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Class 228/31 - With associated bath of liquid flux or filler


Subclass of Class 228 - Metal fusion bonding
Definition: Device, whose movable roller or roller-like applicator is
No. of patents: 3
Last issue date: 12/26/2000


NumberTitleIssue Date
6164516Soldering apparatus and method
An automatic soldering apparatus includes a conveyor for conveying a printed circuit board along a predetermined path, a heater located below the conveyor and adapted to heat the lower surface of the printed circuit board on which leads of chips and other...
12/26/2000
5238175Method and apparatus for selective soldering
Disclosed is a method and apparatus for applying flux and solder in order to attach connectors to printed circuit boards (PCBs). Flux is applied to the connector tails and the PCB pads by means of a roller mounted above a flux reservoir. The piece parts a...
08/24/1993
4684544Solder fluxing method and apparatus
Solder flux is applied to the face of a printed circuit board (24) or the like by flowing a foam (30) of liquid flux bubbles upwardly through the top of a chimney flue (10) and into contact with the board face which is top passed over the top of the flue....
08/04/1987
 
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