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Class 257/141 - Lateral structure, i.e., current flow parallel to main device surface


Subclass of Class 257 - Active solid-state devices (e.g., transistors, solid-state diodes)
Definition: Subject matter wherein the extended latchup current level
No. of patents: 126
Last issue date: 05/29/2012


1        
NumberTitleIssue Date
8188511Semiconductor device and method of manufacturing thereof
A semiconductor device and a method of forming the semiconductor device include a substrate and an n drift layer on the substrate with an insulator film placed between them. A trench is provided in a section between a p base region and an n buffer layer on the surfa...
05/29/2012
7893458Semiconductor device having lateral MOS transistor and zener diode
A semiconductor device includes: a semiconductor substrate; a lateral MOS transistor disposed in the substrate; a Zener diode disposed in the substrate; and a capacitor disposed in the substrate. The transistor includes a drain and a gate, and the diode and the capa...
02/22/2011
7795638Semiconductor device with a U-shape drift region
A cell of a semiconductor device comprises a substrate of n-type with a trench formed in a portion of a first main surface of the substrate and filled with insulator. Two device-feature regions are formed beneath the first main surface of the substrate, the first on...
09/14/2010
7759696High-breakdown voltage semiconductor switching device and switched mode power supply apparatus using the same
A high-breakdown voltage semiconductor switching device includes a resurf region of a second conductivity type; a base region of a first conductivity type formed to be adjacent to the resurf region; an emitter/source region of the second conductivity type formed in ...
07/20/2010
7388255Semiconductor device having separation region
A semiconductor device includes: a semiconductor substrate; a separation region in the substrate; an embedded layer; a channel forming region; a source region; a drain region; a first electrode for the source region; a second electrode for the channel forming region...
06/17/2008
7368788SRAM cells having inverters and access transistors therein with vertical fin-shaped active regions
Complementary metal oxide semiconductor (CMOS) static random access memory (SRAM) cells include at least a first inverter formed in a fin-shaped pattern of stacked semiconductor regions of opposite conductivity type. In some of these embodiments, the first inverter ...
05/06/2008
7348630Semiconductor device for high frequency uses and manufacturing method of the same
The semiconductor device has a semiconductor substrate, gate electrodes formed above the semiconductor substrate, and a pair of impurity diffusion layers formed in a surface layer of the semiconductor substrate at both sides of each of the gate electrodes. The semic...
03/25/2008
7342282Compact SCR device and method for integrated circuits
A semiconductor device and method for electrostatic discharge protection. The semiconductor device includes a first semiconductor controlled rectifier and a second semiconductor controlled rectifier. The first semiconductor controlled rectifier includes a first semi...
03/11/2008
7321504Static random access memory cell
A static random access memory (SRAM) cell having an inverter and a tri-state inverter. An input of the inverter is coupled to an output of the tri-state inverter and an output of the inverter is coupled to an input of the tri-state inverter. The tri-state inverter h...
01/22/2008
7294551Semiconductor device and method for manufacturing the same
A semiconductor device has a gate electrode formed on a P type semiconductor substrate via gate oxide films. A first low concentration (LN type) drain region is made adjacent to one end of the gate electrode. A second low concentration (SLN type) drain region is for...
11/13/2007
7275226Method of performing latch up check on an integrated circuit design
A method of performing latch up check on an integrated circuit (IC) design that comprises rasterizing a conductor region shape and contact shapes and iteratively expanding the contact shapes within the conductor region shape using a cellular algorithm. Direction val...
09/25/2007
7268373Thyristor-based memory and its method of operation
A semiconductor may contain a plurality of circuits each comprising at least one thyristor having a base region. The base region of at least one of the thyristors has a different doping profile than the others. When a bias circuit is used to bias the thyristors, the...
