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| Number | Title | Issue Date |
| 7080771 | Method for checking the quality of a wedge bond A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps: Placin... | 07/25/2006 |
| 6962281 | Bonding apparatus and bonding method having process for judging bonding state In a bonding apparatus having an ultrasonic horn 3 coupled to an ultrasonic vibrator 5 and a bonding tool 4 coupled to the ultrasonic horn 3, and applying ultrasonic bonding to a work 11, by providing an ultrasonic detector 7 | 11/08/2005 |
| 6899264 | Apparatus for producing a sleeve-shaped printing form An apparatus for producing a sleeve-shaped printing form from a plate-shaped blank includes a circular shaping device for the blank, a welding system, by means of which the plate edges forming the start and end of the printing form can be cut to size, maintaining th... | 05/31/2005 |
| 6691908 | Brazing apparatus and brazing method in which the amount of heating is controlled on the basis of temperature of articles to be brazed Articles to be brazed are preheated to an increased temperature in a preheating process and the temperature of the articles to be brazed is measured. Conversion data obtained and stored for different combinations of articles to be brazed is referred to on... | 02/17/2004 |
| 6412682 | Wave soldering method and system used for the method In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth co... | 07/02/2002 |
| 6409069 | Apparatus for manufacturing unit elements for chip components, and chip components mounting structure A chip component is manufactured through a step of burning a unburned unit element made of ceramics having prism-shaped parts at its ends, a step of polishing the edges of the burned unit element, and a step of forming a resistor conductor, an electrode c... | 06/25/2002 |
| 6382497 | Reflow soldering apparatus and method The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a tran... | 05/07/2002 |
| 6273319 | Wave soldering method and system used for the method In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth co... | 08/14/2001 |
| 6172318 | Base for wire bond checking A base mainly includes a heating plate and a probe. The probe is attached to the surface of a heating plate which serves to place a substrate having an ball pad on a lower surface facing the probe of the heating plate. The probe contacts the ball pad of t... | 01/09/2001 |
| 6149047 | Die-bonding machine In a die-bonding machine for picking up a number of semiconductor pellets arranged in the form of a pellet array, one by one, to place a picked-up semiconductor pellet on a predetermined position, when an estimated X-direction coordinate position of the s... | 11/21/2000 |
| 6119915 | Alignment fixture for solder-wave machines An alignment fixture for aligning components of a solder-wave machine during manufacturing processes of PCB assemblies and other electronic devices. In one embodiment, an alignment fixture has a calibration member that is adapted to be positioned at least... | 09/19/2000 |
| 6085960 | Apparatus for measuring the height of a solder wave A solder wave height measuring device is provided that may be constructed using a horizontal supporting member that is positioned on a set of conveyors. Perpendicularly attached to the horizontal supporting member is a graduated beam that slidably support... | 07/11/2000 |
| 6001493 | Substrate for transferring bumps and method of use A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) ... | 12/14/1999 |
| 5992727 | Apparatus for producing a sleeve-type printing form Disclosed is an apparatus for producing a sleeve-type printing form from a plate-shaped blank. The apparatus has a fixing device for fixing the uppermost plate-shaped blank of a stack of blanks as a flat raw form, a curving device for curving the flat raw... | 11/30/1999 |
| 5988482 | Discharge abnormality detection device and method for use in wire bonding apparatus A device and method is available for detecting abnormalities of an electric discharge generated for forming a ball at the end of a bonding wire in a bonding apparatus. A high voltage is applied across the bonding wire and an electrode, and the maximum val... | 11/23/1999 |
| 5979740 | Solder wave height set-up gauge An apparatus for measuring the height of a solder wave having a supporting horizontal member, at least one elongated pin slidably affixed to the horizontal member extending vertically downward. The elongated pins have a sensing means affixed to it and the... | 11/09/1999 |
| 5971247 | Friction stir welding with roller stops for controlling weld depth Stir friction welding is accomplished by applying force to plunge a nonconsumable, rotating welding post into the region to be welded. The rotation creates friction which at least partially melts the material to be welded, as the welding post penetrates. ... | 10/26/1999 |
| 5934543 | Wire bonding capillary having alignment features A capillary (10) is provided for use in wire bonding and may be incorporated into a wire bonding machine. The capillary (10) incorporates one or more indicators (100, 105, 110, 113) which may be positioned about the capillary. For example, the indicators ... | 08/10/1999 |
| 5918793 | Weld test apparatus and method An apparatus and method are available for detecting the presence of inert gas in an enclosure isolating one side of selected weld structures being joined during welding operation. The system and method include using an inert gas detector relying upon an e... | 07/06/1999 |
| 5893508 | Circuit board having a terminal for detecting disconnection of a bonding wire and a wire bonding apparatus using such a board A circuit board for detecting disconnection of a bonding wire, includes a circuit board body; a pattern layer having a die pad region formed on an upper surface of the circuit board body for mounting a semiconductor chip thereon, and respective conductive... | 04/13/1999 |
| 5862974 | Wire bonding method and apparatus This method and apparatus for wire bonding allows easy checking and correction of bonding point coordinates in which upon the registration of the coordinates of fixed points used for alignment in a fixed point standard pattern storage memory and the subse... | 01/26/1999 |
