Did You Know...
...that the Band-Aid Bandage was invented by a Johnson & Johnson employee whose wife had cut herself? Earl Dickson's wife was rather accident prone, so he set out to develop a bandage that she could apply without help. He placed a small piece of gauze in the center of a small piece of surgical tape, and what we know today as the Band Aid bandage was born!
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| Number | Title | Issue Date |
| 6951299 | Tooling frame able to adhere to tin A tooling frame with an ability to adhere to tin is disclosed, which is a frame structure used to support a circuit board passing through a stannic furnace to be soldered. The tooling frame is characterized in that a tin adhesive apparatus having a tin adhesive mate... | 10/04/2005 |
| 6948650 | Dross removal and solder reclamation improvements When dross is removed from a molten-solder reservoir, a substantial amount of molten solder is often removed with the dross. This molten solder can be separated from the dross and returned to reservoir via a conduit for reuse. Additionally, a skimmer for removing th... | 09/27/2005 |
| 6789720 | Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on... | 09/14/2004 |
| 6760396 | Coated metal articles and method of making The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and ... | 07/06/2004 |
| 6758387 | Solder coated material and method for its manufacture The present invention is a solder coated material having a large amount of solder adhered to a difficult to solder material such as Kovar or Alloy 42 and a method which can adhere a sufficient amount of solder to a difficult to solder material without using flux. An... | 07/06/2004 |
| 6592021 | Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system A circuit assembly having a thin and large-area dielectric substrate and an improved grounding condition. To make the assembly, a circuit board comprises the substrate, and a circuit pattern and a metal layer that are formed on respective sides of the sub... | 07/15/2003 |
| 6551650 | Dip formation of flip-chip solder bumps A process for fabricating a solder bump (113) includes providing an inorganic de-wetting substrate (102). In order to form a composite substrate (20), having the desired wetting/dewetting composition, a wetting metal is first applied on the inorganic de-w... | 04/22/2003 |
| 6523735 | Method of manufacturing bonded assembly A method of bonding respective objects made of different kinds of material to each other is disclosed. The method includes the steps of (A) contacting a bonding material in the fluid state thereof with respective bonding faces of the respective objects to... | 02/25/2003 |
| 6250537 | Self-cleaning soldering thimble assembly A self-cleaning soldering thimble assembly includes a thimble and a scraper disposed therein. The scraper is supported by two support rods that extend through the bottom of the thimble. The thimble slides along the support rods. When the thimble is dipped... | 06/26/2001 |
| 6209776 | Flyback transformer device and process for preparing same In a flyback transformer device wherein the leads of diodes or like electronic components are connected between pairs of terminal pieces provided upright at opposite ends of a coil bobbin, the lead ends, of the components are fixedly connected to the resp... | 04/03/2001 |
| 6145733 | Process for soldering electronic components to a printed circuit board The invention concerns a method for soldering of additional electronic components onto a circuit board having components which have already been soldered and mounted thereto, wherein the additional components are plugged through the circuit board and sold... | 11/14/2000 |
| 5934540 | Horizontal soldering system with oil blanket A solder immersion chamber in a solder crater/leveler includes a solder manifold having upper and lower solder chambers, from which solder is directed onto the top and bottom surfaces of printed circuit boards conveyed therebetween. The solder immersion c... | 08/10/1999 |
| 5845839 | Method and apparatus for dip solder processing A dip soldering process includes a reservoir of molten solder and a solder ladle for immersion therein to refresh the supply of ladled solder. The ladled solder is displaced by a displacement plunger to thereby overflow the ladle and carry with it surface... | 12/08/1998 |
| 5711473 | Inert atmosphere soldering apparatus An inert atmosphere spot soldering process and apparatus uses cups arranged to match the arrangement of the terminals to be soldered. The cups are filled to over flowing with liquid solder and provided with a enveloping flow of hot inert gas. The terminal... | 01/27/1998 |
| 5611480 | Soldering process In a soldering process leads of components on a circuit board are dipped into a solder bath to solder them to the underside of the board. The board is rotated about a horizontal axis as it is lifted away from the bath. This reduces the tendency to form so... | 03/18/1997 |
| 5497936 | Method and apparatus for soldering a coil winding wire to a terminal pin A method is provided for soldering a coil winding to a terminal pin. A specific quantity of solder is applied onto the terminal pin, the terminal pin having a winding end wrapped therearound. The solder, for example, can be applied by immersing the pin en... | 03/12/1996 |
| 5370297 | Soldering apparatus In a soldering apparatus using a rotary station, a component holder is lowered and/or moved vertically by a stepper motor drive. A motor, lowers a drive shaft by a lead screw, and a second motor rotates the shaft via a toothed bearing wheel, the shaft hav... | 12/06/1994 |
| 5335843 | Soldering process and apparatus A soldering process and apparatus for soldering difficult to reach junctions. Small containers, just large enough to accommodate the junctions are filled to overflowing from a pot of liquid solder. Once filled the flow of solder is terminated and the junc... | 08/09/1994 |
| 5299728 | Method and apparatus for laminating foils into a superconducting tape for use in a superconducting magnet Apparatus and method for forming long lengths of laminated superconducting tape by passing three foils over idler pulleys, through a solder bath and between pinch rollers having a portion which extend above the solder bath to enable cleaning of the pinch ... | 04/05/1994 |
| 5288009 | Method for degolding or tinning conductive portions of a microelectronic device The method comprises the steps of providing a vessel for containing a solder melt, and a bowl having a horizontal upper rim with an upwardly directed edge extending therealong; immersing the bowl in the solder melt contained in the vessel; lifting the bow... | 02/22/1994 |
