Did You Know...
...that Robert Adler has the dubious distinction of being the Father of the Couch Potato? Back in 1955 Adler was employed by what was then Zenith Radio Corp., where he was charged to invent something that would allow viewers to turn down the TV volume without leaving their chairs. After a series of flops (such as a wired contraption that people tripped over), Adler hit on the idea of using sound waves. Thus the Remote Control was born...
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| Number | Title | Issue Date |
| 7975898 | Joining method and reflow apparatus A joining method includes melting a hot melt joining material provided between a board and a component to be joined to the board; and reducing the pressure of the ambient atmosphere of the hot melt joining material and tilting the board while the hot melt joining ma... | 07/12/2011 |
| 7942305 | Soldering apparatus A soldering apparatus includes a base body, an actuator connected to the base body, and a pair of soldering arms connected to the actuator, each of the pair of soldering arms including a heating member and a soldering tip thermally coupled to the heating member. The... | 05/17/2011 |
| 7597232 | Apparatus for applying conductive paste onto electronic component An apparatus and a method for applying a conductive paste, for forming electrodes, onto an electronic component, such as a micro chip device. The apparatus includes a first jig unit provided with paste holes, which are filled with the conductive paste; and a second ... | 10/06/2009 |
| 7401393 | Method for removing solder bumps from LSI The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on whi... | 07/22/2008 |
| 7370681 | Substrate bonding apparatus for liquid crystal display device A substrate bonding apparatus for fabricating an LCD device aligns upper and lower stages to accurately bond first and second substrates. The distance to which the upper and lower substrates are spaced apart from each other during bonding is adjustable depending on ... | 05/13/2008 |
| 7367486 | System and method for forming solder joints Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/compon... | 05/06/2008 |
| 7364950 | Semiconductor device and method of manufacturing the same A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which electrically connects at least one of the plurality of electrodes and one... | 04/29/2008 |
| 7357288 | Component connecting apparatus When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection... | 04/15/2008 |
| 7337939 | Bonding apparatus A bonding apparatus is constituted by a bonding tool, a substrate stage, a moving mechanism for moving the bonding tool and the substrate stage, an up-and-down mechanism for moving up and down said bonding tool, and a chip recognition camera. The bonding apparatus i... | 03/04/2008 |
| 7320423 | High speed linear and rotary split-axis wire bonder A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portio... | 01/22/2008 |
| 7320424 | Linear split axis wire bonder A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance syst... | 01/22/2008 |
| 7320426 | Cover for ball-grid array connector A presently-preferred embodiment of a cover for a ball-grid array connector comprises a top member and a first and a second side member adjoining opposing ends of the top member. The first and the second side members each have a mating feature formed thereon for eng... | 01/22/2008 |
| 7311239 | Probe attach tool A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the ... | 12/25/2007 |
| 7308999 | Die bonding apparatus A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in wh... | 12/18/2007 |
| 7303647 | Driving mechanism for chip detachment apparatus A driving mechanism and method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism includes a first actuator coupled to the detachment tool and operative to drive the detachment tool t... | 12/04/2007 |
| 7303427 | Electrical connector with air-circulation features A preferred embodiment of an electrical connector includes an electrical conductor for transmitting electrical power, and a housing. The electrical conductor is mounted in the housing so that the housing and the electrical conductor define a channel for circulating ... | 12/04/2007 |
| 7299546 | Method for manufacturing an electronic module An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also ... | 11/27/2007 |
| 7296727 | Apparatus and method for mounting electronic components After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of... | 11/20/2007 |
| 7279358 | Mounting method and mounting device A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclo... | 10/09/2007 |
| 7276396 | Die handling system A system may include singulation of a semiconductor wafer to separate a plurality of integrated circuit die that are integrated into the semiconductor wafer; coupling of a support to an integrated circuit substrate of one of the plurality of integrated circuit die, ... | 10/02/2007 |
| 7255273 | Descriptor for identifying a defective die site The present invention relates to the marking and identification of defective die sites on a mounting substrate. A mounting substrate is provided which is inspected and tested for visual and electrical defects. Information relating to the functionality and/or various... | 08/14/2007 |
| 7238543 | Methods for marking a bare semiconductor die including applying a tape having energy-markable properties A method used for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The present method comprises reducing the cros... | 07/03/2007 |
