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| Number | Title | Issue Date |
| 7394084 | Method of generating image and illumination device for inspecting substrate For generating an image for inspection of a substrate, a camera is provided above this substrate with an optical axis orienting downward and a plurality of multi-colored light emitting members are set around the optical axis of the camera so as to be within a specif... | 07/01/2008 |
| 7353954 | Tray flipper and method for parts inspection Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconduc... | 04/08/2008 |
| 7326946 | Optical module having a reflector element and method of manufacturing the same An optical module includes a light-emitting element, a light-receiving element, and a reflector. The light-emitting element and the light-receiving element are mounted in the optical module, and the reflector composed of a wire or a ribbon reflects and guides an emi... | 02/05/2008 |
| 7304500 | Programmable logic module and upgrade method thereof A programmable logic module. In the programmable logic module, a first printed circuit board has a socket and a downloading unit. A field programmable gate array (FPGA) is disposed on the first printed circuit board. A nonvolatile memory stores program codes for pro... | 12/04/2007 |
| 7299684 | Automated tool and workspace analysis An automated tool installation and workspace analysis method determines an axis of a fastener in order to determine positioning a fastener actuating tool. A center of gravity of the fastener is determined. The axis of the fastener is calculated based in part on the ... | 11/27/2007 |
| 7283235 | Optical device and inspection module Optical device for representing a central image (10) of an object (1) and at least one lateral image (11, 12, 13, 14) of the same object (1), with the length of the real optical path of said central image (10) being different from ... | 10/16/2007 |
| 7239399 | Pick and place machine with component placement inspection Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination i... | 07/03/2007 |
| 7209583 | Bonding method, bonding apparatus and bonding program With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the posit... | 04/24/2007 |
| 7181058 | Method and system for inspecting electronic components mounted on printed circuit boards A method and system are provided for inspecting electronic components mounted on printed circuit boards utilizing both 3-D and 2-D data associated with the components and the background on which they are mounted on the printed circuit board. Preferably, a 3-D scanne... | 02/20/2007 |
| 7145162 | Wire loop height measurement apparatus and method The invention provides a method and an apparatus for determining a height of a point on a wire loop. A height gauge device is positioned over the point on the wire loop to be measured. Incident light is projected from the height gauge device for illuminating the poi... | 12/05/2006 |
| 7142301 | Method and apparatus for adjusting illumination angle A machine-vision system that provides quick changing and/or automatic adjustment of illumination angle, dispersion, intensity, and/or color of illumination. One such system includes a light source emitting polarized light, a machine-vision imager, an image processor... | 11/28/2006 |
| 7058216 | Apparatus for detecting lead coplanarity, apparatus for detecting condition of electronic component, and system for mounting electronic component An apparatus for detecting a coplanarity of a plurality of leads of an electronic component that laterally extend from a main body thereof, including a holding device which holds the main body of the electronic component at an upper surface of the main body, an imag... | 06/06/2006 |
| 7034272 | Method and apparatus for evaluating integrated circuit packages having three dimensional features The present invention provides for methods and an apparatus for evaluating objects having three dimensional features. One method involves using both two dimensional data sets to improve the processing of three dimensional data sets. The two dimensional data set can ... | 04/25/2006 |
| 7019826 | Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection A three-dimensional optical inspection system reconstructs a three-dimensional image of the shape of the surface of an at least partially specular object resident on a printed circuit board by capturing two or more two-dimensional images of the object under differen... | 03/28/2006 |
| 7006212 | Electrical circuit conductor inspection A first inspection functionality is provided to obtain information about a first attribute at a conductor location on an electrical circuit. A second inspection functionality is provided to obtain information about a second attribute at the conductor location. A com... | 02/28/2006 |
| 6956963 | Imaging for a machine-vision system Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconduc... | 10/18/2005 |
| 6950548 | Creating geometric model descriptions for use in machine vision inspection systems A method and system create a geometric object model for use in machine vision inspection. A pixel image representation of an object is acquired. Based on this pixel image representation, part models for the parts of the object are generated. Each part model correspo... | 09/27/2005 |
| 6947151 | Surface state inspecting method and substrate inspecting apparatus In a substrate inspecting apparatus comprising a projecting section (4) in which light sources (8), (9) and (10) are provided for emitting colored lights of R, G and B in directions having different elevation angles, one or two color comp... | 09/20/2005 |
| 6813016 | Co-planarity and top-down examination method and optical module for electronic leaded components A machine-vision system and method are described for simultaneously imaging different sides of an object. The system includes an imager and optics that images two or more views of the first side of the object and of the second side. The views of the first side and t... | 11/02/2004 |
| 6762428 | Cream solder inspection method and apparatus therefor An inspection method for cream solder for determining whether or not the shape of the cream solder is appropriate based on information on the height of the cream solder by irradiating light from substantially besides in two directions opposing each other through a l... | 07/13/2004 |
| 6683731 | Bonding apparatus A bonding apparatus that includes a bonding tool through which a wire passes and which performs bonding on a workpiece, a position detection camera which takes images of the workpiece, a reference member which is disposed in a specified position, and an o... | 01/27/2004 |
