Bizarre Patents
A hand wearable body squeegee comprising a glove portion, a concave squeegee band, and a linear squeegee band.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7913894 | Selective soldering system A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of... | 03/29/2011 |
| 7631796 | Selective soldering system A solder machine includes a top flat carrier that holds PWBs just above a solder bath. Opposed edges of the carrier are coupled to a frame and each edge can be independently raised or lowered by a respective piston. Also, the base of the frame can pivot along one of... | 12/15/2009 |
| 7416103 | Flow soldering apparatus A compact soldering apparatus capable of increasing reliability of products by reducing occurrence of dross and using lead-free solder, wherein a primary jet nozzle 1, a secondary jet nozzle 2, and a pump (not shown) forming jet waves 24, 25 are... | 08/26/2008 |
| 7335392 | Method for producing corrosion-resistant rare earth metal-based permanent magnet The objectives of the present invention are to provide a stable and simple method for producing a rare earth metal-based permanent magnet having on the surface thereof a corrosion-resistant film containing fine zinc particles dispersed therein, a corrosion-resistant... | 02/26/2008 |
| 7320937 | Method of reliably electroless-plating integrated circuit die The present invention is a reliable method of electroless-plating integrated circuit die that achieves high yield. Die are attached to a holder using a polyimide adhesive to eliminate voltage differences on bond pads which would otherwise interfere with the plating.... | 01/22/2008 |
| 6951299 | Tooling frame able to adhere to tin A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive mate... | 10/04/2005 |
| 6945445 | Supporting tray for wave soldering A supporting tray for moving a PCB (10) in a wave solder machine includes a frame (30) and a circular plate (20). The frame includes a circular opening (33) defined thereof and a graduated scale (31) marked thereon around the circu... | 09/20/2005 |
| 6786385 | Semiconductor device with gold bumps, and method and apparatus of producing the same A semiconductor device includes a semiconductor element having electrodes and metal bumps are attached to the electrodes. The metal bumps include copper cores and gold surface layers covering the cores. In addition, the metal bumps may include gold bump elements and... | 09/07/2004 |
| 6761302 | Device mounting method When a substrate electrode (6) formed on a semiconductor substrate (5) and a device electrode (14) formed on an optical device (13) are joined to each other by solder to mount the device (13) on the substrate (5), a solder p... | 07/13/2004 |
| 6732907 | Soldering method, soldering device, and method and device of fabricating electronic circuit module A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the... | 05/11/2004 |
| 6637638 | System for fabricating solder bumps on semiconductor components A method and system for fabricating solder bumps on semiconductor components are provided. The component can be a wafer, a die, a package, or a BGA substrate. The component is provided with electrodes, such as aluminum bond pads, on which the solder bumps... | 10/28/2003 |
| 6637639 | Wire processing apparatus, flux applying device, and solder depositing device A wire processing apparatus includes an applicator (60) for crimping a crimp contact onto an end of a wire (2) and solder depositing units (7, 8) for depositing solder onto an exposed core on the wire end, all of which serve as wire processing units. The ... | 10/28/2003 |
| 6499645 | Automatic soldering apparatus An automatic soldering apparatus comprises a solder bath, and a plurality of component parts such as a jet flow nozzle, bolts, nuts and washers equipped in the solder bath, wherein a relative density of such component parts equipped in the solder bath of ... | 12/31/2002 |
| 6471111 | Method and apparatus for acoustic pressure assisted wave soldering A method and apparatus are disclosed for improving the release of molten solder from a module via the introduction of acoustic pressure waves to the module and/or molten solder wave. The acoustic pressure waves may be created by a transducer where the wav... | 10/29/2002 |
| 6436732 | Apparatus for applying viscous materials to a lead frame The invention is directed to the application of viscous materials, such as the adhesives used in LOC die attach processes, to a lead frame by forming a film of viscous material and then bringing a portion of the lead frame and the film of viscous material... | 08/20/2002 |
| 6364194 | Soldering apparatus A carriage for a printed circuit board in a soldering apparatus has clamps which clamp opposite edges of the board to hold it during transport. As the carriage is lowered to a board delivery station, the clamp members are opened automatically. The board i... | 04/02/2002 |
| 6305596 | Apparatus and method for soldering through-hole components on circuit board A method for breaking off solder bridges between pins of a through-hole component on a printed circuit board, comprises the following steps: (1) providing a soldering apparatus, the apparatus having an opening corresponding to the through-hole component, ... | 10/23/2001 |
| 6302316 | Ball arrangement method and arrangement apparatus A ball arrangement method and arrangement apparatus for simultaneously mounting balls on a mounting object by the steps of holding the balls by suction on ball suction holes in a ball arrangement device having the ball suction holes arranged, transcribing... | 10/16/2001 |
| 6296169 | Flux-application fixture for a ball-grid-array (BGA) assembly process A flux-application fixture for applying flux to die pads in a ball-grid-array assembly process is provided. The fixture comprises a solid plate having a lower surface and an upper surface and a plurality of flux pins formed in the upper surface of the sol... | 10/02/2001 |
| 6146698 | Process for simultaneously wetting a plurality of electrical contact areas with a liquid An apparatus for simultaneously wetting a plurality of electrical contact areas with a liquid includes a punch with nubs or studs made of an elastomer. The number, configuration and dimensions of the nubs are adapted to the contact areas to be wetted. A p... | 11/14/2000 |
