Lines with other classes and within this classClass 228 includes patents disclosing and claiming certain steps or instrumentalities useful for a proper operation of fusion bonding which are partially listed as follows: (1) a metallic heat applicator (subclasses 51+); (2) seam back-up means (subclass 50 and subclass 216); (3) specialized solder pot (subclass 56); (4) solder form (subclass 56). A patent claiming closing of a minute opening in a single workpiece (e.g., tipping) is proper subject matter for Class 228, in that the periphery of a single work opening is considered to constitute meeting faces of a single work part as required by the definition of this class. Coating of a work part which may, incidentally, cover small openings in the part is not considered to be proper subject matter for this class. RELATIONSHIP TO CLASSES INVOLVING, PER SE, METAL FUSION BONDING Classes Of Article Making Generally a patent claiming making of a particular article will be found in the appropriate class directed to making of that article except that a patent claiming performing a single fusion bonding operation is placed in this class (228). Fusion bonding combined with additional operations which are considered to be ancillary to the bonding (e.g., preheating, positioning for bonding, or pretinning) will also be found in this class (228). Examples of such classes providing for the manufacture of particular articles may be found in References to Other Classes, below. Because of the technology in the making of semiconductor and related devices, certain art terms used to designate operations specially recognized in that discipline are listed below which, when combined with fusion bonding, will cause placement of a patent in Class 29, Metal Working, and Class 438, Semiconductor Device Manufacturing: Process, particularly subclasses 26+, 51, 55, 64+, and 106+ for methods of packaging a semiconductor device and subclasses 455+ for laminating or bonding plural semiconductor substrates; see the search notes thereunder. (1) Diffusion (not diffusion bonding) (2) Assembling two semiconductors for an electrical function (Note that each semiconductor may be, for example, a player, an n layer, a chain of p or n layers or a laminated article of p and n layers). (3) Shaping a metal layer to form a conductor. (4) Cutting (5) Assembling other than to bond (i.e., other than juxtapose) (6) Bonding to create a junction (7) Doping Also see References to Other Classes, below, for specific search notes to the following: The Class Of Wireworking The Class Of Metal Casting The Class Of Electric Fusion Bonding RELATIONSHIP TO COMBINATION CLASSES A patent claiming a combination of metal fusion bonding with a different operation, whether manufacturing or nonmanufacturing, is proper subject matter for Class 228, except as specifically noted in the search notes in References to Other Classes, below, relating to the following combination classes: The Class Of Package Making The Classes Including Post-fusion Treatment RELATIONSHIP TO OTHER CLASSES The Heating Classes: Placement of a patent claiming heating is in the appropriate heating class, even though the sole disclosed application of the heat is in the production of a metal fusion-bonded product of this class (228). In this connection, the term "heating" includes the usually accepted auxiliary means or step such as supporting or holding material to be heated, or causing or permitting relative movement between the material and the heating means. But if, in addition to the above recited heating structure or step, a claim recites a means to further metal fusion bonding, placement is in this class (228). Examples of such claimed limitations are: (a) moving or guiding one work part relative to another work part, into a position for mutual fusion bonding; (b) forcing or urging one work portion against another work portion at the immediate zone of fusion; or (c) moving or guiding flux or filler. A claim to the combination of a Class 228 application (e.g., "soldering") with supplying of heat to such applicator is considered to define heating, proper for one of the heating classes (see paragraph 4, below), even though details of the applicator are also recited, such as: (a.) its alloy composition or its shape; or (b) adjusting such applicator relative to its support. "Means for supplying heat" may be, for example, nothing more elaborate or detailed than a claimed pair of terminals for connection of the applicator to an electrical circuit. See References to Other Classes, below, for examples of classes providing for heating. The Work Handling Or Product Handling Classes: The placement of patents claiming handling work for, or product of, a metal fusion bonding operation, and also claiming fusion bonding is in this class (228) except where the fusion bonding is recited by name only, i.e., in terms that name but do not describe any characteristics of a metal fusion bonding operation. The so excepted patents are placed in appropriate classes related to material handling, per se. See References to Other Classes, below, for examples of classes providing for handling the work or product of a fusion bonding operation. See References to Other Classes, below, for specific search notes to the following classes: The Classes Of Coating The Class Of Adhesive Bonding The Class Of Static Structures | 
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