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| Number | Title | Issue Date |
| 7845540 | Systems and methods for depositing conductive material into openings in microfeature workpieces Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing ... | 12/07/2010 |
| 7296725 | Feed devices and methods for injection molded solder systems A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second lea... | 11/20/2007 |
| 7131565 | Feed devices and methods for injection molded solder systems A solder feeding device having a reservoir, a drive unit, a first lead, and a second lead is provided. The reservoir melts solid solder wire into molten solder, while the drive unit selectively feeds the solid solder wire into the reservoir. The first and second lea... | 11/07/2006 |
| 7003874 | Methods of bonding solder balls to bond pads on a substrate Methods and apparatuses for bonding solder balls to bond pads are described. In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are with... | 02/28/2006 |
| 6951299 | Tooling frame able to adhere to tin A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive mate... | 10/04/2005 |
| 6942137 | Die removal method and apparatus A method and apparatus for separating a semiconductor device from a substrate in a fixture with a shearing element, wherein the semiconductor device is attached to the substrate by solder connections to form an assembly, includes using the shearing element to apply ... | 09/13/2005 |
| 6926188 | Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a mov... | 08/09/2005 |
| 6732907 | Soldering method, soldering device, and method and device of fabricating electronic circuit module A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the... | 05/11/2004 |
| 6730173 | Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module A method of manufacturing an electronic circuit module includes flow soldering including preheating an interconnect substrate on which an electronic part is placed, and supplying molten solder to a first surface of the interconnect substrate, whereby the first surfa... | 05/04/2004 |
| 6637639 | Wire processing apparatus, flux applying device, and solder depositing device A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The ... | 10/28/2003 |
| 6592021 | Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system A circuit assembly having a thin and large-area dielectric substrate and an improved grounding condition. To make the assembly, a circuit board comprises the substrate, and a circuit pattern and a metal layer that are formed on respective sides of the sub... | 07/15/2003 |
| 6467671 | Solder recovering method and solder recovering apparatus A solder receiving method for a printed circuit board having electronic components soldered thereon includes the steps of forming, in a recovering apparatus body, a solder alloy layer, a metal particle layer and a liquid heat medium layer according to dif... | 10/22/2002 |
| 6142357 | Molded selective solder pallet A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder palle... | 11/07/2000 |
| 6135239 | Fire escape ladder A self-contained fire escape apparatus for mounting in a wall of a building adjacent an associated window includes a collapsible ladder. A cover is securely attached to a first end of the ladder. A box is configured to provide storage space for the ladder... | 10/24/2000 |
| 5860582 | Inert atmosphere soldering apparatus An inert atmosphere spot soldering process and apparatus uses pockets arranged to match the arrangement of the terminals to be soldered. The pockets are filled to over flowing with liquid solder by lowering the pockets below the surface of the molten sold... | 01/19/1999 |
| 5740954 | Apparatus for attaching/detaching a land grid array component to a circuit board A system is provided for selectively attaching or detaching a land grid array component to a surface of circuit board where the attachment is a grid array of solid conductive solder beads or balls. A chamber contains an inert liquid, and a heater heats th... | 04/21/1998 |
| 5611475 | Soldering apparatus Apparatus for applying solder to electrical or electronic components mounted in a horizontally oriented carrier, includes a solder bath, a pair of tracks (1,2) for guiding the carrier across the solder bath, and a device for urging the carrier along the t... | 03/18/1997 |
| 5370297 | Soldering apparatus In a soldering apparatus using a rotary station, a component holder is lowered and/or moved vertically by a stepper motor drive. A motor, lowers a drive shaft by a lead screw, and a second motor rotates the shaft via a toothed bearing wheel, the shaft hav... | 12/06/1994 |
| 5335843 | Soldering process and apparatus A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junc... | 08/09/1994 |
| 5226964 | Vertical solder coating apparatus A vertical solder coating machine is described incorporating a tank containing molten solder with a bath of solder leveling fluid on the top thereof. Drive rollers are positioned within the tank and in the solder leveling fluid for grasping workpieces suc... | 07/13/1993 |
| 5092266 | Solder leveler This invention relates to a solder leveler and in particular to one including a solder trough assembly having a container, two blowing means and two angular frames, two pneumatic rods mounted on the angular frames and having an elongated case in which the... | 03/03/1992 |
| 4932585 | Method and apparatus for solder plating an object A method and an apparatus for solder plating parallel arranged leads on an electronic device, e.g. QFP having leads on four sides or SOLC having leads on two sides. A metal plate of solder wettable material having an inclined upper surface is placed in a ... | 06/12/1990 |