| 6126060 | Soldering device A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where... | 10/03/2000 |
| 6062460 | Apparatus for producing an electronic circuit A method for producing an electronic circuit device includes a repair step in which, in a case where a semiconductor device once mounted on a wiring board is defective, the defective semiconductor device is removed from the wiring board and a new semicond... | 05/16/2000 |
| 6019275 | Method and system for introducing flux onto at least one surface of a solder pump A method and system for introducing flux onto at least one surface of a solder pump achieve their objects as follows. A solder pump nozzle is submerged into a flux reservoir. In response to such submersion, the flux in the reservoir is actively introduced... | 02/01/2000 |
| 5934540 | Horizontal soldering system with oil blanket A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion c... | 08/10/1999 |
| 5899376 | Transfer of flux onto electrodes and production of bumps on electrodes A process of transferring a flux on electrodes of a semiconductor chip, a film carrier, or a substrate, the process comprising: using a transfer apparatus including a transfer baseplate having protrusions corresponding to said electrodes; dipping the tips... | 05/04/1999 |
| 5884833 | Ultrasonic vibration soldering apparatus and resonator used therein A support portion for attaching a horn main body to a solder tank is provided on the horn main body at a nodal point f2 and ultrasonic vibration from an external transducer is transmitted to solder in the solder tank through the horn main body.... | 03/23/1999 |
| 5845839 | Method and apparatus for dip solder processing A dip soldering process includes a reservoir of molten solder and a solder ladle for immersion therein to refresh the supply of ladled solder. The ladled solder is displaced by a displacement plunger to thereby overflow the ladle and carry with it surface... | 12/08/1998 |
| 5435481 | Soldering process A soldering process for use with solder clad printed circuit boards (10) uses a pin transfer means to apply a tacking agent to the substrate. An array of pins (24) is dipped into a film of tacking agent (22). The pins are removed from the tacking agent (2... | 07/25/1995 |
| 5372293 | Apparatus for degolding or tinning conductive portions of a microelectronic device The apparatus is used for processing a microelectronic device having a face with electrically conductive elements arranged thereon. The apparatus comprises a vessel for containing a solder melt, a bowl for drawing molten solder from the vessel, a device h... | 12/13/1994 |
| 4958588 | Solder-coating fixture and arrangement An arrangement for solder-coating respective end portions of elongated components in a molten solder bath includes a fixture to be loaded with the components. This fixture includes at least one supporting wall that is capable of maintaining the fixture af... | 09/25/1990 |
| 4858310 | Method for soldering a metal ferrule to a flexible coaxial electrical cable A method for terminating a coaxial electrical cable by dip-soldering a metal ferrule to the outer braided shield surrounding an end.... | 08/22/1989 |
| 4848644 | Drag soldering method and apparatus for printed wiring boards The invention is an improved drag soldering machine for printed wiring boards (PWB) for providing a uniform vertical velocity at the point of separation between the solder and the PWBs. The improved drag soldering machine has a molten solder bath, an entr... | 07/18/1989 |
| 4832247 | Soldering apparatus A surface mounted chip soldering apparatus comprises a number of stations for fluxing and soldering the chip. For each station, the chip is carried by a suction pad in which is created a partial vacuum by a respective piston and cylinder mounted on a turr... | 05/23/1989 |
| 4779790 | Job oriented method and apparatus utilizing molten solder for procedures such as soldering and desoldering Apparatus for performing an operation with molten solder, such as soldering or desoldering a component mounted on a substrate such as a PCB including an enclosed reservoir, the reservoir including a contained space above the molten solder; a hollow nozzle... | 10/25/1988 |
| 4776508 | Electronic component lead tinning device An electronic component tinning apparatus comprising a longitudinal base unit having two longitudinally extending sides connected to a first end and an opposing second end, a top portion connected to and bounded by said sides and ends with an open longitu... | 10/11/1988 |
| 4684054 | Automatic soldering apparatus and method of using the flux to heat the circuit board An automatic soldering apparatus and method thereof is described, wherein a flux is heated up to a predetermined temperature, and is then contacted to a face of a printed base board to thereby coat the base board and to simultaneously heat the latter with... | 08/04/1987 |
| 4659002 | Apparatus for replacement of through-hole mounted PCB components An apparatus is disclosed for removing or installing at least one through-hole mounted component from a printed circuit board or the like, the apparatus including a compliant mask for contacting and supporting the printed circuit board with the mask havin... | 04/21/1987 |
| 4637541 | Circuit board soldering device A process for soldering circuit boards comprising the steps of: (a) applying a solder flux coating to the solder side of a board; (b) drying the flux on the board and preheating the solder side of the board by sequentially (i) directing a stream of warm gas over th... | 01/20/1987 |
| 4532884 | Device for applying a fixing medium to components such as chip-type components A device for applying a fixing medium to electronic chip-type components, comprising a container with a number of stamps arranged in one row and displaceable in vertical direction. Each of these stamps consists of a stamp pin which is identical for all st... | 08/06/1985 |
| 4518114 | Dip soldering apparatus and method Method and apparatus for forming an electrical contact between mounting pins extending from an electrical component and insulated wires from the component that are wrapped around the pins in which the tips of the pins are held in a flowing pool of molten ... | 05/21/1985 |
