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| Number | Title | Issue Date |
| 8076696 | Power module assembly with reduced inductance A device is provided that includes a first conductive substrate and a second conductive substrate. A first power semiconductor component having a first thickness can be electrically coupled to the first conductive substrate. A second power semiconductor component ha... | 12/13/2011 |
| 7910952 | Power semiconductor arrangement One aspect relates to a power semiconductor arrangement includes a power semiconductor module which is mechanically connected to a heat sink. In order to improve the thermal cycling stability of the connection between a baseplate of the module and a circuit carrier ... | 03/22/2011 |
| 7759697 | Semiconductor device A semiconductor device is provided which comprises a thermally radiative and electrically conductive support plate 1; and a regulatory semiconducting element 2 mounted on one main surface of support plate 1 through an insulator 3. Insulat... | 07/20/2010 |
| 7719027 | Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof The present invention provides an integrated circuit and the method of implementing the same. The integrated circuit includes a die, a base, a covering material and a plurality of pins. The die has at least a first function and a second function and includes a plura... | 05/18/2010 |
| 7696532 | Power semiconductor module A power semiconductor module (1) with a housing (2) and at least one semiconductor chip (3, 3′) located in it is devised. At least one semiconductor chip (3, 3′) has a first main electrode side (31) and a second main electrode ... | 04/13/2010 |
| 7659559 | Semiconductor package having insulated metal substrate and method of fabricating the same Provided is a semiconductor package in which an adhesion force between an insulation metal substrate and a molding member is increased by removing a solder mask layer from the insulation metal substrate and a method of fabricating the semiconductor package. The semi... | 02/09/2010 |
| 7470939 | Semiconductor device A semiconductor device is disclosed that includes a first and a second semiconductor package. Each semiconductor package includes a semiconductor element, a plurality of electrode members, and an encapsulating member. The semiconductor elements are interposed betwee... | 12/30/2008 |
| 7462888 | Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device The temperature of a bipolar semiconductor element using a wide-gap semiconductor is raised using heating means, such as a heater, to obtain a power semiconductor device being large in controllable current and low in loss. The temperature is set at a temperature hig... | 12/09/2008 |
| 7462886 | Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device The temperature of a bipolar semiconductor element using a wide-gap semiconductor is raised using heating means, such as a heater, to obtain a power semiconductor device being large in controllable current and low in loss. The temperature is set at a temperature hig... | 12/09/2008 |
| 7462887 | Semiconductor connection component There is a need for providing a technology capable of decreasing on-resistance of a power transistor in a semiconductor device that integrates the power transistor and a control integrated circuit into a single semiconductor chip. There is another need for providing... | 12/09/2008 |
| 7449726 | Power semiconductor apparatus The power semiconductor apparatus includes a resin package made up of a power semiconductor element and a control semiconductor element which are mounted on a main front surface of a lead frame and sealed with mold resin, a power terminal led out of the resin packag... | 11/11/2008 |
| 7420224 | Active rectifier module for three-phase generators of vehicles A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is co... | 09/02/2008 |
| 7402898 | Semiconductor package, method for fabricating the same, and semiconductor device A semiconductor device includes a semiconductor chip, leads for sending and receiving signals between the semiconductor chip and an external device, fine metal wires, an encapsulant for sealing the leads, and a lid member. On the surface of each of the leads, a meta... | 07/22/2008 |
| 7397120 | Semiconductor package structure for vertical mount and method In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with ... | 07/08/2008 |
| 7397126 | Semiconductor device The present invention provides inhibiting an electrical leakage caused by anion migration. A trenched portion 15 is provided as ion migration-preventing zone between a source electrode 4 and a gate electrode 5. The trenched portion 15 is ... | 07/08/2008 |
| 7382000 | Semiconductor device A semiconductor device is provided which comprises a connecting lead 4 mounted between a MOS-FET 1 and a regulatory IC 2 on a support plate 3. Connecting lead 4 has a thermally radiative and electrically conductive substrate 6 | 06/03/2008 |
| 7352233 | Efficient thyristor-type power switches The highest-power switches now available are based on thyristor-type devices: GTOs (Gate turn-off thyristors), MTOs (MOS controlled turn-off thyristors), IGCTs (Integrated gate commutated thyristors), and the new ETOs (Emitter turn-off thyristors). These devices han... | 04/01/2008 |
| 7301755 | Architecture for power modules such as power inverters Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additional... | 11/27/2007 |
| 7295448 | Interleaved power converter A power converter architecture interleaves full bridge converters to alleviate thermal management problems in high current applications, and may, for example, double the output power capability while reducing parts count and costs. For example, one phase of a three ... | 11/13/2007 |
| 7289329 | Integration of planar transformer and/or planar inductor with power switches in power converter A power converter integrates at least one planar transformer comprising a multi-layer transformer substrate and/or at least one planar inductor comprising a multi-layer inductor substrate with a number of power semiconductor switches physically and thermally coupled... | 10/30/2007 |
| 7274089 | Integrated circuit package system with adhesive restraint An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad. ... | 09/25/2007 |