| 6571007 | Ball-arranging substrate for forming bump, ball-arranging head, ball-arranging device, and ball-arranging method A ball-arranging substrate comprising a substrate with a main surface, a plurality of ball-arranging holes formed on the main surface for sucking and holding minute electroconductive balls at the locations corresponding to those of electrodes formed on a ... | 05/27/2003 |
| 6567161 | Three dimensional lead inspection system A semiconductor device lead inspection apparatus and method are provided for capturing images of the semiconductor edges and leads along two optical axes which have different directions in a plane perpendicular to the semiconductor device edge. One image ... | 05/20/2003 |
| 6542236 | Illuminating and optical apparatus for inspecting soldering of printed circuit board An illuminating and optical apparatus for inspecting soldering of an inspecting part on a PCB includes an illuminating and optical apparatus collecting light emitted by first and second illuminating units. The first and second illuminating units each incl... | 04/01/2003 |
| 6538244 | Pick and place machine with improved vision system including a linescan sensor A pick and place machine is disclosed which includes an on-head linescan sensor, and at least one additional optical sensor. The at least one additional sensor can be an off-head linescan sensor, an off-head or on-head 2D camera, an on-head shadow (e.g. o... | 03/25/2003 |
| 6526165 | Methods and apparatuses for refining a geometric description of an object having a plurality of extensions A method and apparatus are disclosed for refining a rough geometric description (GD) and a rough pose of an object having extensions. The invention locates anchor points within an image of the object and uses the anchor points to align in at least one dim... | 02/25/2003 |
| 6525331 | Ball grid array (BGA) package on-line non-contact inspection method and system A method and apparatus is disclosed for non-contact, on-line inspection of objects including a ball grid array package by means of a shadow moire technique combined with a novel flash phase-shifting method. The grid pitch size, ball height, ball diameter,... | 02/25/2003 |
| 6515295 | Device for exposure of the peripheral area of a film circuit board A device for exposure of the peripheral area of a film circuit board in which the edge of the copper foil can be exactly determined and the position of the irradiation area can be controlled with high precision is obtained in that a resist (R) in the peri... | 02/04/2003 |
| 6437355 | Apparatus for judging whether bump height is proper or not An apparatus to check a height of a bump includes a measuring device and a determining device. The measuring device is configured to measure a distance between an image position in an image of a reference object reflected in a surface of the bump and a pr... | 08/20/2002 |
| 6314194 | Method for generating computer aided design programming circuit designs from scanned images of the design A VHSIC hardware description language model is generated from a scanned image of an electronic circuit by: a. producing a bitmap image of a schematic using standard scanning devices that takes a paper drawing and produces an image of a drawing in electron... | 11/06/2001 |
| 6307210 | Device for imaging object to be inspected and device for inspecting semiconductor package An inspection object imaging device, which images a plurality of objects to be inspected that are located at different imaging distances from imaging means, in which a light transmitting optical member which has a predetermined refractive index and a thic... | 10/23/2001 |
| 6278797 | Apparatus for inspecting land-attached circuit board An inspection beam such as laser beam is scanned two-dimensionally on an inspection surface of a circuit board with a plurality of lands while allowing its reflected beam from the inspection surface to be received by a beam receiving section. The beam rec... | 08/21/2001 |
| 6249598 | Solder testing apparatus A solder testing apparatus comprising image processing means for performing image processing on an image of an appearance of a soldered portion to identify shape characterizing amounts for the soldered portion; and defect determining means for performing ... | 06/19/2001 |
| 6242756 | Cross optical axis inspection system for integrated circuits A method and an apparatus for the measurement and inspection of integrated circuit. Such an apparatus includes a camera for sensing an image of the integrated circuit (IC), an oblique light source, and a reflector. The camera has an optical axis passing t... | 06/05/2001 |
| 6207946 | Adaptive lighting system and method for machine vision apparatus A variable intensity lighting system for use with a machine vision apparatus for capturing high contrast images of articles to be inspected, such as semiconductor packages, includes an LED or optical fiber element and flash lamp array configured in multip... | 03/27/2001 |
| 6205238 | Apparatus and method for inspecting leads of an IC Disclosed are apparatus and method for inspecting leads of an IC placed on a setting table. The apparatus comprises an optical image recognition part for scanning the setting table, a device for moving the recognition palt with respect to the setting tabl... | 03/20/2001 |
| 6201892 | System and method for arithmetic operations for electronic package inspection An inspection system and method uses a first illumination apparatus to illuminate one or more features, such as solder balls on an electronic component or other protruding surfaces or features on an object being inspected. Once the object being inspected ... | 03/13/2001 |
| 6188784 | Split optics arrangement for vision inspection/sorter module The present invention provides method and apparatus for determining lead integrity of IC devices characterized by an inspection arrangement which comprises optical elements for back lighting the leads disposed on either side of a trackway for the travel o... | 02/13/2001 |
| 6133579 | Method and apparatus for slanted attitude testing and/or for co-planarity testing of a contact for SMD components An entire contact row of an SMD component is illuminated by a light source direction in the direction of the contact row, and a shadow of the entire contact row is directed by a linear sensor. A shift of the contact row perpendicular to a contact surface ... | 10/17/2000 |
| 6118538 | Method and apparatus for electronic component lead measurement using light based sensors on a component placement machine The present invention is a light based detection system for providing a low cost, very fast and very accurate measurements of lead positions and heights for integrated circuit board components. The alignment detections systems of the present invention are... | 09/12/2000 |
