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| Number | Title | Issue Date |
| 7389805 | Bonding arm swinging type bonding apparatus A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 | 06/24/2008 |
| 7262124 | Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire has a crushed part formed therein by crushing the part of the wire and a top of a ball bonded to the first bonding point with a capillary. The wir... | 08/28/2007 |
| 7138328 | Packaged IC using insulated wire A packaged IC including insulated wire for electrically connecting conductive structures of the packaged IC. In some embodiments, the packaged IC includes an IC die attached to a package substrate, where bond pads of the IC die are electrically connected to bond fin... | 11/21/2006 |
| 6877650 | Compliant wirebond pedestal A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electr... | 04/12/2005 |
| 6311890 | Concave face wire bond capillary An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding... | 11/06/2001 |
| 6165888 | Two step wire bond process A two step wire bonding process is used to ultrasonically attach a wire (18) to a contact pad (13) on a semiconductor device (10). A first step is used to flatten a rounded tip (19) of the wire (18), and to start the bonding process. This is accomplished ... | 12/26/2000 |
| 6158647 | Concave face wire bond capillary An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame. The wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding... | 12/12/2000 |
| 6089439 | Wire cutting and feeding device for use in wire bonding apparatus In a wire cutting and feeding device used in a wire bonding apparatus, piezo-electric actuators are used as the driving source of a slide block which moves wire clamper toward and away from a workpiece upon which bonding is performed. The piezo-electric a... | 07/18/2000 |
| 6080651 | Wire bonding method A wire bonding method in the manufacture of, for instance, a semiconductor device in which first bonding points or pads of a chip and second bonding points or leads of a lead frame are connected by wires, and the bonding by wires is initiated from one end... | 06/27/2000 |
| 5945065 | Method for wedge bonding using a gold alloy wire A gold alloy wire for wedge bonding, comprising 1 to 100 parts per million by weight of calcium (Ca), the remainder being gold and inevitable impurities, said gold alloy wire having a tensile strength of not less than 33.0 kg/mm2 and an elongat... | 08/31/1999 |
| 5838071 | Wire bonding method, wire bonding apparatus and semiconductor device produced by the same A wire bonding method for joining a metal wire with a bonding pad disposed on a semiconductor element by using a load and supersonic wave vibration, comprising: during interval of time from contact of the metal wire with the bonding pad to application of ... | 11/17/1998 |
| 5829663 | Self locking key for ultrasonic transducers The present invention concerns a self locking system for holding a wire bonding tool in a wire bonding transducer and comprises an unitary cam key rotatably mounted in a cam key aperture extending through an anti-node end of an ultrasonic transducer. A ca... | 11/03/1998 |
| 5776786 | Method for wire-bonding a covered wire To assure that a loop height remains constant even if the wiring distance should vary and no slack is generated in the hypotenuse of the bonded wire: the length of the covered wire required for a next wiring operation is set by a formula which combines a ... | 07/07/1998 |
| 5637274 | Palladium alloy thin wire for wire bonding semiconductor elements The present invention provides a Pd alloy thin wire for wire bonding semiconductor elements comprising Ca, Al, Cr and Si each in an amount of up to 0.0003% by weight, from 0.001 to 0.01% by weight of In, optionally one or both of Au and Ag each having a p... | 06/10/1997 |
| 5603445 | Ultrasonic wire bonder and transducer improvements Improved ultrasonic wire bonders, and improvements to ultrasonic wire bonding transducers that are used with such ultrasonic wire bonders. The improvements to the ultrasonic wire bonding transducer includes driver-node mounting of the transducer and a cla... | 02/18/1997 |
| 5550083 | Process of wirebond pad repair and reuse A wire bonding method comprising the steps of (a) disconnecting a first wire which is bonded on a first pad which is provided on a substrate, (b) forming a second pad on the first pad, and (c) bonding a second wire on the second pad, so that the second wi... | 08/27/1996 |
| 5538685 | Palladium bonding wire for semiconductor device A bonding wire for a semiconductor device contains high purity Pd or Pd alloy as a base metal and 25-10000 atppm of low boiling element III having a boiling point lower than a melting point of the base metal and soluble in Pd, or contains high purity Pd o... | 07/23/1996 |
| 5514912 | Method for connecting semiconductor material and semiconductor device used in connecting method This invention relates to a connection method for a semiconductor material enabling a formation of a bump electrode with a wire bonder, keeping always a cutting position of the wire at a specified position and improving a continuous workability and stabil... | 05/07/1996 |
| 5488768 | Method of forming a defibrillation electrode connection A method for electrically attaching electrode wire to a conductor in a defibrillation lead is disclosed. The method comprises melting the end of the wire with a hydrogen torch to form a ball of metal, then crimping or welding the ball to the conductor or ... | 02/06/1996 |
| 5468683 | Method of manufacturing an optoelectronic semiconductor device having a single wire between non-parallel surfaces Optoelectronic devices often comprise an optoelectronic semiconductor element such as a diode laser fastened on a carrier. The desired path of a beam of radiation from or to such an element often implies that such an element has to be fastened on the carr... | 11/21/1995 |
| 5455200 | Method for making a lead-on-chip semiconductor device having peripheral bond pads A semiconductor device (10) has a lead-on-chip (LOC) configuration. Leads (24) of the device have central portions (36) which are electrically coupled to peripheral bond pads (14) by conductive wires (30). Inner portions (38) of the leads extend from the ... | 10/03/1995 |