| 7222773 | Semiconductor bonding apparatus There is disclosed a semiconductor bonding apparatus which mounts a semiconductor chip via an elastic member disposed between the semiconductor chip and a mounting substrate, comprising a holding section which holds the semiconductor chip facing the mounting substra... | 05/29/2007 |
| 7222772 | Flip chip bonder A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a c... | 05/29/2007 |
| 7223238 | Method and device for marking skin during an ultrasound examination A method and device for marking a patient's skin during an ultrasound examination to denote a feature of interest. The device comprises a first portion and a second portion. The first portion is adapted for attachment of the device to an ultrasound transducer. The s... | 05/29/2007 |
| 7210930 | Apparatus and method for curing materials with radiation A hand held dental instrument for curing light-curable compounds comprises a housing and an array of solid state, light emitting junctions or dies for generating light having wavelengths within a narrow band of wavelengths (e.g. 400–500 nm). Preferably, a peak wav... | 05/01/2007 |
| 7146713 | Method of manufacturing a base plate A method for forming a base plate in which the base plate is stamped out of a sheet of metal. One of a relief surface and a boss are formed in the base plate by press working the base plate. ... | 12/12/2006 |
| 7120995 | Apparatus for mounting semiconductors An apparatus for mounting semiconductors contains a bonding station, whereby the bonding station comprises a wafer table for presenting the semiconductor chips, a substrate table and a pick and place system with a bondhead with a chip gripper. Part of the wafer tabl... | 10/17/2006 |
| 7103959 | Conduit for preventing oxidation of a electronic device An apparatus to prevent oxidation of an electronic device, such as a semiconductor substrate during a semiconductor packaging process, comprises a substantially-enclosed conduit having at least one movable support defining a path through which the electronic device ... | 09/12/2006 |
| 7094618 | Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape The present invention provides a method and apparatus for marking a semiconductor wafer or device. The method and apparatus have particular application to wafers or devices which have been subjected to a thinning process, including backgrinding in particular. The pr... | 08/22/2006 |
| 7086145 | Magazine, assembly device for microcomponents The invention relates to an assembly device for microcomponents that are disposed in a magazine. The inventive assembly device does not require any optical systems and allows for an exact positioning of the microcomponents. The assembly will also be unaffected by an... | 08/08/2006 |
| 7070086 | Sensor pre-load and weld fixture apparatus and method A sensor pre-load and welding apparatus and method are disclosed. A weld fixture apparatus includes a fixture base upon which a sensor package having a sensor base and a sensor cover is located, and a load bar associated with a spring, wherein the load bar provides ... | 07/04/2006 |
| 7066733 | Apparatus and method for curing materials with light radiation An instrument and method for curing light-curable compounds in the mouth of a patient, the instrument comprising a housing and a plurality of solid state, light-emitting elements on a substrate supported by the housing. The elements form a collective array on the su... | 06/27/2006 |
| 7059511 | Adjustable force and position pre-load welding fixture A pre-load weld fixture apparatus and method are disclosed, which include a stationary pivot block attached to a base, wherein the stationary pivot block is located adjacent to a nest for maintaining an object to be welded. Additionally a pivot arm is associated wit... | 06/13/2006 |
| 7028397 | Method of attaching a semiconductor chip to a chip mounting substrate A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting substrate positioned on a first supporting device, pressing a semiconductor c... | 04/18/2006 |
| 7014092 | Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semico... | 03/21/2006 |
| 7004371 | Gripper and method for detaching packaged chip from PCB A gripper for detaching a packaged chip from a PCB. The gripper comprises a plurality of hooks, elastic slices, and a heating device. These hooks are used for gripping and hooking the packaged chip. Each hook includes a chip-upholding part and a chip-gripping part, ... | 02/28/2006 |
| 6996484 | Sequential unique marking The present invention comprises a method of sequential unique marking comprising providing a multi-die handling device with a plurality of semiconductor devices therein, reading an ID code on the multi-die handling device, retrieving a tray map file corresponding to... | 02/07/2006 |
| 6966480 | Concave face wire bond capillary and method An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire f... | 11/22/2005 |
| 6939173 | Low cross talk and impedance controlled electrical connector with solder masses An electrical connector, comprising: a dielectric base; a plurality of ground or power contacts in the dielectric base; a plurality of signal contacts in the dielectric base and angled relative to the ground or power contacts; and a plurality of solder balls secured... | 09/06/2005 |
