Bizarre Patents
Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7435377 | Weldable ultrahard materials and associated methods of manufacture A weldable ultrahard insert can include an ultrahard working layer and a weldable metal layer metallically bonded with the working layer. The ultrahard working layer can be any ultrahard material such as PCD, PCBN, metal carbide, ceramic, diamond, or the like. The w... | 10/14/2008 |
| 7043822 | Method of manufacturing commutator of rotary electric machine A method of manufacturing a commutator of a rotary electric machine includes a step of forming a first unitary material having nail portions, a step of forming a second unitary material for the commutator segments, a step of fixing the first unitary material and the... | 05/16/2006 |
| 6698242 | Brittle article comprising joined-together hardened glass and/or glass-ceramic parts and method of making same In the method according to the invention cold or unheated hardened glass and/or glass-ceramic parts are bonded together with a metallic ductile joining material, preferably silver, copper, aluminum or an alloy of those metals, to form a brittle article. T... | 03/02/2004 |
| 6634082 | Method of making a carbon commutator assembly A method for making a carbon commutator assembly by forming an annular carbon cylinder of a conductive carbon composition and metalizing an inner surface of the carbon cylinder by bonding a first layer of metallic material to the inner surface of the carb... | 10/21/2003 |
| 6582548 | Compression bonding method using laser assisted heating A method for bonding an oxide-containing member to an aluminum surface, includes the steps of: providing a substrate, wherein a portion of a surface of the substrate has aluminum thereon; positioning an oxide-containing member on the aluminum surface of t... | 06/24/2003 |
| 6410161 | Metal-ceramic joint assembly A metal-ceramic joint assembly in which a brazing alloy is situated between metallic and ceramic members. The metallic member is either an aluminum-containing stainless steel, a high chromium-content ferritic stainless steel or an iron nickel alloy with a... | 06/25/2002 |
| 6399019 | Brazing material for use in joining a metal plate to a ceramic substrate A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centen... | 06/04/2002 |
| 6354484 | Process for producing a metal-ceramic composite substrate A metal-ceramic composite substitute is produced by joining a metal plate to a ceramic substrate by using a brazing material in a paste form prepared by adding 10-14 parts by weight of a vehicle to 100 parts by weight of a powder of which the solid centen... | 03/12/2002 |
| 6347982 | Method for making a polishing apparatus utilizing brazed diamond technology and titanium nitride A method and apparatus for polishing and planarizing workpieces such as semiconductor wafers is presented. Conditioning rings, which are used to condition polishing pads used in the planarization or polishing of semiconductor wafers, are shown which utili... | 02/19/2002 |
| 6319617 | Oxide-bondable solder A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. T... | 11/20/2001 |
| 6306516 | Article comprising oxide-bondable solder The invention provides an article comprising a solder that bonds well to oxides and other surfaces to which solder bonding is problematic. The solder composition contains one or more rare earth elements, which react with the oxide or other surface to prom... | 10/23/2001 |
| 6247221 | Method for sealing and/or joining an end of a ceramic filter A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantiall... | 06/19/2001 |
| 6197435 | Substrate An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the... | 03/06/2001 |
| 6020076 | Joined ceramic structures and a process for the production thereof A joined ceramic structure including a ceramic member and a metallic joining member joined to each other through a joining layer made of a brazing material wherein a metallic member is buried in the ceramic member in the state that a metal-exposed portion... | 02/01/2000 |
| 6000243 | Vacuum pull down method for an enhanced bonding process A process for effectively bonding arbitrary size or shape substrates. The process incorporates vacuum pull down techniques to ensure uniform surface contact during the bonding process. The essence of the process for bonding substrates, such as glass, plas... | 12/14/1999 |
| 5942185 | Lead-free solder used for connecting electronic parts on organic substrate and electronic products made using same Provided is a lead-free solder for connecting LSI and parts on organic substrates, which can provide soldering at a maximum temperature of 220°-230° C. and which has a sufficient reliability in mechanical strength even at a high temperature of 150° C. ... | 08/24/1999 |
| 5900097 | Method of fabricating a laminated composite material There is provided a method of fabricating a laminated composite material and laminated composite materials fabricated thereby wherein the method includes the initial step of forming a pre-laminate by overlaying a first layer characterized by a first therm... | 05/04/1999 |
| 5882784 | Metal-film laminate A metal-film laminate including a metal plate and a biaxially oriented polyester-group film laminated on the metal plate. The orientation degree of the film is controlled such that, when the thickness of the film is represented by T and the mean orientati... | 03/16/1999 |
| 5831309 | Semiconductor element for an electronic or opto-electronic semiconductor component Semifinished products designed as composite bodies for electronic or opto-electronic semiconductor components are known. The composite bodies are made of a disk-shaped, transparent quartz glass substrate and a wafer made of a semiconductor material. The d... | 11/03/1998 |
| 5700373 | Method for sealing a filter A process for sealing a ceramic filter by infiltrating a metal into an end of the filter. The process includes the steps of contacting the end of a porous ceramic filter with a molten metal, whereby the metal enters into the ceramic matrix to substantiall... | 12/23/1997 |
| 5534103 | Method for bonding of a ceramic body and a metallic body Proposed is a method for bonding of a ceramic body and a metallic body at a relatively low temperature not to cause substantial deformation or material degradation of the ceramic and metallic materials. The surface of the ceramic body is first irradiated ... | 07/09/1996 |