| 5836504 | Method and apparatus for soldering inspection of a surface mounted circuit board It is an object of the present invention to provide a method and an apparatus for soldering inspection of a surface mounted circuit board, which can improve an inspection accuracy by obtaining a highly accurate X-rays transmission image corresponding to a... | 11/17/1998 |
| 5732873 | Magnetic energy monitor for an ultrasonic wirebonder An ultrasonic wirebonder has a horn and a transducer for vibrating the horn at a predetermined frequency. A magnet affixed to the horn generates a magnetic field. A coil coupled to the magnet has an output signal induced from the magnetic field moving rel... | 03/31/1998 |
| 5685571 | Pipe socket A socket accommodates pipes of different wall thicknesses that are to be joined by a fillet weld. The socket has a body with a central opening in one face. The face includes a series of physical indicators each of which are spaced from the opening a dista... | 11/11/1997 |
| 5676302 | Method and apparatus for crescent boundary thresholding on wire-bonded leads Method and apparatus for selecting a threshold for use by a boundary tracker to locate a crescent on a bonded lead involves creating a two-dimensional inspection window along the angle of the wire in a post-bond image of a bonded wire in order to generate... | 10/14/1997 |
| 5617988 | Device for measuring the height of a solder wave The invention relates to a device for measuring the height of a solder wave in a soldering apparatus which comprises a solder bath and which is provided with at least one solder tower for generating a solder wave and a pump connected to the solder tower, ... | 04/08/1997 |
| 5615823 | Soldering ball mounting apparatus and method In a soldering ball mounting apparatus, a pickup head is movable between a soldering ball feeder and a workpiece to be mounted with soldering balls. The pickup head has a bottom formed with a large number of absorber holes for vacuum-absorbing the solderi... | 04/01/1997 |
| 5603446 | Bonding apparatus A bonding apparatus which includes a function of adjusting the height level of an upper limit of a bonding stage including a standard stroke cam which raises and lowers the bonding stage, a cam holder which rotatably supports one end of the standard strok... | 02/18/1997 |
| 5537876 | Apparatus and method for nondestructive evaluation of butt welds Apparatus and method for nondestructive evaluation of butt welds. The present invention in its broadest form includes an apparatus and method for detecting flaws in butt welds in steel sheets using horizontal shear ultrasonic waves generated on the surfac... | 07/23/1996 |
| 5533663 | Solder wave measurement device In a wave solder manufacturing process, a test device is used to measure the contact-area between a solder wave and a printed wiring board. In particular, the test device is a printed wiring board (PWB) that includes at least two arrays of electrical cont... | 07/09/1996 |
| 5516028 | Process and system for temperature control and in-line testing of electronic, electromechanical and mechanical modules A process and system exists for temperature control and testing of modules, such as printed circuit boards, with fitted electronic, electromechanical and mechanical components or individual components, wherein the modules are subjected, following assembly... | 05/14/1996 |
| 5494206 | Wire bonding method and apparatus A proper replacement time to exchange a used bonding tool with a new one in a wire bonder is accomplished by a method and apparatus that includes a contact detector which detects the bonding tool contacting a bonding surface, a counter which counts the nu... | 02/27/1996 |
| 5472133 | Soldering iron rack with a power saving control A soldering iron rack including a base having an upright support, an electric soldering iron, a holder mounted on the upright support and having a heat-insulative barrel on the inside for holding the electric soldering iron, and a control circuit to detec... | 12/05/1995 |
| 5447264 | Recessed via apparatus for testing, burn-in, and/or programming of integrated circuit chips, and for placing solder bumps thereon A temporary substrate for solder bumps may be used to transfer solder bumps to a microelectronic device. The temporary substrate includes a solder nonwettable surface and a plurality of conductive vias therein. A solder bump is formed on each of the condu... | 09/05/1995 |
| 5439157 | Automated butt weld inspection system An automated system for non-destructive inspection of a weld through the use of ultrasonic waves produced by an electromagnetic acoustic transducer (EMAT). The system includes: a computer control unit; a transport apparatus having a first EMAT for produci... | 08/08/1995 |
| 5435477 | Wire clampers A wire clamper used in a wire bonding apparatus including a pair of open/close clamping arms and a pair of clamping elements provided at terminal ends of the clamping arms so as to clamp a bonding wire in between, and at least one of the clamper arms is o... | 07/25/1995 |
| 5388468 | Solder wave parameters analyzer An indicator of solder wave soldering parameters includes a simulating board (10) of electrically insulating material provided with a plurality of electrical contact elements (11A, 11B . . . 18A, 18B) which are located on a first surface of the board (10)... | 02/14/1995 |
| 5377894 | Wire bonder system A wire bonder system comprising mounting a tool for ultrasonic bonding onto a transducer and the tool is protruded from the transducer with its bonding side to supply the high frequency electric power to the transducer. The protruded length of the tool is... | 01/03/1995 |
| 5361963 | Dispenser A dispenser for applying creamy solder onto a substrate, comprising: a syringe 1 storing therein creamy solder; a needle 2 fixed at the forward end of this syringe 1; and a driving mechanism 3 using a pulse-controlled stepping motor and an eccentrically r... | 11/08/1994 |
| 5340011 | Adjustable height work holder for bonding semiconductor dies In a semiconductor wire bonder, the need for frequently changing chucks and re-focusing optical equipment for each different die/package thickness combination is alleviated by providing an adjustable stop mechanism lifting the upward displacement of the d... | 08/23/1994 |
