Bizarre Patents
Pet Toilet-Like Water Disk and Food Storage
One pet-friendly inventor patented "a device for watering pets, e.g., a dog or cat." The device, he helpfully noted, "has the general shape of a toilet."
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| Number | Title | Issue Date |
| 7397066 | Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers Microelectronic imagers with curved image sensors and methods for manufacturing curved image sensors. In one embodiment, a microelectronic imager device includes an imager die having a substrate, a curved microelectronic image sensor having a face with a convex and/... | 07/08/2008 |
| 7154926 | Laser diode module, laser apparatus and laser processing apparatus Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insu... | 12/26/2006 |
| 6979843 | Power semiconductor device A power semiconductor device that uses a lead frame for making connection to a semiconductor device and has a structure less subject to fatigue failure at the connection part of the lead frame. A mold resin of a casing (14) is used for integrally covering the... | 12/27/2005 |
| 6891189 | Nitride semiconductor laser device and optical pickup apparatus therewith A nitride semiconductor laser device includes a nitride semiconductor substrate, and a layered portion corresponding to a nitride semiconductor film grown on the nitride semiconductor substrate, the layered portion including an n-type layer and a p-type layer and a ... | 05/10/2005 |
| 6747343 | Aluminum leadframes with two nickel layers A leadframe for use with integrated circuit chips comprising a leadframe base made of aluminum or aluminum alloy having a surface layer of zinc; a first layer of nickel on said zinc layer, said first nickel layer deposited to be compatible with aluminum and zinc; a ... | 06/08/2004 |
| 6562545 | Method of making a socket assembly for use with a solder ball A socket assembly for removably receiving a solder ball of a chip package and methods for forming the same. The socket assembly is a raised construction formed over a substrate and includes a socket, a ball contact structure, and an electrical trace. A re... | 05/13/2003 |
| 6518647 | Plated aluminum leadframes for semiconductor devices, including two nickel layers, and method of fabrication A leadframe for use with integrated circuit chips, comprising a leadframe base made of aluminum or aluminum alloy having a surface layer of zinc; a first layer of nickel on said zinc layer, said first nickel layer deposited to be compatible with aluminum ... | 02/11/2003 |
| 6369411 | Semiconductor device for controlling high-power electricity with improved heat dissipation A semiconductor device including (a) a base plate, (b) an insulation substrate including of an insulator plate with a front electrode and a back electrode bonded thereon and fixed onto the base plate by the back electrode, (c) a semiconductor element fast... | 04/09/2002 |
| 6045893 | Multilayered electronic part with minimum silver diffusion A multilayered electronic part with minimized silver diffusion into ceramic body. The multilayered electronic part is produced by sintering a green ceramic body of a plurality of ceramic layers comprising a main phase and a grain boundary phase, at least ... | 04/04/2000 |
| 4918514 | Press-contact type semiconductor device A soft metal plate having substantially equal hardness as emitter electrodes formed of soft metal is disposed between the emitter electrodes and a heat buffer metal plate formed of hard metal, and pressure applied to the emitter electrodes is shared by th... | 04/17/1990 |
| 4885630 | High power multi-layer semiconductive switching device having multiple parallel contacts with improved forward voltage drop A large area solid state multi-layer semiconductive switching device having multiple parallel contacts accommodates large magnitudes of currents and provides a uniform and a relatively low voltage drop for each of its multiple parallel contacts. This is p... | 12/05/1989 |
| 4882612 | Power semiconductor device In a power semiconductor device according to the present invention, a sheet, formed of a soft metal such as Ag, is provided on that portion of a pressing control electrode which is brought into contact with an Al gate electrode of a pellet. By means of th... | 11/21/1989 |
| 4881118 | Semiconductor device One surface of a cathode sliding compensator is finished as an irregular surface while another surface thereof is finished as a sliding surface. The irregular surface is arranged to contact with a cathode electrode layer of a semiconductor element while t... | 11/14/1989 |
| 4835119 | Semiconductor device and a process of producing same A semiconductor device which comprises: a first main electrode on a first main surface of the semiconductor substrate, and a second main electrode on a second main surface thereof, the first main surface including a control electrode; a first outer main e... | 05/30/1989 |
