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3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 7648056 | Selective soldering bath A solder machine uses various linear actuators to move a PWB carrier in three degrees of freedom relative to a solder bath, to facilitate safe loading and unloading of PWBs onto the carrier while the carrier is distanced from the bath, and then to move the carrier o... | 01/19/2010 |
| 7392926 | Electrically-controlled soldering pot apparatus An electrically-controlled soldering pot apparatus with a timer control mechanism and a temperature control mechanism; a method of alerting a user when to exchange a solder bath of the apparatus before erosion to the solder bath occurs; and a method of varying the h... | 07/01/2008 |
| 7331498 | Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature... | 02/19/2008 |
| 7311241 | Method of mounting terminal on printed board, terminal mounted printed board and electric connection box accommodating the terminal mounted printed board, which are formed by the method A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing nozzles are shielded by shield jigs, solder jetted from the solder blowin... | 12/25/2007 |
| 7048173 | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate fro... | 05/23/2006 |
| 6957004 | Passive connectivity of waveguides for optical components A packaged waveguide for passive connectivity includes waveguides packaged in a ferrule. The ferrule allows the waveguides to be passively aligned to other waveguides, fibers, or optical components, such as to align a first waveguide in the ferrule with a laser diod... | 10/18/2005 |
| 6742693 | Solder bath with rotatable nozzle A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mo... | 06/01/2004 |
| 6705506 | Inert atmosphere soldering apparatus A printed circuit board soldering process where a number of pockets containing solder are filled to overflowing with solder and then raised to immerse the terminals to be soldered. The solder pot and the pockets are protected by an atmosphere of hot inert gas introd... | 03/16/2004 |
| 6648214 | Method for partially or completely coating the surfaces of components produced from aluminum or its alloys with solders, fluxing agents or binders for brazing In a method for partial or complete coating of surfaces of components of aluminum and its alloys with a uniform layer of homogeneously distributed solder, fluxing agent and binder for brazing of the components to one another, the solder, fluxing agent and... | 11/18/2003 |
| 6581818 | Trough device in a soldering furnace A trough device in a soldering furnace comprises a motor, a soldering pot, support device, a trough part and transmission device. The support device connects with a fixing base of the motor via a micro adjustment device and an inclinometer for adjusting a... | 06/24/2003 |
| 6578752 | Method and apparatus for separating dross floating on solder A method for separating dross floating on solder into solder and a residue, comprising of repeatedly cutting through the dross with at least one knife extending substantially parallel to the direction of movement and removing the residue from the solder. ... | 06/17/2003 |
| 6499650 | Solder dross removal apparatus and method An apparatus and method for recovering solder from dross present on the surface of a molten solder includes a solder reservoir for holding a pool of molten solder, and a solder nozzle disposed in the solder reservoir and adapted to direct a solder wave ag... | 12/31/2002 |
| 6316125 | Aluminum welding process and composition for use in same The invention provides a new and improved process and exothermic reaction mixture for producing molten weld metal. The molten weld metal is used in joining one metallic piece with at least one other metallic piece. The process and exothermic reaction mixt... | 11/13/2001 |
| 6250537 | Self-cleaning soldering thimble assembly A self-cleaning soldering thimble assembly includes a thimble and a scraper disposed therein. The scraper is supported by two support rods that extend through the bottom of the thimble. The thimble slides along the support rods. When the thimble is dipped... | 06/26/2001 |
| 6123251 | Apparatus and method for soldering A solder head is adapted to direct the flow of solder from a solder fountain. The solder head includes a wall forming a passage through which solder can flow upwardly and having an edge portion over which solder can flow from the passage. The solder head ... | 09/26/2000 |
| 5860582 | Inert atmosphere soldering apparatus An inert atmosphere spot soldering process and apparatus uses pockets arranged to match the arrangement of the terminals to be soldered. The pockets are filled to over flowing with liquid solder by lowering the pockets below the surface of the molten sold... | 01/19/1999 |
| 5740954 | Apparatus for attaching/detaching a land grid array component to a circuit board A system is provided for selectively attaching or detaching a land grid array component to a surface of circuit board where the attachment is a grid array of solid conductive solder beads or balls. A chamber contains an inert liquid, and a heater heats th... | 04/21/1998 |
| 5372293 | Apparatus for degolding or tinning conductive portions of a microelectronic device The apparatus is used for processing a microelectronic device having a face with electrically conductive elements arranged thereon. The apparatus comprises a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device h... | 12/13/1994 |
| 5340013 | Rework process for printed circuit cards and solder fountain having gas blanket for carrying out the process Disclosed is a solder tool for reworking a pin-in-hole printed circuit board. The solder tool has means for providing a gas blanket. Also disclosed is a method of reworking a pin-in-hole printed circuit board using the solder tool.... | 08/23/1994 |
| 5335843 | Soldering process and apparatus A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junc... | 08/09/1994 |
| 5229562 | Process for consolidation of composite materials A process for consolidating a composite material comprising the steps of forming a workpiece including a matrix interspersed with fibers, supporting the workpiece by an electrically conductive support, inductively heating the support and thereby conductiv... | 07/20/1993 |
