Did You Know...
...that in the early 1940s GE engineer James Wright was charged with a task of utmost importance to the war effort: develop a cheap substitute for rubber that could be used to produce tires, gas masks and a whole host of military gear. Wright tackled the task diligently -- and wound up inventing Silly Putty.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7441687 | Desoldering sheath The present invention provides a desoldering sheath and a method for making the same. The desoldering sheath is comprised of multiple metal ropes that are each made from two or more fine-gauge wire threads. The metal ropes are woven together to form a metal fabric t... | 10/28/2008 |
| 7360675 | Wire bonder for ball bonding insulated wire and method of using same An electrical contact device is provided for electrically grounding an uninsulated end-portion of insulated wire stored on a spool driven by a device comprises the following. An electrical connector fixes to the spool and is configured to receive an electrical conne... | 04/22/2008 |
| 7320425 | Low-profile capillary for wire bonding A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less tha... | 01/22/2008 |
| 7291809 | Soldering iron and method of manufacturing same A soldering iron provided with a soldering tip that melts solder at a distal end, having inside said soldering tip a substantially cylindrical insertion fit recess portion extending from a proximal end of the soldering tip to the distal end, opening at the proximal ... | 11/06/2007 |
| 7249702 | Multi-part capillary A bonding tool for bonding a wire to a substrate. The bonding tool has a cylindrical body portion formed from a first material and a conical tip portion separately formed from a second material. The conical tip portion is coupled to one end of the body portion. ... | 07/31/2007 |
| 7175687 | Advanced erosion-corrosion resistant boride cermets A cermet composition represented by the formula (PQ)(RS) comprising: a ceramic phase (PQ) and binder phase (RS) wherein, P is at least one metal selected from the group consisting of Group IV, Group V, Group VI elements, Q is boride, ... | 02/13/2007 |
| 7175686 | Erosion-corrosion resistant nitride cermets The invention includes a cermet composition represented by the formula (PQ)(RS) comprising: a ceramic phase (PQ) and a binder phase (RS) wherein, P is a metal selected from the group consisting of Si, Mn, Fe, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W and mixture... | 02/13/2007 |
| 7160797 | Method of bumping die pads for wafer testing A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads... | 01/09/2007 |
| 7074253 | Advanced erosion resistant carbide cermets with superior high temperature corrosion resistance Cermets are provided in which a substantially stoichiometric metal carbide ceramic phase along with a reprecipitated metal carbide phase, represented by the formula MxCy, is dispersed in a metal binder phase. In MxCy M is ... | 07/11/2006 |
| 7030339 | Soldering iron tip with metal particle sintered member connected to heat conducting core A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, ... | 04/18/2006 |
| 6818862 | Iron tip and electric soldering iron In an iron tip for a soldering iron, composed of Fe plated copper or copper alloy, an outer surface excluding a solder coating portion in a leading end portion of the iron tip is plated with Cu in a film thickness range of approximately 10 to 50 μm, the surface is ... | 11/16/2004 |
| 6629631 | Solder iron pressure monitor and method of using same in manufacturing a cathode ray tube A pressure gauge or monitor is attached to a soldering iron so that the pressure with which the iron is being applied can be precisely monitored. Such a pressure monitor on a soldering iron can be used to monitor the pressure applied with the soldering ir... | 10/07/2003 |
| 6523732 | Ultrasonic welding apparatus An apparatus for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode tip has a specific surface configuration, including a curvilinear shaped outer surface combined with a plurality of gro... | 02/25/2003 |
| 6386423 | Soldering iron tips A technique for producing soldering iron tips entails cutting clad wire into a plurality of segments, each segment comprising a core of material (such as copper) and an outer protective layer (such as stainless steel, Ni, Cr, or alloy thereof). Each clad ... | 05/14/2002 |
| 6171456 | Method for making improved long life bonding tools The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the semiconductor industry to make fine wire or TAB finger inte... | 01/09/2001 |
| 6119927 | Method and apparatus for placing and attaching solder balls to substrates A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pat... | 09/19/2000 |
| 6039237 | Heating tip and method of manufacturing the same A heating tip in which an insertion cavity is formed in a tip substrate made of copper or copper alloy for insertion and containment of a heat generating portion, wherein the inner circumferential wall surface of the insertion cavity is formed by forging ... | 03/21/2000 |
| 6019270 | Soldering iron tip A soldering iron tip includes a removable Invar shield covering a copper core plated with other metals. In one embodiment, the core is plated with iron and, outside a working section of the tip, with nickel and chrome. In another embodiment, the core is p... | 02/01/2000 |
| 6006979 | Method of bonding a diamond substrate to at least one metal substrate The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of al... | 12/28/1999 |
| 5934542 | High strength bonding tool and a process for production of the same The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting... | 08/10/1999 |
| 5931368 | Long life bonding tool The present invention relates to post manufacturing operations for improving the working life of known bonding tools such as capillaries, wedges and single point TAB tools of the type used in the semiconductor industry to make fine wire or TAB finger inte... | 08/03/1999 |