09/11/2007
7230455Logic circuits utilizing gated diode sensing
A family of logic circuits, called gated diode logic circuits, is disclosed wherein small amplitude signals, typically a fraction of the supply voltage, can be sensed and amplified by applying a small amplitude signal to a gate of a gated diode in a sampling mode an...
06/12/2007
7208820Substrate having a plurality of I/O routing arrangements for a microelectronic device
A substrate is provided for packaging a microelectronic device having a pattern of contacts on the surface thereof. The substrate is formed from a support member having a substantially planar surface, and first, second, and third electrically conductive paths. The e...
04/24/2007
7205629Lateral super junction field effect transistor
A voltage booster transistor with an optimal conducting path formed in widebandgap semiconductors like Silicon Carbide and Diamond, is provided as a power transistor with a voltage rating >200V. Contrary to conventional vertical design of power transistors, a higher...
04/17/2007
7196361Cascoded bi-directional high voltage ESD protection structure
In a high voltage ESD protection solution, a plurality of DIACs are connected together to define a cascaded structure with isolation regions provided to prevent n-well and p-well punch through. An p-ring surrounds the DIACs and provides a ground for the substrate in...
03/27/2007
7184312One transistor SOI non-volatile random access memory cell
One aspect of the present subject matter relates to a memory cell, or more specifically, to a one-transistor SOI non-volatile memory cell. In various embodiments, the memory cell includes a substrate, a buried insulator layer formed on the substrate, and a transisto...
02/27/2007
7148543Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation regions
A semiconductor chip includes a base substrate, a bulk device region having a bulk growth layer on a part of the base substrate, an SOI device region having a buried insulator on the base substrate and a silicon layer on the buried insulator, and a boundary layer lo...
12/12/2006
7141831Snapback clamp having low triggering voltage for ESD protection
An SCR device having a first P type region disposed in a semiconductor body and electrically connected to anode terminal of the device. At least one N type region is also disposed in the body adjacent the first P type region so as to form a PN junction having a widt...
11/28/2006
7141832Semiconductor device and capacitance regulation circuit
According to an embodiment of the invention, there is provided a semiconductor device comprising: a semiconductor element having a first main electrode, a second main electrode and a control electrode, a current flowing between the first and second main electrodes b...
11/28/2006
7135745Fin thyristor-based semiconductor device
A semiconductor device having a thyristor-based device and a pass device exhibits characteristics that may include, for example, resistance to short channel effects that occur when conventional MOSFET devices are scaled smaller in connection with advancing technolog...
11/14/2006
7135738Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
A family of semiconductor devices is formed in a substrate that contains no epitaxial layer. In one embodiment the family includes a 5V CMOS pair, a 12V CMOS pair, a 5V NPN, a 5V PNP, several forms of a lateral trench MOSFET, and a 30V lateral N-channel DMOS. Each o...
11/14/2006
7130216One-device non-volatile random access memory cell
One aspect of the present subject matter relates to a one-device non-volatile memory cell. The memory cell includes a body region, a first diffusion region and a second diffusion region formed in the body region. A channel region is formed in the body region between...
10/31/2006
7122861Semiconductor device and manufacturing method thereof
The present invention relates to a semiconductor device including a high withstand voltage MOS transistor and a manufacturing method thereof. The semiconductor device according to the present invention includes a MOS transistor in which a second-conductivity type so...
10/17/2006
7109533Electrostatic discharge protection device
There is provided an electrostatic discharge protection device comprising a P conductive type first P well region 101 formed in a P type epitaxial layer 31 being deposited on a surface of a P+ substrate 30 having a prescribed thickness, an N con...
09/19/2006
7105386High density SRAM cell with latched vertical transistors
High density static memory cells and arrays containing gated lateral bipolar transistors which can be latched in a bistable on state. Each transistor memory cell includes two gates which are pulse biased during the write operation to latch the cell. Also provided is...
