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| Number | Title | Issue Date |
| 7243688 | Device for reforming socket contacts An apparatus for reworking contacts of sockets is provided with an elongated member having a first formation tip, and a pair of arms having second formation tips, to respectively impart first and second profiles to first and second surfaces of a contact of a socket.... | 07/17/2007 |
| 7076979 | Method and device for producing curved lengths of spring band steel In a method and a device for producing curved lengths of spring band steel in order to produce precisely toleranced, dimensionally stable bending radii, the spring band steel (10) pass through a bending unit (20), which is comprised of three support po... | 07/18/2006 |
| 7056412 | Counter rotational layering of ePTFE to improve mechanical properties of a prosthesis A prosthesis, and method for forming same, are provided which includes expanded polytetrafluoroethylene (ePTFE) tubes having angularly offset node and fibril configurations. Also, the node and fibril configurations are angularly offset from the longitudinal axes of ... | 06/06/2006 |
| 6966957 | Bonding method for a plurality of components, bonding method for container and lid member, and ultrasonic welding apparatus According to a bonding method of heat-welding a plurality of components in a predetermined lengthwise direction by vibration of an ultrasonic vibrator, the plurality of components are fixed such that their bonding positions are aligned, the ultrasonic vibrator is os... | 11/22/2005 |
| 6880742 | Separating seam welding device Shown is a device and a process for the simultaneous separating and welding of foils or foil tubes (5) where the device comprises at least one welding terminal (2) and an opposing terminal (3), | 04/19/2005 |
| 6729529 | System and method for cutting and orbital welding thin-walled tubing A system for providing cutting and orbitally welding thin-walled tubing. The system includes a plurality of clamping blocks that hold the tubing while the tubing is trimmed and orbitally welded. The system further includes at least one tooling plate to which the cla... | 05/04/2004 |
| 6516515 | Semiconductor integrated circuit A method for stabilizing the form of a letter S of an inner lead after bonding in a method of manufacturing μBGA.multidot.IC in which a chip is fixed via an insulating film on a tape carrier on one main surface of which plural inner leads are laid and ea... | 02/11/2003 |
| 6213380 | Bonding a diamond compact to a cemented carbide substrate A method of bonding a diamond compact comprising a polycrystalline mass of diamond and a bonding phase which contains free-silicon to a substrate is provided. The method includes the steps of contacting a surface of the compact with carbon or nitrogen or ... | 04/10/2001 |
| 6206275 | Deep access, close proximity, fine pitch bonding of large wire This invention relates to a wire bonding apparatus for bonding wire to a substrate wherein the components used to guide, bond and cut the wire have a reduced cross-sectional dimension near the substrate to enable close proximity, deep access, fine pitch b... | 03/27/2001 |
| 6056184 | Apparatus for shaping liquid portions of solder in soft soldering semiconductor chips The apparatus, in preparation of soft soldering semiconductor chips to a substrate (6), is for the shaping of spherically domed liquid portions of solder (8) into flat solder applications (8"), as evenly distributed as possible and correctly positioned on... | 05/02/2000 |
| 6041995 | Wire bonding method In a wire bonding method, particularly a method for forming a ball at an end of a bonding wire that has an intended ball size, a tail length of the bonding wire extending from the lower end of a capillary is determined according to the size of the intende... | 03/28/2000 |
| 5957369 | Method for connecting two workpieces together In a method for connecting two workpieces together by welding, the workpieces are placed on clamping tables by a feed unit (F) and are joined together by a welded seam. First, the workpieces are positioned in the feed unit (F). The feed unit (F) is then t... | 09/28/1999 |
| 5823416 | Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus There are disclosed a surface treatment device and a wire bonding device which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost. The surface treatment device includes a base having a transfer path for... | 10/20/1998 |
| 5720425 | Method of splicing rolled plates and aparatus for the same The invention provides a method of splicing rolled plates with each other, including the steps of (a) positioning a rear end portion of a leading rolled plate above a front end portion of a following rolled plate by a distance slightly greater than a diam... | 02/24/1998 |
| 5667131 | Method and apparatus for pressure-welding an electric wire to a pressure terminal A method and apparatus for pressure-welding an electric wire to a pressure terminal in a manner that minimizes the deformation of pressure-welding cutters when the connection wire is pressed fit into the pressure terminal and provides electrical connectio... | 09/16/1997 |
| 5528818 | Assembly line for producing a steel coffer from sheet metal plate The assembly line for producing a steel coffer (2) for ceiling and/or wall structures, in particular for interior finishing and construction of ships, for transportable and movable buildings, for sheds, hotels and the like, from a sheet metal plate (1) co... | 06/25/1996 |
| 5386625 | Tab type IC assembling method and an IC assembled thereby A method of assembling an integrated circuit (IC) by a TAB (Tape Automated Bonding) system, and an IC assembled thereby. Leads extending from a TAB tape and connected to an IC are each partly reduced in width. Hence, even when the end portions of the lead... | 02/07/1995 |
| 5312025 | Method of and device for manufacturing bands of steel A device for manufacturing loops of steel employed in continuous-operation presses to manufacture single-layer or multiple-layer webs of material. To equalize the tension in the ends of a strip before they are welded together to form a loop and to increas... | 05/17/1994 |
| 5299472 | Saw blade tipping apparatus A method of and apparatus for mounting hard material tips to a cutter tool such as a saw blade body (6), wherein a gripper/pick-up member/element (4) for handling the tips (8) to be mounted or other material required in the tip mounting operation is movea... | 04/05/1994 |
