Did You Know...
...that one person who claimed to be the inventor of the television is Russian emigre Vladimir Zworykin? In 1929 David Sarnoff, founder of RCA, asked Zworykin what it would take to develop TV for commercial use. He said: a year and a half and $100,000. In reality, it took 20 years and $50 million! Before his death in 1982 at the age of 92, Zworykin said of his invention: "The technique is wonderful. It is beyond my expectations. But the programs! I would never let my children even come close to this thing."
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| Number | Title | Issue Date |
| 8181842 | Device for assembly by brazing an end cap onto a cylindrical body and vacuum cartridge comprising one such device The present invention relates to a device for assembly by brazing an end cover onto a cylindrical body, said end cover presenting a circular peripheral rim via which said cover is brazed onto a part of one of the end surfaces of the cylindrical body, this device bei... | 05/22/2012 |
| 8141766 | Automatic soldering system An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is co... | 03/27/2012 |
| 8091760 | Device for fixing conductor tracks on a solar cell The invention concerns to a device for fixing conductor tracks on at least one first main-surface of at least one solar cell. ... | 01/10/2012 |
| 8066172 | Quick-loading soldering apparatus A quick-loading soldering apparatus for soldering PCBs comprises a rotatable deck which has a plurality of angularly spaced PCB work sites. While a first PCB work site is angularly positioned for pre-loading and pre-heating PCB components at a pre-loading station, a... | 11/29/2011 |
| 8047419 | Method of manufacturing vehicle body and welding facility A welding facility includes a main welding line for manufacturing an assembly of frame members, and a sub-welding line for manufacturing an assembly of panel members, the sub-welding line merging with the main welding line. The main welding line is comprised of a pl... | 11/01/2011 |
| 7690550 | Reflow soldering apparatus In a reflow soldering apparatus comprising a conveyor 4 to transport circuit boards 5 mounted with electronic components into multiple chambers 1, 2 and 3, and fans 6 installed in the chambers 1, 2 and 3, the centers ... | 04/06/2010 |
| 7568606 | Electronic device handler for a bonding apparatus A bonding apparatus is provided which includes a device handler for handling electronic devices, the bonding apparatus including a bonding tool at which the electronic devices are locatable for bonding. A storage assembly is provided for storing multiple electronic ... | 08/04/2009 |
| 7546942 | System for assembling, in particular by welding, structures made up of elements of pressed sheet metal, such as motor-vehicle bodies or subassemblies thereof A flexible system for welding motor-vehicle bodies or subassemblies thereof envisages a series of pairs of side frames provided with referencing and clamping devices for keeping in the correct position the structures to be assembled during welding. For each differen... | 06/16/2009 |
| 7404511 | Laser trimming problem suppressing semiconductor device manufacturing apparatus and method A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer subs... | 07/29/2008 |
| 7293692 | Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a firs... | 11/13/2007 |
| 7284980 | Continuous firing furnace, manufacturing method of porous ceramic member using the same, porous ceramic member, and ceramic honeycomb filter A continuous firing furnace of the present invention comprises: a muffle formed into a cylindrical shape so as to ensure a predetermined space; a plurality of heat generators placed at the peripheral direction from the muffle; and a heat insulating layer formed in a... | 10/23/2007 |
| 7229000 | Adjustable frame fixture An adjustable frame fixture aims to hold a printed-circuit board (PCB) to pass over a tin oven to process wave soldering. The fixture includes at least two side frames and at least two fasteners. The two side frames are coupled to form a holding dock. The positions ... | 06/12/2007 |
| 7204751 | Method and apparatus for filtering contaminants A self-contained ventilator includes a housing having a support member for supporting a pollution source. A filter is further disposed in the housing for filtering contaminants emitted from the pollution source. A conduit is adapted to connect to the housing to prov... | 04/17/2007 |
| 7100813 | System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate... | 09/05/2006 |
| 7048173 | Wave soldering method using lead-free solder, apparatus therefor, and wave-soldered assembly The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate fro... | 05/23/2006 |
| 7021517 | Method and device for applying pieces of material to a workpiece The invention relates to a device for applying pieces of material to a workpiece. Said device comprises a plurality of capillaries which respectively bring a piece of material (6) to a work station (3) in one working cycle. The piece of material is pla... | 04/04/2006 |
| 7015066 | Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly A method of making a microelectronic assembly buying restraining a substrate in a fixture at room temperature, placing a flip chip on the substrate so that conductive bumps on the flip chip are aligned with contact pads on the substrate, heating the flip chip, the s... | 03/21/2006 |
| 6971571 | Reflow soldering apparatus and reflow soldering method A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing p... | 12/06/2005 |
| 6945445 | Supporting tray for wave soldering A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circu... | 09/20/2005 |