09/12/2006
7091557Semiconductor component with increased dielectric strength and/or reduced on resistance
The invention relates to a semiconductor component having a first semiconductor zone of a first conduction type, a second semiconductor zone of a second conduction type and a drift zone arranged between the first and second semiconductor zones, which drift zone has ...
08/15/2006
7087961Semiconductor device with reduced on-state resistance
To enable the reduction of ON-state resistance in a state in which the withstand voltage is secured, a semiconductor device according to the invention is provided with a gate electrode formed so that the gate electrode ranges from a gate oxide film formed on an N-ty...
08/08/2006
7067852Electrostatic discharge (ESD) protection structure
An ESD protection structure includes a semiconductor substrate of a first conductivity type, and first and second well regions of a second conductivity type disposed in the substrate. The first and second well regions are separated by a gap region of the substrate. ...
06/27/2006
7067970Light emitting device
A light emission device has an emitter made of a dielectric material, a cathode electrode disposed on a surface of the emitter, an anode electrode disposed on a reverse surface of the emitter, and a pulse generation source for applying a drive voltage between the ca...
06/27/2006
7045830High-voltage diodes formed in advanced power integrated circuit devices
A diode-connected lateral transistor on a substrate of a first conductivity type includes a vertical parasitic transistor through which a parasitic substrate leakage current flows. Means for shunting at least a portion of the flow of parasitic substrate leakage curr...
05/16/2006
7042027Gated lateral thyristor-based random access memory cell (GLTRAM)
One aspect of the present subject matter relates to a memory cell, or more specifically, to a scalable GLTRAM cell that provides DRAM-like density and SRAM-like performance. According to various embodiments, the memory cell includes an access transistor and a gated,...
05/09/2006
7034358Vertical transistor, and a method for producing a vertical transistor
The present invention relates to a method for producing a vertical transistor, and to a vertical transistor. A sacrificial gate oxide and a sacrificial gate electrode are used during the production of the vertical transistor to makes it possible to considerably redu...
04/25/2006
7029956Memory system capable of operating at high temperatures and method for fabricating the same
A memory system having a plurality of T-RAM cells arranged in an array is presented where each T-RAM cell has dual vertical devices and is fabricated over a SiC substrate. Each T-RAM cell has a vertical thyristor and a vertical transfer gate. The top surface of each...
04/18/2006
7020030SRAM cell with horizontal merged devices
A merged structure SRAM cell is provided that includes a first transistor and a second transistor. The second transistor gate forms a load resistor for the first transistor and the first transistor gate forms a load resistor for the second transistor. Also provided ...
03/28/2006
7012301Trench lateral power MOSFET and a method of manufacturing the same
A semiconductor device is provided that can be manufactured by a simpler process than a conventional lateral trench power MOSFET for use with an 80V breakdown voltage, and which has a lower device pitch and lower on-state resistance per unit area than a conventional...
03/14/2006
6972237Lateral heterojunction bipolar transistor and method of manufacture using selective epitaxial growth
A method for manufacturing a heterojunction bipolar transistor is provided. An intrinsic collector structure is formed on a substrate. An extrinsic base structure partially overlaps the intrinsic collector structure. An intrinsic base structure is formed adjacent th...
12/06/2005
6963109Semiconductor device and method for manufacturing the same
A semiconductor device has a gate electrode formed on a P type semiconductor substrate via gate oxide films. A first low concentration (LN type) drain region is made adjacent to one end of the gate electrode. A second low concentration (SLN type) drain region is for...
11/08/2005
6936866Semiconductor component
A vertical or lateral semiconductor component derives a signal from a high load voltage. This signal can be used directly for driving the semiconductor component or, alternatively, a control device. ...
08/30/2005
6921688Method of and apparatus for integrating flash EPROM and SRAM cells on a common substrate
A system for and a method of integrating SRAM cells and flash EPROM cells onto a single silicon substrate includes an area on the silicon substrate where a local oxidation of silicon (LOCOS) isolation technique is implemented and another area on the same silicon sub...
07/26/2005
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