| 5248075 | IC pin forming machine with integrated IC testing capability The present invention relates to integrated circuits (ICs) fabrication and testing. Particularly, there is an IC pin/lead trimming and forming machine that is adapted to electrically test ICs for electrical defects. Uniquely, the IC testing can occur at a... | 09/28/1993 |
| 5228613 | Machine for the automatic and continuous production of wire winding spools This invention concerns a machine for the automatic and continuous production of wire winding spools, and in particular metal welding wire for welding machines. The machine in question consists of three successive operating stations through which two para... | 07/20/1993 |
| 5211326 | Method of manufacturing a built-up metal plate and welding carriage for the carrying out of the method A method is described for manufacturing a built-up sheet panel by forming a double flanged joint with raised flange edges between sheets arranged alongside of each other, which are then welded together by means of a driven welding carriage, the raised fla... | 05/18/1993 |
| 5203078 | Printed wiring board for IC cards This invention relates to a printed wiring board (10) for IC cards to be built in or fitted to a contact type IC card, that is, an IC card having external contact terminals. The present invention is to provide a printed wiring board (10) for IC cards wher... | 04/20/1993 |
| 5187863 | Method and device for connecting a connector to a board A method and apparatus for fixing a connector having pins onto a printed circuit board wherein the apparatus is movable between a position rear the pins and a position retracted from the pins. The apparatus includes heating means and pressure heads which ... | 02/23/1993 |
| 5174020 | Remelting process for printed circuit boards The appearance of stresses when remelting printed circuit boards should be avoided. The remelting process of the tin-lead layers ensues in a pressure vessel at elevated ambient gas pressure. The quantity of heat required for the remaining can be supplied ... | 12/29/1992 |
| 5123587 | Method and apparatus for making steel joists The present invention provides a method and apparatus for making joists. The chord members of the joists consist of two pairs of spaced apart angle irons, and the web portion of the joists consist of a plurality of linear metal bar lengths. Under a comput... | 06/23/1992 |
| 5118556 | Film material for film carrier manufacture and a method for manufacturing film carrier A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part ... | 06/02/1992 |
| 5042123 | Computer controlled automated semiconductor production apparatus An apparatus for producing semiconductor devices includes: a wafer splitting device for splitting a semiconductor wafer into individual dice; an automatic warehouse for lead frames for storing a plurality of kinds of lead frame; an assembly device for ass... | 08/27/1991 |
| 5030313 | Apparatus for connecting strips An apparatus for connecting strips, in which a rear end portion of a preceding strip and a front end portion of a succeeding strip are cut and brought into contact to each other so that a butt welding of the contacted portions may be carried out to connec... | 07/09/1991 |
| 5020217 | Methods for fabricating an electrical contact A method of fabricating an electrical contact formed at least in part of a precious metal which defines a contact surface on the electrical contact. In this method, an initial discrete deformation of the precious metal extends a projection of the precious... | 06/04/1991 |
| 4917284 | Apparatus for manufacturing building panels The apparatus, for manufacturing building panels for construction walls with antiseismic and thermoacoustic insulation characteristics, includes a horizontal table for assembling a panel formed by at least one layer of insulating material and by a pair of... | 04/17/1990 |
| 4896813 | Method and apparatus for cold rolling clad sheet Metals to be bonded are drawn from pay-off reels and passed around holding rollers which are grounded cathodes, each roller being partially exposed in an etching chamber having an anode area at least three times the exposed area of the cathode. Each chamb... | 01/30/1990 |
| 4887758 | Apparatus for connecting external leads An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driv... | 12/19/1989 |
| 4877174 | Tab device excise and lead form apparatus Apparatus is described for excising and forming tape mounted electronic devices in an automated fashion so that as the tape bearing the components is fed past a punch and die set, each frame bearing an electronic component is precisely aligned and the ele... | 10/31/1989 |
| 4856700 | Apparatus for assembling a structural panel in order to prevent the sag thereof Apparatus for facilitating the assembly of a structural panel and for preventing the sag thereof comprises an upstanding support structure in the form of laterally spaced rows of longitudinally spaced columns (C) which extend upwardly from a floor support... | 08/15/1989 |
| 4826068 | Outer lead bonding device utilizing tape carriers A bonding device for effecting outer lead bonding is disclosed which comprises a bonding stage, a pair of bonding tools, and lead supporting means. The lead supporting means may take the form of a pair of projections formed on the upper surface of the bon... | 05/02/1989 |
| 4762263 | Small-sized gas pressure welding machine for rails with two separate mechanisms for punching-shearing excess metal A small-sized gas pressure welding machine for rails comprises a pressure application unit and an excess metal punching unit. The pressure application unit includes a positioning bed disposed along the rail feet of rails to be welded together, a movable p... | 08/09/1988 |
| 4759486 | Controlled environment chamber for use in cladding a nonaluminum core with aluminum A method of cladding a nonaluminum core with at least one aluminum cladding strip by preheating both the core rod and the strip with the former being preheated to about 1000° F. to 1300° F. and the latter being heated to about 600° F. to 1000° F. Clea... | 07/26/1988 |
| 4759489 | Automobile body building methods and apparatus In a method of building an automobile body separate upper and lower body modules (50, 78) are formed, incorporating the roof area and the floor area of the automobile respectively, precision mating locations (62) on the body modules are used first as refe... | 07/26/1988 |
| 4746048 | Printed circuit board jumper wire wiring device A device which can improve the efficiency of jumper wire wiring work through automatic coiling and soldering of both conductor parts of a jumper wire to selected pins of the multiple pins protruding from a printed circuit board. The device includes a sett... | 05/24/1988 |
