic semiconductor material is deposited... | 07/08/2008 |
| 7375406 | Thermoplastic overmolding for small package turbocharger speed sensor A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical compone... | 05/20/2008 |
| 7315083 | Circuit device and manufacturing method thereof A circuit device suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, and a manufacturing method thereof are provided. According to a hybrid integrated circuit device of the present invention and a manufacturing m... | 01/01/2008 |
| 7302982 | Label applicator and system A label applicator including a support surface having a central area and curving downwardly from the central area. A post assembly extends up from the central area such that a label having a label through-hole can be positioned in a support position generally on the... | 12/04/2007 |
| 7288801 | Image sensing structure A CMOS image sensing structure includes a photodiode, in which an epitaxial layer is on a P-type substrate. The photodiode includes an N-well collection node in the epitaxial layer. An isolation trench is provided around the collection node to provide better control... | 10/30/2007 |
| 7253437 | Display device having a thin film transistor A semiconductor device and a method for forming the same are disclosed. The semiconductor device comprising an insulated gate field effect transistor provided with a region having added thereto an element at least one selected from the group consisting of carbon, ni... | 08/07/2007 |
| 7253409 | Electrochemical nano-patterning using ionic conductors The present invention provides nano-patterning based on flow of an ion current within an ionic conductor to bring ions in proximity to a microscope probe tip touching a surface of the conductor. These ions are then electrochemically reduced to form one or more featu... | 08/07/2007 |
| 7247895 | Electrostatic nanolithography probe actuation device and method Method and apparatus for selectively actuating a cantilevered probe for applying a compound to a substrate in nanolithography. A probe having a probe electrode and a substrate having a counter electrode are provided. Voltage applied to the probe electrode and/or cou... | 07/24/2007 |
| 7242012 | Lithography device for semiconductor circuit pattern generator General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 07/10/2007 |
| 7227199 | Image sensor and method of manufacturing the same Disclosed is a method of manufacturing an image sensor having light sensitivity over a photodiode equal in area to that of a unit pixel. The image sensor includes an image sensor comprising: a first semiconductor substrate doped with a first conductive dopant; a fir... | 06/05/2007 |
| 7223696 | Methods for maskless lithography General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 05/29/2007 |
| 7217584 | Bonded thin-film structures for optical modulators and methods of manufacture The present invention provides silicon based thin-film structures that can be used to form high frequency optical modulators. Devices of the invention are formed as layered structures that have a thin-film dielectric layer, such as silicon dioxide, sandwiched betwee... | 05/15/2007 |
| 7217983 | Photoelectric conversion film-stacked type solid-state imaging device To provide a solid-state imaging device in which the number of transistors for each signal readout circuit provided in a semiconductor substrate side is reduced and the number of image signal readout lines is reduced, solid-state imaging device a semiconductor subst... | 05/15/2007 |
| 7214999 | Integrated photoserver for CMOS imagers An exemplary system and method for providing an integrated photosensing element suitably adapted for use in CMOS imaging applications is disclosed as comprising inter alia: a processed CMOS host wafer (460) bonded with a monocrystalline, optically active dono... | 05/08/2007 |
| 7214974 | Image sensors for reducing dark current and methods of manufacturing the same An image sensor includes a substrate region of a first conductivity type, a photodiode region of a second conductivity type located in the substrate, a hole accumulated device (HAD) region of the first conductivity type located at a surface of the substrate and over... | 05/08/2007 |
| 7212240 | Imager with a row of photodiodes or pinned photo diodes A TDI sensor includes a first readout register and a plurality of sensor columns. The first readout register includes a plurality of first readout register elements. A first sensor column includes a photogate and a diode photodetector at an end. The diode photodetec... | 05/01/2007 |
