Class 228/35 - By brush, wick, or pad

Subclass of Class 228 - Metal fusion bonding
Definition: Device, comprising either a filamentary member or a plurality
No. of patents: 22
Last issue date: 10/23/2007

Number	Title	Issue Date
7285173	Desoldering systems and processes A process for recovering a solder contaminant from a substrate surface with a wick structure comprising a plurality of heat conductive metal strands and a desoldering flux comprising a mixture of a first component of a partially polymerized rosin having a melting po...	10/23/2007
6951299	Tooling frame able to adhere to tin A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive mate...	10/04/2005
6854638	Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed The solder paste printing method of the present invention mounts a solder paste containing therein as a solder material a Sn—Zn system solder on a mask, and urges the solder paste to make rolling over the mask from one end thereof toward the opposite thereof by me...	02/15/2005
6769599	Method and device for placing and remelting shaped pieces consisting of solder material A method and a device for placing a multitude of shaped parts of solder material (20) on a bond pad arrangement (29) of a substrate (23), said bond pad arrangement comprising a multitude of bond pads (28), and for subsequent re-melting of...	08/03/2004
6637641	Systems and methods for manufacturing a circuit board A circuit board manufacturing system has a paste source, a circuit board processing apparatus, and a controller. The circuit board processing apparatus includes a carrier configured to receive a circuit board having (i) a section of circuit board material...	10/28/2003
6138890	Automatic soldering mechanism capable of improving a working efficiency with stabilizing a soldering quality An automatic soldering mechanism is for jetting a solder jet flow to a printed-circuit board to carry out a soldering of the printed-circuit board. The automatic soldering mechanism comprises a solder tank for storing a molten solder and a solder jetting ...	10/31/2000
6098867	Automated brush fluxing system for application of controlled amount of flux to packages An automated method of applying flux to substrate on which a semiconductor chip is to be assembled in a flip chip configuration by applying a controlled amount of flux to the substrate by a brush that applies the flux to the substrate in a programmed patt...	08/08/2000
6039805	Transfer fluxing method and apparatus for component placement on substrate A transfer fluxing apparatus is provided. The apparatus is a flux reservoir for holding flux, a compliant pad attached to an opening in the flux reservoir and a means for controlling deposition of flux onto the compliant pad. The apparatus can be attached...	03/21/2000
5973295	Heated tool positioned in the X,Y, and 2-directions for depositing fine lines on a substrate A heated apparatus, positioned in the X, Y, and Z directions, for forming fine lines of molten material on a substrate. The apparatus includes a pen having a refractory tip wetted with material in a molten state. The tip is attached to a V-shaped heater t...	10/26/1999
5834062	Material transfer apparatus and method of using the same A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) ...	11/10/1998
5831238	Method and apparatus for bonding using brazing material at approximately atmospheric pressure A method and apparatus for bonding components with a brazing material is described in which atmospheric plasma with active species is created by gas discharge generated in a gas capable of discharge at or about atmospheric pressure, and a portion of a com...	11/03/1998
5686226	Method of forming an applicator for applying tacking media to a circuit substrate An applicator (300) provides a tool for depositing processing media (510), such as a tacky flux agent, on predetermined surface areas (715) of a circuit substrate (705). The applicator (300) has a portion formed from a flexible compressible material with ...	11/11/1997
5482736	Method for applying flux to ball grid array package A method and apparatus for applying flux to a series of metallization contacts or plated contact pad a substrate exposed by an apertured solder mask, employs a compressible transfer pad. A central flux pick-up area is formed on the transfer pad bottom sur...	01/09/1996
5305941	Desoldering wick A desoldering wick is made from an elongated strip of woven wire mesh slit from a sheet of woven fabric. The wire mesh is folded longitudinally for forming a ribbon having a width less than the width of the strip and having multiple thicknesses of wire me...	04/26/1994
5266113	Dispenser for applying solder A dispenser has a tube and a tip portion having a flat passage communicated with the tube and an elongated opening at a lower end thereof. The flat passage has a constant sectional area over the entire axial length thereof, so that the solder flows in the...	11/30/1993
5074455	Solder flux dispenser suitable for use in automated manufacturing A dispenser (100) for solder flux includes a first solder flux reservoir (110) with a dispensing tip (118) at one end thereof for dispensing solder flux (112) in response to a frictional pressure applied to the tip. A second solder flux reservoir (102) is...	12/24/1991
4863092	Apparatus for making a diaphragm assembly and method of making the apparatus An apparatus for automatically brazing the opposed ends of a capillary tube respectively to connecting parts of a bulb and a diaphragm unit and a method of making the apparatus are provided, the apparatus comprising a rotatable table and a plurality of wo...	09/05/1989
4832246	Automatic soldering machines An automatic spot soldering machine incorporates apparatus for automatically sequencing through operations for forming soldered joints at a predetermined position. The sequence includes preforming a quantity of solder from a length of solder wire and posi...	05/23/1989
4196839	Methods of fabricating printed circuit boards A printed circuit board is fabricated by a series of steps which eliminate the necessity of post soldering cleaning of the printed circuit assembly. The board is fabricated by positioning components on the top surface and uniformly applying a hydrophobic ...	04/08/1980
4081575	Method of flux coating metal wick A metal wick to be used for the absorption of molten solder is deoxidized and flux coated by a process that does not involve the application of heat to the wick or the flux. In one embodiment the wick is cleaned by heating in a reducing atmosphere and is ...	03/28/1978
3960308	Apparatus for affixing surface enlarging members in the form of coherent transversally corrugated metal strips to elongate metal basic profiles Apparatus for affixing surface enlarging, transversally corrugated metal strips to elongate metal basic profiles which are advanced in the direction of their longitudinal axes whilst simultaneously being joined by a joining compound to the wave crests on ...	06/01/1976
3941292	Apparatus for soldering a plurality of flat conductors on a board An apparatus for soldering a plurality of flat conductors on a board consisting of a head with a soldering element and of a mechanism for relative displacement of the board and head. The soldering element has a working surface unwetted by the solder where...	03/02/1976

PatentStorm

Quotables

PatentStorm News

Class 228/35 - By brush, wick, or pad