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| Number | Title | Issue Date |
| 8074863 | Sealing device for heat sealing foil material The invention relates to a device for heat sealing two layers of foil material. To that end, the device comprises two blocks arranged opposite each other and conveying means for guiding the foil material between these blocks. Between the blocks, at least one heating... | 12/13/2011 |
| 7882997 | Method and device for mutual contacting of two wafers A method and a device for the mutual contacting of two wafer-type component composite configurations made of multiple identical components which are implemented coherently, in particular a semiconductor wafer (12) with a functional component wafer (14)... | 02/08/2011 |
| 7703657 | Device for mounting electric component A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive ... | 04/27/2010 |
| 7533792 | Elastic interface for wafer bonding apparatus An apparatus for bonding a lid wafer to a device wafer includes an elastic interface having a first surface and a second surface. Relieved areas may be created in the elastic interface by removing at least some of the elastic material of the interface, leaving a mes... | 05/19/2009 |
| 7357288 | Component connecting apparatus When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection... | 04/15/2008 |
| 7342402 | Method of probing a device using captured image of probe structure in which probe tips comprise alignment features An image of an array of probes is searched for alignment features. The alignment features are then used to bring contact targets and the probes into contact with one another. The alignment features may be a feature of one or more of the tips of the probes. For examp... | 03/11/2008 |
| 7303640 | Orientation equipment with multiple PCBS An orientation equipment with multiple PCBs adapted for a SMT line has a rack module including a casing mounting a front of the SMT line; a visual orientation module having a visual orientation camera used for recognizing the PCB; a movable arm module capable of lat... | 12/04/2007 |
| 7286371 | Attaching heat sinks to printed circuit boards using preloaded spring assemblies An integrated circuit assembly including a heat sink, a socket, a printed circuit board and a chassis to be held together under spring bias. The assembly may be secured together with less than 2 mm spanning between a printed circuit board and a chassis. ... | 10/23/2007 |
| 7231112 | Solder seals within a switching system A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder. ... | 06/12/2007 |
| 7219824 | Mechanism and process for compressing chips A chip compressing mechanism is provided. The chip compressing mechanism essentially comprises a loading component, a head component and a gimbal. The head component is disposed under the loading component, with a gap in-between. The gimbal is disposed between the l... | 05/22/2007 |
| 7121199 | Method and apparatus for supporting and clamping a substrate A stencil printer for printing viscous material on a substrate includes a frame, a stencil coupled to the frame, and a print head, coupled for the frame, to deposit and print viscous material over the stencil. The stencil printer further includes a substrate support... | 10/17/2006 |
| 7074112 | Apparatus that holds and tilts a tool The invention provides an apparatus that holds and tilts a tool over a tilt range and substantially about a vertex. The apparatus includes a base having pivots defining a base line and a base pivot distance. The apparatus also includes first and second pivot arms co... | 07/11/2006 |
| 7048174 | Adaptable spring force clamping apparatus and methods Adaptable spring force clamping apparatus and methods are disclosed. In one embodiment, an apparatus includes at least one elongated member adapted to be positioned proximate to a surface of a work piece. The elongated member includes first and second end portions a... | 05/23/2006 |
| 7045388 | Semiconductor device provided with low melting point metal bumps A semiconductor device (1) comprising electrodes formed on a semiconductor chip (2) and bumps (3) which consist of a low melting point metal ball spherically formed and having a given size and which are adhesive bonded to the electrodes (5 | 05/16/2006 |
| 7028391 | Method and apparatus for supporting a substrate An apparatus for performing operations on at least one surface of an electronic substrate having a first surface and a second surface includes a frame, a transportation system that moves the substrate through the apparatus, a substrate support system, coupled to the... | 04/18/2006 |
| 7008483 | Curing printed circuit board coatings A method for curing a layer of liquid coating applied to surfaces of a printed circuit board is disclosed. The method comprises exposing the layer of liquid coating to a curing agent; and manipulating the printed circuit board during the exposure so as to prevent th... | 03/07/2006 |
| 6922294 | Optical communication assembly An optical assembly comprising an optical cube. A first optical transmitter chip and a first optical receiver chip are mounted on one surface of the optical cube. A first continuous printed circuit board is soldered to electrical surfaces of the first optical transm... | 07/26/2005 |
| 6915940 | Device for applying solder globules An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposit... | 07/12/2005 |
| 6880742 | Separating seam welding device Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), | 04/19/2005 |