| 7262507 | Semiconductor-mounted device and method for producing same Semiconductor-mounted device comprises wired board, first semiconductor chip mounted on first side of wired board, second semiconductor chip mounted on second side of wired board and sealing resin sealing, with a same height, a region disposed at and around first se... | 08/28/2007 |
| 7262444 | Power semiconductor packaging method and structure A semiconductor chip packaging structure comprising a dielectric film having one or more through holes aligned with the one or more contact pads of at least one power semiconductor chip. A patterned electrically conductive layer adjacent to the dielectric film has o... | 08/28/2007 |
| 7256431 | Insulating substrate and semiconductor device having a thermally sprayed circuit pattern An insulating substrate includes a metal base as a base member, an insulating layer which is a room temperature, aerosol deposited shock solidification film formed on the metal base, and a circuit pattern which is a cold sprayed thermal spray coating formed on the i... | 08/14/2007 |
| 7256489 | Semiconductor apparatus In a semiconductor apparatus in which a main current of a semiconductor device flows through a wiring pattern formed on an insulation circuit board, the rise in temperature of the wiring pattern is suppressed and the increase in cost of parts can be minimized. On th... | 08/14/2007 |
| 7238551 | Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys A semiconductor package includes a die that is interposed, flip-chip style, between an upper lead frame and a lower lead frame. The lower lead frame has contacts that are aligned with terminals on the bottom surface of the die. The upper lead frame contacts a termin... | 07/03/2007 |
| 7227198 | Half-bridge package A semiconductor package that includes two power semiconductor dies, such as power MOSFET dies, including vertical conduction MOSFETs, arranged in a half-bridge configuration is disclosed. The package may be mounted on a split conductive pad including two isolated di... | 06/05/2007 |
| 7215204 | Intelligent high-power amplifier module An amplifier module has a substrate, as assembly having one or more integrated circuit (IC) dies mounted to the substrate, and one or more other electronic components mounted to the substrate. The assembly receives an input signal and generates an amplified output s... | 05/08/2007 |
| 7196412 | Multi-chip press-connected type semiconductor device A multi-chip press-connected type semiconductor device comprises: a plurality of active element chips to control an electric current flowing in one direction; a plurality of diode chips that transmit the current in a direction opposite to the current transmitting di... | 03/27/2007 |
| 7187074 | Semiconductor and electronic device with spring terminal A semiconductor or electronic device, such as a power module uses at least one spring terminal as a control terminal. The spring terminal is led outside a case through a coil-accommodating member, which can be a frame or removable cover. With this arrangement, the s... | 03/06/2007 |
| 7183575 | High reverse voltage silicon carbide diode and method of manufacturing the same high reverse voltage silicon carbide diode A high reverse voltage diode includes a hetero junction made up from a silicon carbide base layer, which constitutes a first semiconductor base layer, and a polycrystalline silicon layer, which constitutes a second semiconductor layer, and whose band gap is differen... | 02/27/2007 |
| 7145230 | Semiconductor device with a solder creep-up prevention zone The present invention provides a semiconductor device which includes a U-shaped metal package base, and a semiconductor chip having at least surface electrodes and being mounted on the inner bottom portion of the U-shaped metal package base, wherein the metal packag... | 12/05/2006 |
| 7141832 | Semiconductor device and capacitance regulation circuit According to an embodiment of the invention, there is provided a semiconductor device comprising: a semiconductor element having a first main electrode, a second main electrode and a control electrode, a current flowing between the first and second main electrodes b... | 11/28/2006 |
| 7132698 | Compression assembled electronic package having a plastic molded insulation ring A compression assembled semiconductor package for housing a power semiconductor die which includes two major pole pieces in intimate electrical contact with respective major electrodes of a power semiconductor die. The package includes a plastic molded insulation ri... | 11/07/2006 |
| 7126213 | Rectification chip terminal structure A rectification chip terminal structure for soldering a rectification chip on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conducti... | 10/24/2006 |
| 7119432 | Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package A semiconductor package comprising a packaging substrate, a semiconductor die mounted with the substrate, a heatspreader, and a multi-layer heat transfer element arranged between the semiconductor die and the heat spreader to enable thermal communication between the... | 10/10/2006 |
| 7119447 | Direct fet device for high frequency application A source mounted semiconductor device package is described which includes a semiconductor die having first and second opposing major surfaces, first and second major electrodes disposed on respective major surfaces and a control electrode disposed on the second majo... | 10/10/2006 |
| 7091580 | Semiconductor device When a silicone gel is injected into a case, since the gel is liquid before curing, the gel attempts to rise along a minute gap formed between a front face of a first electrode and a rear face of a resin member due to capillary action. However, since the gap becomes... | 08/15/2006 |
| 7071550 | Semiconductor module having heat sink serving as wiring line A semiconductor module includes a parts-mounting or packaging substrate, a plurality of power metal insulator semiconductor (MIS) chips which have top surfaces and back surfaces and are mounted by flip chip bonding on or above the package substrate while letting the... | 07/04/2006 |
| 7045831 | Semiconductor device A semiconductor device of the present invention comprises a semiconductor chip, metal layers formed on a first main surface of the semiconductor chip, a first conductive layer layered on a second main surface of the semiconductor chip, consisting of a plurality of c... | 05/16/2006 |
