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| Number | Title | Issue Date |
| 8186564 | Brazing preform manufacture A method and apparatus for forming a brazing preform. The preform is made utilizing a brazing preform member having a first shaped end and a second shaped end. The first and second shaped ends are mated in a friction fit without any welding to provide the brazing pr... | 05/29/2012 |
| 8061578 | Solder preform A solder preform has gaps extending from the boundary of preform towards the preform center. During reflow soldering, the gaps close from the center towards the boundary. This allows flux and gasses to escape the interface between the solder and the substrate. Parti... | 11/22/2011 |
| 8020745 | Solder ball An object of the present invention is to improve a yield of electronic devices in a ball mounting process by preventing a micro-bonding and change in color of the solder balls, and to improve a bonding reliability of the solder balls by reducing an oxide film on a s... | 09/20/2011 |
| 7946467 | Braze material and processes for making and using A braze material and processes for making and using the material, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material is composed of particles with melt-modifying constituents that are limited to the surfa... | 05/24/2011 |
| 7857189 | Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one... | 12/28/2010 |
| 7780058 | Braided solder Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder compositio... | 08/24/2010 |
| 7775414 | Consumable insert and method of using the same A consumable insert (10) formed of material particles (14) contained within a sheath (12). The particles may be a melting point depressant that has a concentration that is greater in a center region (16) of the insert than in the surface ... | 08/17/2010 |
| 7690551 | Die attach by temperature gradient lead free soft solder metal sheet or film A die attach process employs a temperature gradient lead free soft solder metal sheet or thin film as the die attach material. The sheet or thin film is formed to a uniform thickness and has a heat vaporizable polymer adhesive layer on one surface, by which the thin... | 04/06/2010 |
| 7681777 | Solder paste and printed circuit board In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the compositi... | 03/23/2010 |
| 7533793 | Solder preforms for use in electronic assembly A solder preform for use to attach an electronic component to a substrate. The preform is for placement by a pick-and-place machine using a vacuum nozzle which picks the preform from a preform holder. Each of the sides of the preform configured to function as a vacu... | 05/19/2009 |
| 7527187 | Titanium braze foil The present invention provides a braze foil comprising titanium and zirconium layers covered by one or more layers of copper, nickel or an alloy of copper and nickel such that neither the zirconium or titanium layers are exposed to the atmosphere. The braze foil may... | 05/05/2009 |
| 7461770 | Copper-based brazing alloy and brazing process The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to 5.0 atom % of zinc, 6 to 16 atom % of phosphorus, remainder copper an... | 12/09/2008 |
| 7451906 | Products for use in low temperature fluxless brazing A brazing product for low temperature fluxless brazing comprises a filler metal-forming composition which melts in the range from about 380-575° C. The filler metal-forming composition comprises zinc optionally in combination with aluminum and/or silicon, and furth... | 11/18/2008 |
| 7434720 | Gold/nickel/copper/titanium brazing alloys for brazing WC-Co to titanium alloys A brazing material including about 20 to about 60 percent by weight gold, about 6 to about 16 percent by weight nickel, about 16 to about 60 percent by weight copper and about 6 to about 16 percent by weight titanium. ... | 10/14/2008 |
| 7422721 | Lead-free solder and soldered article A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn.... | 09/09/2008 |
| 7422141 | Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale In one embodiment, a solder preform includes a solder matrix having microparticles secured with the solder matrix. The microparticles are constructed so as to be capable of arranging during a solder bonding process so as to provide a uniform separation between oppos... | 09/09/2008 |
| 7410088 | Solder preform for low heat stress laser solder attachment A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, t... | 08/12/2008 |
| 7407713 | Simultaneous multi-alloy casting A method of casting a multi-layered metal ingot including the steps of delivering a metallic divider member into a direct chill mold, pouring a first molten metal into the mold on one side of the divider member, and pouring a second molten metal into the mold on the... | 08/05/2008 |
| 7387230 | Brazing filter metal sheet and method for production thereof In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form the brazing filler metal composition. By powder roll compaction of the ... | 06/17/2008 |
| 7363705 | Method of making a contact Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 04/29/2008 |
| 7357291 | Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ... | 04/15/2008 |
| 7353978 | Method of making tailored blanks using linear friction welding A method of making tailored blanks in accordance with one embodiment comprises the steps of friction welding a first joining surface of a first structural member having a substantially non-rectangular parallelogram profile to a first portion of a joining surface of ... | 04/08/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7349223 | Enhanced compliant probe card systems having improved planarity Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more ... | 03/25/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7342409 | System for testing semiconductor components A system for testing semiconductor components includes an interconnect, an alignment system for aligning a substrate to the interconnect, a bonding system for bonding the component to the interconnect, and a heating system for heating the component and the interconn... | 03/11/2008 |
| 7337941 | Flux coated brazing sheet A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required,... | 03/04/2008 |
| 7335517 | Multichip semiconductor device, chip therefor and method of formation thereof A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the c... | 02/26/2008 |
| 7331503 | Solder printing process to reduce void formation in a microvia In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the seco... | 02/19/2008 |
| 7331498 | Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature... | 02/19/2008 |
| 7319265 | Semiconductor chip assembly with precision-formed metal pillar A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The metal ... | 01/15/2008 |
| 7318547 | Method for assembling parts made of materials based on SiC by non-reactive refractory brazing, brazing composition, and joint and assembly obtained by said method Method for assembling at least two pieces of silicon carbide based materials by non reactive refractory brazing, wherein these pieces are put into contact with a non reactive brazing solder composition and the assembly formed by the pieces and the brazing solder com... | 01/15/2008 |
| 7293688 | Gold/nickel/copper/aluminum/silver brazing alloys for brazing WC-Co to titanium alloys A brazing material including about 2 to about 30 percent by weight gold, about 4 to about 14 percent by weight nickel, about 25 to about 65 percent by weight copper, about 1 to about 3 percent by weight aluminum and about 20 to about 55 percent by weight silver.... | 11/13/2007 |
| 7291549 | Method and structure to reduce risk of gold embrittlement in solder joints A method for reducing gold embrittlement in solder joints, and a copper-bearing solder according to the method, are disclosed. Embodiments of the invention comprise adding copper to non-copper based solder, such as tin-lead solder. The embodiments may further compri... | 11/06/2007 |
| 7282932 | Compliant contact pin assembly, card system and methods thereof A compliant contact pin assembly, a contactor card, a testing system and methods for making and testing are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within ... | 10/16/2007 |
| 7276296 | Immersion plating and plated structures A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boilin... | 10/02/2007 |
| 7273812 | Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may b... | 09/25/2007 |
| 7268421 | Semiconductor chip assembly with welded metal pillar that includes enlarged ball bond A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line and a metal pillar, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The chip a... | 09/11/2007 |
| 7264991 | Method of connecting a conductive trace to a semiconductor chip using conductive adhesive A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanical... | 09/04/2007 |
| 7262082 | Method of making a three-dimensional stacked semiconductor package with a metal pillar and a conductive interconnect in an encapsulant aperture A method of making a three-dimensional stacked semiconductor package includes providing a first semiconductor chip assembly that includes a first chip, a first conductive trace and a first encapsulant, wherein the first conductive trace includes a first metal pillar... | 08/28/2007 |