| 6877650 | Compliant wirebond pedestal A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electr... | 04/12/2005 |
| 6779703 | Method and device for pressing workpiece A pressing device including a platen for pressing a workpiece is provided, which has a pressing plate provided between the platen and the workpiece to press the workpiece instead of the platen when the platen is moved toward the workpiece, and a liquid layer formed ... | 08/24/2004 |
| 6742695 | Soldering machine for tape carrier package outer leads A soldering machine for tape carrier package. The soldering machine includes a cylinder, a linking rod, a cushioning pad, a floating connector and a press head assembly. The cylinder has a first end and a second end. The linking rod passes through the interior of th... | 06/01/2004 |
| 6371353 | Pressure welding apparatus and pressure welding method A pressure welding apparatus includes a pressing die assembly 50 which has a plurality of stuffers 54 that pressure-weld electric wires 45 to the pressure-welding parts 34 of contacts 30, and a comb 70. The pressing die assembly 50 has a plurality of pins... | 04/16/2002 |
| 6352191 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 03/05/2002 |
| 6264089 | Connecting apparatus A heater tool, which bonds by thermocompression outer leads of a TCP to electrodes on an array substrate, is fixed to a support block and is movable between a compression-bonding position, wherein the distal end portion of the heater tool presses the TCP ... | 07/24/2001 |
| 6244493 | Die bonding apparatus In a die bonding apparatus with a position correcting stage that has a die carrying surface upon which a die is placed by a collet, the external circumferential shape of the die carrying surface of the position correcting stage is formed so as to be small... | 06/12/2001 |
| 6241141 | Reflow soldering self-aligning fixture An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatical... | 06/05/2001 |
| 6199742 | Method and tooling arrangement for diffusing braze weight pressure in brazing of aerostructure honeycomb sandwich panel A method of brazing together a lightweight metallic aerostructure sandwich panel having at least two spaced face sheets and an intermediate honeycomb core layer comprises: providing a tooling base having a determinable upper surface; assembling spaced upper an... | 03/13/2001 |
| 6138891 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 10/31/2000 |
| 6105846 | Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide ... | 08/22/2000 |
| 6073827 | Wire bonding capillary with a conical surface A bonding tool for use with an ultrasonic horn comprising an orifice at a first end of the ultrasonic horn and a capillary having a first tapered end coupled, the first tapered end to the orifice of the ultrasonic horn.... | 06/13/2000 |
| 6070781 | System for bringing the joint edges of sheet material into butting relationship for welding A system for bringing the joint edges of first and second sheet metal components into butting relationship. The components are clamped in opposing clamping assemblies with one of the assemblies being movable toward and away from the other. A fluid motor i... | 06/06/2000 |
| 6047875 | Reflow soldering self-aligning fixture An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatical... | 04/11/2000 |
| 6029879 | Enantiomorphic friction-stir welding probe A friction-stir welding probe tip is disclosed which has right-handed threads on one portion of the probe and left-handed threads on another portion of the probe such that weld material is drawn to the middle of the weld as the friction-stir welding probe... | 02/29/2000 |
| 6006981 | Wirefilm bonding for electronic component interconnection A system (30) is provided for interconnecting a first component (10) having multiple first bonding sites (16) and a second component (12) having multiple second bonding sites (18). The system (30) includes a leadframe (40) coupled to the first component (... | 12/28/1999 |
| 6003754 | Airfoil for a gas turbine engine and method of manufacture A fabricated gas turbine engine component and method of manufacturing. In one embodiment the component having a structural member with a cover member metalurgically bonded thereto. The bonding of the cover member being controlled by an apparatus that sequ... | 12/21/1999 |
| 5996434 | Pressure head with dual horns A pressure head (10) for contacting pressure areas through relative movement in the vertical Z-direction includes a frame (20), a pair of horn assemblies (12) each including a horn (100) for contacting a workpiece (230), the horn (100) supported by a gimb... | 12/07/1999 |
| 5893509 | Apparatus for making wire connections on semiconductor chips In an apparatus known as a wire bonder, a new type of one-piece joint element (20) is used as the articulated link (G) between a support unit (pivoting rocker 30) and a bonding unit (10) that carries a capillary (12). One or more such joint elements (20) ... | 04/13/1999 |
| 5848746 | Load regulating expansion fixture A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regu... | 12/15/1998 |
| 5683026 | Pressure-bonding unit and pressure-bonding head unit A thermocompression-bonding unit and a pressure-bonding head unit which are structurally simple and where reliability is high. The pressure-bonding head unit includes a pressure-bonding head; pressure-bonding head holding means for integrally fixing and h... | 11/04/1997 |