| 5901898 | System for removing solder The misapplication or misplacement of solder bumps on chips and/or circuit boards presents financially significant waste and cost efficiency problems in the manufacture of electronic components. The present invention describes an article and a process for... | 05/11/1999 |
| 5653376 | High strength bonding tool and a process for the production of the same The present invention provides a thermocompression tool, i.e. high strength bonding tool used for mounting a semiconductor device or element such as IC, LSI, etc. on a substrate, for example, a tool of pulse heating type used for soldering, and a mounting... | 08/05/1997 |
| 5618456 | Improvement of surface property of tip and nozzle for gas welder made of copper and copper alloys by chemical conversion coating treatment A method for improving the tip and nozzle of a gas welder in which a conventional or new surface oxidation chemical treatment was applied to improve the surface properties of the tip and nozzle of a gas welder made of copper or copper alloys. Continuous w... | 04/08/1997 |
| 5569400 | Soldering gun with U-shaped insertable terminal structure and tip having differing impedance layers A solder gun or soldering iron contains a pair of electrical terminals that hold a solder tip containing a pair of straight parallel leads. Each lead has a substantially U-shaped cross-section that creates a circular cavity filled which is filled with an ... | 10/29/1996 |
| 5553767 | Soldering iron tip made from a copper/iron alloy composite A soldering tip comprising 50-95 weight percent uncoated copper particles and 5-50 weight percent iron particles is prepared by a method in which the particles are compacted, sintered and shaped into a soldering tip. The soldering tips are durable, resist... | 09/10/1996 |
| 5516027 | Bonding tool having a diamond head and method of manufacturing the same A bonding tool has a head portion made essentially of vapor-deposited diamond, wherein a principal diamond crystal plane forming a head face is a (111) plane. Such a head face has high hardness and a good wear resistance. In order to improve the toughness... | 05/14/1996 |
| 5379512 | Method for bonding a flexible cable to an electrical component A method for bonding the ends of the conductors 52 to circuit pads 54 is disclosed whereby the cable 20 is placed over the circuit pads 54; a bonding tool 44 is pressed against an upper surface 58 of the cable 20; the substrate 46 of the cable 20 is compr... | 01/10/1995 |
| 5370299 | Bonding tool having diamond head and method of manufacturing the same A bonding tool has a head portion made essentially of vapor-deposited diamond, wherein a principal diamond crystal plane forming a head face is a (111) plane. Such a head face has high hardness and a good wear resistance. In order to improve the toughness... | 12/06/1994 |
| 5332144 | Concave soldering iron tip and method of soldering using same In accordance with a preferred embodiment of the present invention, a concavity of an elliptical shape is formed in a chisel-shaped soldering tip to create a reservoir in which a quantity of molten solder is retained by surface tension. In a preferred met... | 07/26/1994 |
| 5248076 | Soldering tool A soldering tool comprises a handle (10) and a rod-shaped or tubular heating element fastened to the front end of the handle. A soldering tip (4) can be placed on the free end of the heating element. The soldering tip (4) has a borehole for receiving the ... | 09/28/1993 |
| 5215241 | Composite soldering iron tip using heat of fusion Latent heat of fusion is used to store and extract a relatively large quantity of temperature controlled heat from the small volume of a soldering iron tip. This is accomplished by fabricating the tip from a composite material comprised of a porous metal ... | 06/01/1993 |
| 5213248 | Bonding tool and its fabrication The disclosure is directed to a bonding tool for use primarily in thermo-compression bonding of electronic circuit components and to a method of making the bonding tool. In one form of the disclosure, a holder is provided and has a substrate mounted at an... | 05/25/1993 |
| 5197651 | Bonding tool A bonding tool for TAB, used in the production of semiconductor chips, which is provided with, at the end thereof, a substrate consisting of a member selected from the group consisting of sintered compacts of Si or Si3 N4 as a predom... | 03/30/1993 |
| 5109147 | Soldering tip for magnetic wire hookup A small solder tip, which advantageously allows for the rapid production of reliable solder joints without the addition of extra solder, flux or striping the insulation on the wire. The solder tip is preferably formed of tungsten carbide and is used in co... | 04/28/1992 |
| 5082160 | Apparatus and process for ultrasonic seam welding stainless steel foils An ultrasonic seam welding apparatus having a head which is rotated to form contact, preferably rolling contact, between a metallurgically inert coated surface of the head and an outside foil of a plurality of layered foils or work materials. The head is ... | 01/21/1992 |
| 4997121 | Nozzle of solder suction device A nozzle of a solder suction device maintaining wettability with solder, excellent in corrosion resistance and heat transfer property, and optimal for solder removal work of electronic components such as integrated circuits. It is composed of a nozzle bas... | 03/05/1991 |
| 4974768 | Soldering iron tip A soldering iron tip comprises a coating layer of amorphous metal satisfactory in wettability in molten solder formed on the leading end part thereof. A soldering iron tip may comprise a coating layer of amorphous metal low in wettability in molten solder... | 12/04/1990 |
| 4962878 | Desoldering aid A technique is provided for desoldering circuit components employing a desoldering aid that fits like a cap on a standard size rectangular circuit component. The aid has a rectangular top of high thermal conductivity metal substantially the same size as t... | 10/16/1990 |
| 4830260 | Soldering iron tip A soldering iron tip comprises a copper body with a layer of glass bonded on the surface. The portion of the body used for melting solder is not coated. The glass is opaque to infrared, has high, uniform and stable emissivity, helps prevent oxidation, lim... | 05/16/1989 |
