Quotables
"Inventing is a combination of brains and materials. The more brains you use, the less material you need."
Charles Kettering
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7575147 | Compliant wirebond pedestal A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electr... | 08/18/2009 |
| 7407085 | Apparatus and method for attaching a semiconductor die to a heat spreader Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by... | 08/05/2008 |
| 7387229 | Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and tra... | 06/17/2008 |
| 7347347 | Head assembly, disk unit, and bonding method and apparatus A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated c... | 03/25/2008 |
| 7344059 | Apparatus and method for mounting an electrical connector to a glass sheet of a vehicle window An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which... | 03/18/2008 |
| 7308999 | Die bonding apparatus A die bonding apparatus for die bonding at least two members, which are heated in a heat treatment furnace, comprising a first member having a surface to be die bonded on which solder is disposed and a second member disposed to face the first member in a state in wh... | 12/18/2007 |
| 7306132 | Bonding apparatus A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion i... | 12/11/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7229000 | Adjustable frame fixture An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions ... | 06/12/2007 |
| 7222773 | Semiconductor bonding apparatus There is disclosed a semiconductor bonding apparatus which mounts a semiconductor chip via an elastic member disposed between the semiconductor chip and a mounting substrate, comprising a holding section which holds the semiconductor chip facing the mounting substra... | 05/29/2007 |
| 7175024 | Configurable insert for a manufacturing carrier A manufacturing carrier has an insert that can be configured and reconfigured for a wide variety components. The carrier has a frame configured to be transported by a conveyor, an insert and at least one positioner. The insert has pin holes arranged in a matrix. The... | 02/13/2007 |
| 7168609 | Method and apparatus for removing known good die A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connect... | 01/30/2007 |
| 7165711 | Substrate alignment method and apparatus A substrate that is not lying flat on its substrate tray can present significant process problems when a vacuum pickup attempts to pick up the substrate and fails due to the lack of a proper bond forming between the pickup and the substrate. The substrate left behin... | 01/23/2007 |
| 7134589 | Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate A Wire Bonder has a downholder for pressing the fingers of a system carrier onto a heating plate. The downholder can be raised and lowered. A downholder in accordance with the invention contains four guide elements for bearing a holding plate, whereby each guide ele... | 11/14/2006 |
| 7100813 | System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate... | 09/05/2006 |
| 7098051 | Structure and method of direct chip attach A semiconductor package (101) has a die (1), a leadframe (4), a bond pad (6), an encapsulation (3) and a wire bond ball (2). The wire bond ball is formed on the bond pad by bonding one end of a bond wire (7), and rema... | 08/29/2006 |
| 7066314 | Modular belt carrier for electronic components Replaceable component carriers (40) are adapted to be freely floating in belt apertures (74) and have alignment features (160), such as conical holes (170), mated to features (162), such as tapered pins (184), in processing ... | 06/27/2006 |
| 7040525 | Stage structure in bonding machine and method for controlling the same Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around ... | 05/09/2006 |
| 7025244 | Electronic component mounting apparatus and electronic component mounting method In an electronic component mounting method in which electronic components are sucked/held by plural respective nozzles provided on a mounting head so as to be mounted on electronic component mounting portions of a board, such a mounting operation is sequentially car... | 04/11/2006 |
| 7015066 | Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the s... | 03/21/2006 |
| 7007833 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 03/07/2006 |
| 6976616 | Circuit board transferring apparatus and method and solder ball mounting method By photographing pad forming faces of CSPs 400 to recognize a pad arrangement through image processing so as to transfer and position the CSPs 400 in accordance with the recognition result of the pad arrangement, even if pads 401 are formed in a... | 12/20/2005 |
| 6974069 | Solder ball attaching system and method The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base t... | 12/13/2005 |
| 6974071 | Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substr... | 12/13/2005 |
| 6951299 | Tooling frame able to adhere to tin A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive mate... | 10/04/2005 |
| 6945445 | Supporting tray for wave soldering A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circu... | 09/20/2005 |
| 6935828 | Wafer load lock and magnetically coupled linear delivery system A wafer load lock and linear delivery system including within a load lock vacuum chamber a paddle cantilevered from a trolley traveling on a single rail extending on a lateral side of the wafer end of the paddle while it is retracted into the load lock chamber. The ... | 08/30/2005 |
| 6935549 | Brazing fixtures and methods for fabricating brazing fixtures used for making feed-through assemblies A brazing fixture for fabricating a feed-through assembly during a brazing process and a method for forming a brazing fixture are provided. The brazing fixture includes a holding tray and a nesting plate removably mounted on the holding tray. The nesting plate has a... | 08/30/2005 |
| 6915940 | Device for applying solder globules An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposit... | 07/12/2005 |
| 6883698 | Planting device for planting solder balls onto a chip A planting device for planting solder balls onto a chip includes a main board with a plurality of apertures for accommodating solder balls, and a fixture for fixing the chip under the main board. The chip is coated with a layer of adhesive for adhering the solder ba... | 04/26/2005 |
| 6877650 | Compliant wirebond pedestal A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electr... | 04/12/2005 |
| 6860417 | Low shock work transport system for pressure vessels A low shock work transport system for moving workpieces into a pressure vessel without significant vibrations or mechanical shocks. The pressure vessel has two opposing ends with a sealable port in each of the opposing ends. A vessel rail is contained entirely withi... | 03/01/2005 |
| 6860418 | Method for making a bonding tool A method for making a bonding tool is provided. The bonding tool includes a three dimensional surface configuration which is a mirror image of a three dimensional surface configuration of a circuit card assembly (CCA). The method includes creating a mirror image of ... | 03/01/2005 |
| 6857552 | Method and apparatus for making smart card solder contacts A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal ... | 02/22/2005 |
| 6820792 | Die bonding equipment Die bonding equipment for fine pitch ball grid array package includes: a semiconductor chip pickup stage for inspecting a status of a loaded semiconductor chip and a corresponding position thereof; an alignment stage on which the semiconductor chip fixed on a mount ... | 11/23/2004 |
| 6820793 | Apparatus for the transport and equipping of substrates with semiconductor chips An apparatus for the transport and equipping of substrates with semiconductor chips comprises a channel with two side walls in which the substrates are transported in a transport direction. The apparatus has at least one comb which can be raised and lowered in order... | 11/23/2004 |
| 6814277 | Lead frame substrate clamp and method A method of securing articles to each other and an alignment and holding apparatus comprising a platform having an alignment member for positioning and holding a first article, such as a substrate, in a first position and a further alignment member for aligning exte... | 11/09/2004 |
| 6814273 | Flatwire repair tool systems and methods A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original ... | 11/09/2004 |
| 6805274 | Solder ball attracting mask and its manufacturing method A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component and formed with a plurality of through-holes for attracting the solder... | 10/19/2004 |
| 6799714 | Circuit board pallet with component arm A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk hole is drilled in the bottom of the pallet to accommodate the pin. ... | 10/05/2004 |