| 5236117 | Impact solder method and apparatus A method and apparatus for tinning and soldering metal parts of electronic components and assemblies, and removing excess solder therefrom. The metal parts of the electronic components and assemblies are heated to a temperature near that of molten solder.... | 08/17/1993 |
| 5130164 | Solder-coating method An arrangement for solder-coating respective end portions of elongated components in a molten solder bath includes a fixture to be loaded with the components. This fixture includes at least one supporting wall that is capable of maintaining the fixture af... | 07/14/1992 |
| 5052612 | Process for soldering allowing low ionic contamination without cleaning operation A process for soldering a substrate surface which allows low ionic contamination without a cleaning operation which comprises (a) applying a stannous fluoride or eutectic mixture thereof to the substrate surface and (b) applying solder to the flux applied... | 10/01/1991 |
| 4858310 | Method for soldering a metal ferrule to a flexible coaxial electrical cable A method for terminating a coaxial electrical cable by dip-soldering a metal ferrule to the outer braided shield surrounding an end.... | 08/22/1989 |
| 4848644 | Drag soldering method and apparatus for printed wiring boards The invention is an improved drag soldering machine for printed wiring boards (PWB) for providing a uniform vertical velocity at the point of separation between the solder and the PWBs. The improved drag soldering machine has a molten solder bath, an entr... | 07/18/1989 |
| 4776508 | Electronic component lead tinning device An electronic component tinning apparatus comprising a longitudinal base unit having two longitudinally extending sides connected to a first end and an opposing second end, a top portion connected to and bounded by said sides and ends with an open longitu... | 10/11/1988 |
| 4759491 | Method and apparatus for applying bonding material to component leads A controlled amount of a solder is applied to the tip (18) of each lead (14) of a multi-lead component (10) by first placing a solder sphere (30) in each of a plurality of cavities (24) arranged in a baseplate (22) in the same pattern as the tips of the l... | 07/26/1988 |
| 4722470 | Method and transfer plate for applying solder to component leads A method and a solder transfer member for applying discrete bodies of solder of predetermined size to the leads of a component for subsequent surface mounting to a substrate. The transfer member is a plate having a non-wetted surface, for example titanium... | 02/02/1988 |
| 4444351 | Method of soldering metal oxide varistors A method is provided for electrically interconnecting a plurality of varistors of the type formed predominantly of metal oxide. Molten solder is first applied to the receiving surfaces provided on opposite sides of each of the varistors. The molten solder... | 04/24/1984 |
| 4433805 | Soldering method for electric and or electronic components Compressed air is blown into a pool of molten solder during soldering to form air bubbles which rapidly rise in the molten solder toward the top. The rising air bubbles strike against a printed circuit board and electric and or electronic components tempo... | 02/28/1984 |
| 4424931 | Method of making an electrical adaptor block A printed circuit board connector receptacle is positioned on the non-conductive side of a single-sided printed circuit board with its pins extending through the board and the pins are soldered to the foil on the conductive side of the board. A wire conne... | 01/10/1984 |
| 4408560 | Apparatus for applying solder to printed circuit boards Printed circuit boards which are to be tin-plated pass through a liquid application station in a horizontal direction, and thereafter through an activation station for the activation of the applied liquid. Then the printed circuit boards arrive at a recei... | 10/11/1983 |
| 4381590 | Method for manufacturing a catalytic reactor carrier matrix A carrier matrix for use in the manufacture of a catalytic reactor for the purification of exhaust gases in an internal combustion engine of a motor vehicle is prepared by joining in wound form a corrugated steel sheet and a generally flat steel sheet, th... | 05/03/1983 |
| 4375271 | Soldering method for electric and or electronic component A soldering method comprises forming bubbles by blowing gas into a pool of molten solder, and striking the bubbles against a printed circuit board with electric and or electronic components temporarily fixed thereto to solder them to each other.... | 03/01/1983 |
| 4311265 | Soldering of printed circuit boards Carriers each holding a printed circuit board are conveyed successively through a soldering zone to dip each printed circuit board into molten solder contained in a vessel. The vessel is disposed between a pair of laterally spaced apart track members whic... | 01/19/1982 |
| 4311266 | Soldering apparatus An apparatus for soldering printed circuit boards includes a carrier adapted to support a printed circuit board and to be moved along a predetermined transfer path, preferably in the form of a closed loop; a pair of laterally spaced movable rails defining... | 01/19/1982 |
| 4285457 | Apparatus for soldering printed circuit boards An apparatus for soldering printed circuit boards includes carriers each adapted for holding a printed circuit board and conveyed successively through a soldering zone to dip each printed circuit board into molten solder contained in a vessel. The vessel ... | 08/25/1981 |
| 4139881 | Circuit board assembly and method of manufacturing the same A circuit board assembly comprising an electrically insulating circuit board of synthetic resin having at least one surface laminated with conductive sheet. An electric and/or electronic element, such as resistor or capacitor, of a type which has no lead ... | 02/13/1979 |
| 4076167 | Ultrasonic dip soldering process Apparatus for venting a plate fin coil during the ultrasonic soldering of aluminum return bend tubes to the heat exchange tubes in the coil. The apparatus includes a process snorkel member comprising a bored plug for telescoping inside an extension tube e... | 02/28/1978 |
| 4047655 | Liquid level control means and method A pressured gas in a control chamber is used to repetitively change the levels of liquid in a container up and down between two levels and holding at the two levels for predetermined time intervals to permit a function, such as a plurality of soldering op... | 09/13/1977 |