| 6799709 | Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board An apparatus for locally applying solder to a plurality of sets of preselected conductive areas on each printed circuit board to which component leads are joined. The apparatus includes a flux station with flux nozzles, a preheater station, and a wave solder station... | 10/05/2004 |
| 6780225 | Reflow oven gas management system and method Reflow solder oven gas management system introduces an inert gas into and removes contaminated gas from a reflow oven tunnel (42) at predetermined points (6, 8) to influence the oven tunnel gas flow and to dilute and expel excess oxygen. The contaminat... | 08/24/2004 |
| 6772937 | Method and apparatus for applying viscous material By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage... | 08/10/2004 |
| 6755339 | Fluxing apparatus for applying powdered flux A fluxer applies powdered flux to an object. The fluxer includes an enclosure that defines a chamber where the object is fluxed. The enclosure includes an inlet for receiving the object into the chamber prior to application of the flux and an outlet for discharging ... | 06/29/2004 |
| 6754551 | Jet print apparatus and method for printed circuit board manufacturing A jet dispensing print system for dispensing a liquid or viscous, jettable substance as a pattern onto the surface of a PCB in an industrial manufacturing PCB production line. The system includes a printing system having a printing bridge system, that includes a sta... | 06/22/2004 |
| 6702173 | Reflow apparatus in continuous printing and mounting apparatus for film-like printing body When a movement of a film-like printing body is stopped for a longer time than the normal time because of generation of trouble or the like, heat of hot plates for full heating is prevented from being transmitted to the film-like printing body. All of the... | 03/09/2004 |
| 6688511 | Wave solder apparatus and method A method of soldering a circuit board comprises moving a circuit board through various stations including a preheater station and a solder station.... | 02/10/2004 |
| 6655574 | Apparatus for selective soldering The invention relates to a soldering apparatus, including a vessel for containing and heating molten solder, transporting means for transporting objects for soldering to the vessel and removing said objects, at least one tube extending substantially verti... | 12/02/2003 |
| 6637641 | Systems and methods for manufacturing a circuit board A circuit board manufacturing system has a paste source, a circuit board processing apparatus, and a controller. The circuit board processing apparatus includes a carrier configured to receive a circuit board having (i) a section of circuit board material... | 10/28/2003 |
| 6367677 | Wave solder apparatus and method A wave soldering apparatus includes a frame having a first end and wave solder equipment supported with respect to the frame. The wave solder equipment is configured to apply solder to a circuit board. A circuit board transporter is supported with respect... | 04/09/2002 |
| 6364194 | Soldering apparatus A carriage for a printed circuit board in a soldering apparatus has clamps which clamp opposite edges of the board to hold it during transport. As the carriage is lowered to a board delivery station, the clamp members are opened automatically. The board i... | 04/02/2002 |
| 6332567 | Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and g... | 12/25/2001 |
| 6315189 | Semiconductor package lead plating method and apparatus A method and apparatus for uniformly solder plating leads on semiconductor packages wherein the leads are rotated during the solder plating process and the solder on the leads in planarized and solder between and bridging the leads is removed by the appli... | 11/13/2001 |
| 6305596 | Apparatus and method for soldering through-hole components on circuit board A method for breaking off solder bridges between pins of a through-hole component on a printed circuit board, comprises the following steps: (1) providing a soldering apparatus, the apparatus having an opening corresponding to the through-hole component, ... | 10/23/2001 |
| 6237832 | Wave soldering fixture An apparatus used in a process for supporting a printed circuit board during a wave soldering operation including a frame with a frame opening in which a surface of the frame supports the board and also serves as a reference surface for vertically positio... | 05/29/2001 |
| 6027006 | Method and apparatus for applying solder and forming solder balls on a substrate A method and apparatus is disclosed for applying solder to a substrate which has a predetermined pattern of receiving pads thereon and forming solder balls from the applied solder. A conveyor is provided having a support member and a continuous metering m... | 02/22/2000 |
| 6008476 | Apparatus for indexing and affixing components to a substrate An apparatus (400) used for indexing and affixing components to a substrate includes a vacuum conveyor and a controller (816) for controlling operation of the apparatus (400). The conveyor includes pallets (102), first and second tracks (414, 416), first ... | 12/28/1999 |
| 5975402 | Stacking and soldering apparatus for three dimensional stack package devices A stacking and soldering apparatus for a three dimensional stack package devices includes a first base plate for receiving the first individual package devices to be stacked and having a heater for heating metal lead portions of the first individual packa... | 11/02/1999 |
| 5941444 | Soldering The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Each of the series of processing stations includes at least one processing position, and the... | 08/24/1999 |
| 5934540 | Horizontal soldering system with oil blanket A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion c... | 08/10/1999 |
| 5834062 | Material transfer apparatus and method of using the same A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) ... | 11/10/1998 |