| 5465898 | Process for producing a metal-ceramic substrate A process is provided where a ceramic metal substrate is produced by attaching metal foils on either side a ceramic layer to form metal layers and for producing a through connection by placing metal in an opening to form a bridge so that the metal layers ... | 11/14/1995 |
| 5294241 | Method for making glass to metal seals A method for making a seal between a sealing glass and titanium by forming a nitride layer on the titanium and then sealing the glass to the nitrided titanium. The formation of the nitride layer can be accomplished by the steps of placing the titanium in ... | 03/15/1994 |
| 5262347 | Palladium welding of a semiconductor body A method of bonding together two dissimilar planar bodies, one of which is a semiconductor. A film of palladium is deposited on one of the bodies. The two bodies are pressed together with moderate force with the palladium in between. The palladium chemica... | 11/16/1993 |
| 5178319 | Compression bonding methods Elements such as glass spheres (11) and optical fibers (30') are permanently bonded to aluminum surfaces (13) of substrates (12) by applying pressure along with energy to the interface of the element and the aluminum. For example, a glass sphere is bonded... | 01/12/1993 |
| 5143275 | Method for repairing a glass layer of glass-lined equipment An improved method for repairing a damaged portion of a glass layer of glass-lined equipment. In the method, a metallic fiber-containing sheet made of a metallic fiber-containing web, a metallic woven fabric sheet or a metallic nonwoven fabric sheet is di... | 09/01/1992 |
| 5106434 | Method for producing a metal and ceramic heat-connected body In heat-connections between metal and ceramic, martensite stainless steel or martensite heat-resistant steel which can be hardened by quenching in a gas or vacuum after having been heated beyond the quench hardening temperature thereof are used as metal. ... | 04/21/1992 |
| 5074941 | Enhancing bonding at metal-ceramic interfaces Metal-ceramic interfaces of enhanced strength are produced by positioning bodies of ceramic oxides and transition element metals or alloys containing such in abutting relationship, and heating in air at a temperature ranging from 500° C. to just below th... | 12/24/1991 |
| 5066547 | Metal and ceramic heat-connected body In heat-connection between metal and ceramic, martensite stainless steel or martensite heat-resistant steel which can be hardened a gas or vacuum after having been heated beyond the quenching temperature thereof are used as metal. The heat connection is b... | 11/19/1991 |
| 5058799 | Metallized ceramic substrate and method therefor A metallized ceramic substrate having an enhanced bond strength between the ceramic substrate and a conductive metal layer bonded thereto is disclosed. The metallized ceramic substrate includes a heterogeneous juncture band between a ceramic workpiece and... | 10/22/1991 |
| 5054683 | Method of bonding together two bodies with silicon oxide and practically pure boron A method is set forth of bonding together two bodies (1, 2), according to which a first body (1) is provided with a flat surface (5) and the second body (2) is provided with a silicon oxide layer (4) with a flat surface (6), after which a connecting layer... | 10/08/1991 |
| 5046242 | Method of making feedthrough assemblies having hermetic seals between electrical feedthrough elements and ceramic carriers therefor A cochlear prosthetic package having a cup-shaped titanium case with a ceramic plate; a plurality of hermetically-sealed feedthroughs are formed in the plate by sintering the plate with hollow metallic tubes located in plate holes and then sealing at leas... | 09/10/1991 |
| 5007575 | Device for producing cone-shaped bodies of glass, particularly Tiffany-style lampshades The invention relates to a device for producing essentially cone-shaped flat bodies, whose surface area consists of n attached segments, (preferably 4, 6, 8), each composed of a number of attached glass pieces connected to one another, particularly Tiffan... | 04/16/1991 |
| 4962879 | Method for bubble-free bonding of silicon wafers A method for bubble-free bonding of silicon wafers to silicon wafers or silicon wafers to quartz wafers either outside or inside a Clean Room. The method includes the steps of positioning wafers in closely spaced-apart and parallel relationship to each ot... | 10/16/1990 |
| 4939101 | Method of making direct bonded wafers having a void free interface Wafers which are direct bonded to each other in accordance with prior art processes suffer from voids at their bonded interface. Annealing such composite structures at high temperature and high pressure (for silicon wafers preferably about 1,100° C. and ... | 07/03/1990 |
| 4902358 | Ceramic to metal brazing A method for forming extremely strong ceramic-to-metal joints is provided which is particularly applicable to the formation of components for internal combustion engines. The present method simultaneously brazes a ceramic to a metal and creates a normalli... | 02/20/1990 |
| 4883215 | Method for bubble-free bonding of silicon wafers A method for bubble-free bonding of silicon wafers to silicon wafers or silicon wafers to quartz wafers either outside or inside a Clean Room. The method includes the steps of positioning wafers in closely spaced-apart and parallel relationship to each ot... | 11/28/1989 |
| 4842961 | Alternate electrolytic/electroless-layered lid for electronics package A lid or cover for a ceramic enclosure is formed of a substrate of an iron-based alloy, e.g., Kovar, alternately plated and coated with electrolytic nickel and electroless nickel, with an outer gold electroplate. The alternate electroplate and electroless... | 06/27/1989 |
| 4769345 | Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor The present invention is directed to a process of forming a package for enclosing an electrical device wherein the enclosure contains a very low amount of oxygen and water vapor. The package includes a base and lid components bonded together by a sealing ... | 09/06/1988 |
| 4762269 | Method of joining molded silicon carbide parts Silicon carbon molded parts, whether made of silicon carbide sintered together in the absence of pressure or hot pressed silicon carbide are bonded together at close fitting surfaces by applying a layer not thicker than 1 μm on polished surfaces to be jo... | 08/09/1988 |