| 4928869 | Solder leveller A solder leveller for tinning exposed metal on printed circuit boards comprises a solder bath and paired rollers therein for carrying a board in a curvilinear path downwardly into, through and upwardly out of the bath. At least one pair of rollers having ... | 05/29/1990 |
| 4869418 | Solder leveling method and apparatus A method and apparatus for producing flush solder fill over recessed pins and over passage holes in circuitized substrates. A substrate carrying rack is immersed in a vessel of molten solder after it has been similarly immersed in a flux bath. While in th... | 09/26/1989 |
| 4848644 | Drag soldering method and apparatus for printed wiring boards The invention is an improved drag soldering machine for printed wiring boards (PWB) for providing a uniform vertical velocity at the point of separation between the solder and the PWBs. The improved drag soldering machine has a molten solder bath, an entr... | 07/18/1989 |
| 4832247 | Soldering apparatus A surface mounted chip soldering apparatus comprises a number of stations for fluxing and soldering the chip. For each station, the chip is carried by a suction pad in which is created a partial vacuum by a respective piston and cylinder mounted on a turr... | 05/23/1989 |
| 4833274 | Perfluoroalkanes and haloperfluoroalkanes, their percursors and process for their synthesis New perfluoroalkanes and haloperfluoroalkanes, having low melting point and high thermal and chemical stability, constituted by preferably branched perfluorinated and haloperfluorinated chains, obtained by starting from precursors containing two halogen a... | 05/23/1989 |
| 4827053 | Perfluorinated Di-isopropylmethyl decalin Novel compositions include compounds of the formula: ##STR1## wherein the carbon rings are fully fluorinated.... | 05/02/1989 |
| 4796158 | Apparatus for holding electrical or electronic components during the application of solder A carrier for holding SOIC packages during the application of solder to their leads, the carrier including a frame provided with an end plate (17) with mounting lugs (20). On each lug (20) is mounted an upper U-shaped member (1) and a lower U-shaped elong... | 01/03/1989 |
| 4782991 | Hot liquid solder reflow machine A solder reflow machine for removing and replacing electronic components of the pin-grid array type having a large number of leads soldered into a very densely populated printed circuit board. The machine utilizes a heat-transfer liquid and a vacuum to re... | 11/08/1988 |
| 4777304 | Perfluorinated butyl derivative compounds Novel compositions of matter are disclosed having the formula: ##STR1## wherein the carbon rings are fully fluorinated to remove all hydrogens and olefinic character. The compositions have utility as heat transfer agents, hydraulic fluids, vapor phas... | 10/11/1988 |
| 4769083 | Method for removing excess solder from printed circuit boards A method for removing excess solder from a printed circuit board is practiced by mixing a quantity of ceramic beads with an oil to form a fluidized bed mixture. The fluidized bed mixture is heated to a temperature above the melting point of a solder on th... | 09/06/1988 |
| 4697730 | Continuous solder system A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct on... | 10/06/1987 |
| 4679721 | Apparatus for fuse-bonding articles A vapor phase bonding apparatus wherein articles to be bonded are heated with hot vapors of a heat transfer liquid so that a bonding agent such as a solder provided between the articles to be bonded is melted to effect the bonding. The apparatus includes ... | 07/14/1987 |
| 4637541 | Circuit board soldering device A process for soldering circuit boards comprising the steps of: (a) applying a solder flux coating to the solder side of a board; (b) drying the flux on the board and preheating the solder side of the board by sequentially (i) directing a stream of warm gas over th... | 01/20/1987 |
| 4619841 | Solder leveler Printed circuit boards that may contain through-holes, conductors, connectors, etc. are soldered by covering such boards with liquid solder. During such a process, excess or undesirable solder is typically residual on the surface of such boards, and, more... | 10/28/1986 |
| 4603804 | Automatic soldering apparatus An automatic soldering apparatus which makes it possible to automate the whole steps, from the step of feeding the work to the step of collecting the same, as well as simultaneously enhance the reliability in transportation and the economy in soldering op... | 08/05/1986 |
| 4598858 | Covering means and method for protecting the surface of a soldering bath For protecting the surface of a soldering bath a covering means is used which comprises two phases (3,4), which are placed one on top of the other, are not soluble in each other and are liquid at the soldering temperature. The bottom phase (3) is produced... | 07/08/1986 |
| 4560100 | Automated soldering process and apparatus An automated discreet soldering system for plated holes of a printed wiring board, having a free piston type crucible mode of graphitic material, which is propelled along a guided path by pressurized nitrogen. A laser beam is directed along a path substan... | 12/24/1985 |
| 4512510 | Printed circuit board soldering apparatus Carriers each carrying a printed circuit board is conveyed successively through a soldering zone to dip each printed circuit board in molten solder contained in a vessel disposed below a space defined by two pairs of parallel front and rear rails. The fou... | 04/23/1985 |
