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| Number | Title | Issue Date |
| 8113411 | Universal radio frequency shield removal Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identic... | 02/14/2012 |
| 7681776 | Methods and apparatus for efficiently generating profiles for circuit board work/rework A system includes a first module to store times and temperatures for phases in a profile to rework a populated printed circuit board (PCB) for a first integrated circuit (IC) on the PCB and a second module to store suggestions for modifying one or more of the times ... | 03/23/2010 |
| 7644852 | Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off probe for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for... | 01/12/2010 |
| 7516878 | Bump formation method and bump forming apparatus for semiconductor wafer A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognit... | 04/14/2009 |
| 7380697 | Welding condition monitoring device A welding condition monitoring device for monitoring the welding state of a welding work portion by taking an image thereof by an image sensor having a wide dynamic range and capable of taking an image covering a very bright welding portion and relatively dark porti... | 06/03/2008 |
| 7367489 | Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time suff... | 05/06/2008 |
| 7363688 | Land grid array structures and methods for engineering change A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to... | 04/29/2008 |
| 7350684 | Apparatus and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 04/01/2008 |
| 7326025 | System for detecting warped carriers and associated methods Disclosed herein is a warp detection system (200) for determining warping in a carrier (110) configured to carry substrates (120) for processing. In one embodiment, the system (200) includes a guide plate (210) configured to guide ... | 02/05/2008 |
| 7308999 | Die bonding apparatus A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in wh... | 12/18/2007 |
| 7293686 | Bonding apparatus A wire bonder including two link driving mechanisms and a head supporting stage provided with a bonding head via fluid pressure so that the bonding head is movable in the horizontal plane. Each link driving mechanism is formed by a motor, a driving arm, and a movabl... | 11/13/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7282663 | Forge welding process An automated method for forge welding tubulars including heating the tubular ends to be joined in a welding chamber while the heated tubular ends are maintained aligned and parallel relative to each other and at a small spacing, whereupon the heated tubular ends are... | 10/16/2007 |
| 7270258 | Method of fabrication of semiconductor integrated circuit device Productivity is to be improved in assembling a semiconductor integrated circuit device. A matrix substrate is provided and semiconductor chips are disposed on a first heating stage, and then the matrix substrate is disposed above the semiconductor chips on the first... | 09/18/2007 |
| 7270735 | System and method for holding and releasing a workpiece for electrochemical machining A system and method are described for holding and releasing a workpiece for electrochemical machining. In one embodiment, a workpiece holder has a workpiece surface that couples to the workpiece when negative pressure is applied to provide a seal between the workpie... | 09/18/2007 |
| 7246736 | Supplying shielding gas A flexible articulate tubular device has a shank, a plurality of pivot rings, and a terminus with heat sensors and a fiber optic device. The flexible articulate tubular device is initially positioned, either manually or automatically, near a target weld path with th... | 07/24/2007 |
| 7225968 | Crack repair using friction stir welding on materials including metal matrix composites, ferrous alloys, non-ferrous alloys, and superalloys A system and method of using friction stir welding and friction stir processing to perform crack repair or preventative maintenance of various materials and structures, wherein the structures include pipeline, ships, and nuclear reactor containment vessels, wherein ... | 06/05/2007 |
| 7214072 | Pusher of IC chip handler A pusher of an IC chip handler has a pusher frame which is attached to a pusher main body to be driven by the IC chip handler and a plurality of pusher heads attached to the pusher frame. Each of the pusher heads comprises a holder which is held by the pusher frame.... | 05/08/2007 |
| 7159754 | Apparatus and method for corrective soldering The invention relates to a method for soldering an object comprising several soldered joints. The method comprises the steps of mechanically soldering of at least some of the soldered joints, visually assessing the soldered joints, and correctively soldering the vis... | 01/09/2007 |
| 7137544 | Apparatus and method for performing welding at elevated temperature A welding apparatus includes a workpiece housing having a window therethrough and having a welding access therethrough for a welder to an interior of the workpiece housing. The workpiece housing is metallic with a heat insulation on an internal surface thereof. A la... | 11/21/2006 |
| 7135353 | Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables... | 11/14/2006 |
| 7086576 | Machine for constructing the side wall of a cylindrical tank The machine is adapted to supply, manipulate and position steel strip, fed from a coil, so as to bring it into gapped relationship beneath the side wall of a partly constructed, elevated tank. This is done so that the strip can be welded to the side wall to add a co... | 08/08/2006 |
| 7039300 | Identification of electric heater capacity An electric heater is provided with an identifying resistor associated with a connection between the heater and a fan control. When the electric heater is connected to the control, the identifying resistor provides information with regard to the capacity of the part... | 05/02/2006 |
| 7025244 | Electronic component mounting apparatus and electronic component mounting method In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially car... | 04/11/2006 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semico... | 03/21/2006 |
| 7007833 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 03/07/2006 |
| 6993986 | Clamping element with an integrated force sensor A clamping element for the transport of a substrate in a predefined transport direction comprises a first and a second leg with a first and second clamping jaw for clamping a substrate. Each of the two clamping jaws has a clamping plate which is movable in transport... | 02/07/2006 |
| 6983872 | Substrate alignment method and apparatus The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obta... | 01/10/2006 |
| 6983538 | Method of mounting component on a circuit board A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the sol... | 01/10/2006 |
| 6972489 | Flip chip package with thermometer A flip chip package with a thermometer comprises a chip, a substrate, and a thermocouple. The chip has an active surface and a plurality of bumps disposed on the active surface. The substrate defines a region for disposing the chip, and comprises a plurality of bump... | 12/06/2005 |
| 6955284 | Device for positioning a tool in relation to a workpiece The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spat... | 10/18/2005 |
| 6948650 | Dross removal and solder reclamation improvements When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing th... | 09/27/2005 |
| 6935552 | High-precision method and apparatus for evaluating creep damage A high-precision method for evaluating creep damage of high tension heat resistant steel used in high temperature exposed apparatuses involves comparing particle size behavior varying with creep damage progress of crystal grains having a crystal orientation differen... | 08/30/2005 |
| 6913183 | Selective gas knife for wave soldering Selective gas knives for wave soldering provide for targeted gas flow at a particular location on a substrate, such as a printed circuit board. Both the temperature and flow rate of gas through a segment of a gas knife can be independently controlled. ... | 07/05/2005 |
| 6913665 | Method and apparatus for the overlapping welding of sheet-like plastic materials A method for the welding of plastic materials in the form of webs, films or the like by means of a heating wedge, welding being carried out without the use of a second pressure roller below the welded material webs. For this purpose, the heating wedge is placed onto... | 07/05/2005 |
| 6910613 | Device and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 06/28/2005 |
| 6906924 | Temperature-controlled rework system A temperature-controlled rework system comprises a manifold assembly adapted to direct a cooling gas flow toward an area of a printed circuit board adjacent a rework zone to reduce a temperature of the adjacent area to below a temperature of the rework zone. The sys... | 06/14/2005 |
| 6869006 | Amplitude measurement for an ultrasonic horn A method and system for directly measuring and controlling the amplitude of an ultrasonic horn comprising an ultrasonic horn, a non-contact measurement device for directly measuring an amplitude of the ultrasonic horn, and a controller for modulating the amplitude o... | 03/22/2005 |
| 6832714 | Heated filling device A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill ma... | 12/21/2004 |
| 6820792 | Die bonding equipment Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount ... | 11/23/2004 |