| 7199409 | Device for subtracting or adding charge in a charge-coupled device The present invention provides an apparatus for adding or subtracting an amount charge to or from a charge packet in a CCD as the packet traverses the CCD. The apparatus uses a “wire transfer” device structure to perform the addition or subtraction of charge dur... | 04/03/2007 |
| 7196321 | Fine pattern forming apparatus and fine pattern inspecting apparatus Disclosed is a fine pattern forming apparatus and a fine pattern inspecting apparatus. In one preferred form, the fine pattern forming apparatus includes a surface irregularity information reading device for detecting a shape signal corresponding to a surface irregu... | 03/27/2007 |
| 7193241 | Ultraviolet sensor and method for manufacturing the same An ultraviolet sensor includes a substrate; a diamond layer, placed on the substrate, functioning as a detector; and at least one pair of surface electrodes arranged on the diamond layer. The diamond layer has a detecting region present at the surface thereof, the d... | 03/20/2007 |
| 7193239 | Three dimensional structure integrated circuit A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, red... | 03/20/2007 |
| 7190008 | Electro-optic displays, and components for use therein An electro-optic display comprises a substrate (100), non-linear devices (102) disposed substantially in one plane on the substrate (100), pixel electrodes (106) connected to the non-linear devices (102), an electro-optic medium ( | 03/13/2007 |
| 7187052 | Photoelectric conversion apparatus and image pick-up system using the photoelectric conversion apparatus A primary object of the present invention is to provide a photoelectric conversion apparatus with less leak current in a floating diffusion region. In order to obtain the above object, a photoelectric conversion apparatus according to the present invention includes ... | 03/06/2007 |
| 7176545 | Apparatus and methods for maskless pattern generation General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor ... | 02/13/2007 |
| 7177489 | Silicon-insulator-silicon thin-film structures for optical modulators and methods of manufacture The present invention provides silicon based thin-film structures that can be used to form high frequency optical modulators. Devices of the invention are formed as layered structures that have a thin-film dielectric layer, such as silicon dioxide, sandwiched betwee... | 02/13/2007 |
| 7170117 | Image sensor with improved dynamic range and method of formation Embodiments of the invention provide an image sensor having an improved dynamic range. A pixel cell comprises at least one transistor structure. The transistor structure comprises at least one semiconductor channel region, at least one gate for controlling the chann... | 01/30/2007 |
| 7151659 | Gapped-plate capacitor In a semiconductor device, a capacitor is provided which has a gap in at least one of its plates. The gap is small enough so that fringe capacitance between the sides of this gap and the opposing plate at least compensates, if not overcompensates, for the missing co... | 12/19/2006 |
| 7147050 | Recuperator construction for a gas turbine engine A counter-flow recuperator formed from annular arrays of recuperator core segments. The recuperator core segments are formed from two opposing sheets of fin fold material coined to form a primary surface zone disposed between two flattened manifold zones. Each prima... | 12/12/2006 |
| 7149388 | Low loss contact structures for silicon based optical modulators and methods of manufacture The present invention provides silicon based thin-film structures that can be used to form high frequency optical modulators. Devices of the invention are formed as layered structures that have a thin-film dielectric layer, such as silicon dioxide, sandwiched betwee... | 12/12/2006 |
| 7141833 | Photodiode Apart from a semiconductor substrate and a photosensitive region in the semiconductor substrate, which comprises a space charge zone region for generating a diffusion current portion and a diffusion region for generating a diffusion current portion, a photodiode inc... | 11/28/2006 |
| 7138295 | Method of information processing using three dimensional integrated circuits A Three-Dimensional Structure (3DS) Memory allows for physical separation of the memory circuits and the control logic circuit onto different layers such that each layer may be separately optimized. One control logic circuit suffices for several memory circuits, red... | 11/21/2006 |
| 7129531 | Programmable resistance memory element with titanium rich adhesion layer A programmable resistance memory element comprising an adhesion layer between the programmable resistance material and at least one of the electrodes. Preferably, the adhesion layer is a titanium rich titanium nitride composition. ... | 10/31/2006 |