| 5455195 | Method for obtaining metallurgical stability in integrated circuit conductive bonds A method for electrically connecting integrated circuit copper-gold ball bond that connect a bond wire (18) with a bond pad (14) forms a palladium layer (16) in the electrical connection between the bond wire (18) and the bond pad (14). The connection avo... | 10/03/1995 |
| 5366589 | Bonding pad with circular exposed area and method thereof A bonding pad is covered by an passivation layer to provide insulation and anti-corrosion protection. The passivation layer over the bonding pad is etched away to expose a circular area of the bonding pad where the bonding wire is attached. By shaping the... | 11/22/1994 |
| 5342807 | Soft bond for semiconductor dies On a semiconductor integrated circuit die, a semipermanent electrical connection is effected by the use of wirebond techniques, in which the parameters of the wirebond are controlled, so that less bonding force retains the leadwires to the bondpads than t... | 08/30/1994 |
| 5298219 | High purity gold bonding wire for semiconductor device Bonding wire for a semiconductor device contains high purity Au or Au alloy as a base metal and 25-10000 atppm of low boiling point element I having a boiling point lower than a melting point of the base metal and soluble in Au, or contains high purity Au... | 03/29/1994 |
| 5158223 | Wire bonding apparatus A wire bonding apparatus for connecting a chip electrode of a semiconductor chip and an inner lead of a lead frame through a bonding wire is described. The apparatus is provided with an X-Y table having a bonding head. An ultrasonic horn is attached rotat... | 10/27/1992 |
| 5156318 | Ultrasonic bonding apparatus for bonding a semiconductor device to a tab tape In a method for bonding inner leads arranged along a square opening of a tab tape to a semiconductor device, the inner leads of a pair of inner lead rows that face each other are bonded first to the semiconductor device and then a bonding tool is rotated ... | 10/20/1992 |
| 5148959 | Wedge bonding tool A wedge bonding tool having a shank and a tapered work end including a narrow bonding tip for holding a wire against a surface to which it is to be bonded, a shank secured to said tapered work end for guiding wire to the rear of the tapered work end, and ... | 09/22/1992 |
| 5124277 | Method of ball bonding to non-wire bonded electrodes of semiconductor devices In an internal wire bonding section of a semiconductor device, electrodes pads (e.g., Al pads) which are not connected to leads are ball-bonded with metallic balls (e.g., Au balls) to improve moisture resistance and to thereby reduce the rate of corrosion... | 06/23/1992 |
| 5115960 | Wire bonding method A wire bonding method for connecting a chip electrode on a semiconductor chip and a lead through metal wire is described. The wire bonding method includes transmitting a first ultrasonic oscillation to the metal wire before the contact time of the metal w... | 05/26/1992 |
| 5116783 | Method of producing semiconductor device A method of producing a semiconductor device includes bonding a semiconductor chip to a die pad of a lead frame by means of a silicone resin, to bonding a copper wire and an aluminum electrode of the semiconductor chip in such a manner that intermetallic ... | 05/26/1992 |
| 5058798 | Method for forming bump on semiconductor elements Method of forming bumps out of wire on the electrode of a semiconductor element is executed by setting a tip end underneath a vertically movable wedge, lowering the wedge to press the tip end of the wire against the semiconductor element, securely connect... | 10/22/1991 |
| 5014900 | Deep access bond head A wire bonder for bonding semiconductor packages that require a deep access to bond between the semiconductor device bond pads and the bonding area on the package to avoid interference between the bond head and the package pins, the bonder including a bel... | 05/14/1991 |
| 4996169 | Semiconductor laser assembly A semiconductor laser assembly is provided with a photodetector module and a laser module mounted on orthogonal surfaces of a heatsink. The photodetector module includes a photodetector and two electrically isolated wire bond blocks, each with two surface... | 02/26/1991 |
| 4974054 | Resin molded semiconductor device The trend toward higher integration degrees has caused the semiconductor pellets to have large sizes. In the resin molded semiconductor devices, in particular, cracks develop on the pellet due to contraction upon cooling that stems from the difference of ... | 11/27/1990 |
| 4917285 | Dual capstan in-line wire drawing machine A wire drawing machine having first and second capstans for unwinding wire from first and second coils and for pulling the wire through first and second wire drawing dies. The output from both capstans is directed to a single production machine, with the ... | 04/17/1990 |
| 4891333 | Semiconductor device and manufacturing method thereof This invention concerns a semiconductor device manufacturing method wherein connection is made of the end portion of aluminium bonding wire to a lead electrode of material selected from the group consisting of copper and copper alloy in a manner such that... | 01/02/1990 |
| 4882298 | Method for encapsulating microelectronic semiconductor and thin film devices In a method for encapsulating microelectronic semiconductor and thin film devices, a reliable hermetically sealed encapsulation of the circuit components is achieved, even under long exposure to extreme environmental conditions of moisture and corrosive g... | 11/21/1989 |
| 4854466 | Hanging packaging cup A packaging cup of the type typically utilized to contain a small volume of a condiment and formed of a resilient material which has a reservoir and a lip which surrounds the reservoir with a lid sealed to the lip is improved by including support fingers ... | 08/08/1989 |
| 4842671 | Apparatus for connecting elongate material such as electrical conductors by means of ultrasonics In an apparatus intended especially for connecting electrical conductors by ultrasonic welding, in which a two-part anvil comprising three working surfaces is associated with a sonotrode for defining a compaction chamber on all sides, the two anvil parts ... | 06/27/1989 |