| 5203489 | Gas shrouded wave soldering A cover plate extends over a solder reservoir and has a slot for a solder wave to extend up above the plate, a gas excluding oxygen is supplied under the cover plate and flows up through the slot on both sides of the solder wave to blanket the solder wave... | 04/20/1993 |
| 5024366 | Desoldering vat A desoldering vat has a central, elongated solder pot which is filled to the brim with solder in use, so that depending component contact pins inserted through and soldered to a circuit board can be immersed in the meniscus of the liquid solder mass to me... | 06/18/1991 |
| 4979662 | Desoldering vat A desoldering vat includes a narrow, elongated, solder pot filled with liquid solder which actually extends slightly above the pot due to the meniscus, and is used to desolder the multiple pins of electronic components, especially elongated components suc... | 12/25/1990 |
| 4942997 | Solder flow well for reflowing solder of multipin components A solder well configured to abut and enclose the though hole pattern on a printed circuit board to allow the reflow of solder and removal of a multipin electronic component without affecting the integrity of adjacent solder joints of components disposed w... | 07/24/1990 |
| 4932585 | Method and apparatus for solder plating an object A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable material having an inclined upper surface is placed in a ... | 06/12/1990 |
| 4831724 | Apparatus and method for aligning surface mountable electronic components on printed circuit board pads A method and apparatus are described for precisely centering the leads of surface mountable electronic components on the pads of a printed circuit board. The method includes coating the pads with solder, placing the leads of the components on the solder c... | 05/23/1989 |
| 4759491 | Method and apparatus for applying bonding material to component leads A controlled amount of a solder is applied to the tip (18) of each lead (14) of a multi-lead component (10) by first placing a solder sphere (30) in each of a plurality of cavities (24) arranged in a baseplate (22) in the same pattern as the tips of the l... | 07/26/1988 |
| 4722470 | Method and transfer plate for applying solder to component leads A method and a solder transfer member for applying discrete bodies of solder of predetermined size to the leads of a component for subsequent surface mounting to a substrate. The transfer member is a plate having a non-wetted surface, for example titanium... | 02/02/1988 |
| 4666077 | Solder pot for wave soldering machine Automatic wave solder apparatus in which printed circuit boards are passed over a wave soldering section to apply solder to exposed metallic surfaces on the undersides of the surface of the board. A weir is attached to the exit side of a discharge nozzle ... | 05/19/1987 |
| 4659002 | Apparatus for replacement of through-hole mounted PCB components An apparatus is disclosed for removing or installing at least one through-hole mounted component from a printed circuit board or the like, the apparatus including a compliant mask for contacting and supporting the printed circuit board with the mask havin... | 04/21/1987 |
| 4651916 | Soldering apparatus A soldering apparatus comprises a solder bath, an applicator for applying solder to a joint or the like to be soldered and a pump for pumping solder substantially continuously through the applicator. The applicator is movable vertically relative to the so... | 03/24/1987 |
| 4616775 | Translatable soldering machine Wave soldering machine of the type comprising a frame, at least one solder pot mounted on the frame and equipped with a nozzle designed to produce a wave of solder, a conveyor mounted on the frame and designed to carry the printed circuit boards along a s... | 10/14/1986 |
| 4602730 | Device for soldering printed board Device for soldering a printed board, equipped with a printed substrate conveyor, which effects soldering of chip parts on a printed substrate by moving the printed substrate through a molten solder wave formed by providing a nozzle in a solder tank accom... | 07/29/1986 |
| 4586252 | Tool for removing soldered components Apparatus is presented for removing a faulty component from a printed circuit board when attachment is by a plurality of input/output pins that extend outwardly from the component and protrude through holes in the printed circuit board where they are then... | 05/06/1986 |
| 4583673 | Apparatus for soldering the winding to the commutator of an electric machine Apparatus for soldering the winding to the commutator of a rotor of great weight of an electric machine. The apparatus has a vessel containing a bath of molten solder and electric resistance heaters, a single-phase magneto-hydrodynamic pump consisting of ... | 04/22/1986 |
| 4569473 | Apparatus for and method of desoldering and removing an integrated circuit from a mounting member and for cleaning the same Apparatus for and method of desoldering and removing a soldered together integrated circuit from a mounting member and for cleaning the same in which the integrated circuit and the mounting member are placed in tension in preparation of separating the sam... | 02/11/1986 |
| 4562337 | Solder pot An electrical solder pot has a base with a hollow interior. A housing member also having a hollow interior attaches to the top of the base. The housing member further includes an opening at its top. A threaded socket is fitted in the base so as to accept ... | 12/31/1985 |
| 4560100 | Automated soldering process and apparatus An automated discreet soldering system for plated holes of a printed wiring board, having a free piston type crucible mode of graphitic material, which is propelled along a guided path by pressurized nitrogen. A laser beam is directed along a path substan... | 12/24/1985 |
| 4555054 | Process and apparatus for fabricating optical fiber cables A process and apparatus for fabricating an optical fiber communication cable are described herein. The optical fiber cable has a cable core including a metal containment tube and at least one optical fiber within the tube. The containment tube preferably ... | 11/26/1985 |
