Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 8181846 | Method of full-field solder coverage using a vacuum fill head A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area... | 05/22/2012 |
| 8162203 | Spherical solder reflow method The present disclosure relates to methods of making solder balls having a uniform size. More particularly, the disclosure relates to improved solder ball formation processes that prevent or reduce bridging/merging of two or more solder balls during reflow. The proce... | 04/24/2012 |
| 8011563 | Compliant mold fill head with integrated cavity venting and solder cooling A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configu... | 09/06/2011 |
| 7984841 | Member formed with coating film having tin as its main component, coating film forming method and soldering method A member having a coating film capable of suppressing whisker generation is provided. The coating film (3) including a plurality of crystalline grains (3a) made of tin or tin alloy is formed above the surface of the base member (1). An in... | 07/26/2011 |
| 7878387 | Magnetic particle containing material for fastening together parts or substrates In one exemplary embodiment, a high melting temperature fastening material may be prepared containing magnetic particles that is used to fasten two or more parts substrates together to form an integrated part. ... | 02/01/2011 |
| 7784673 | Rotational fill techniques for injection molding of solder A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavitie... | 08/31/2010 |
| 7757932 | Method for step-down transition of a solder head in the injection molding soldering process A method for dispensing solder bumps on a mold plate includes the steps of: relatively moving a fill head comprising an o-ring from a first location to a second location such that the o-ring decompresses as it crosses from the first location to the second location; ... | 07/20/2010 |
| 7513410 | Air bearing gap control for injection molded solder heads An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispen... | 04/07/2009 |
| 7497366 | Global vacuum injection molded solder system and method A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum... | 03/03/2009 |
| 7416104 | Rotational fill techniques for injection molding of solder A system and method for injection molding conductive bonding material into a plurality of cavities in a non-rectangular mold is disclosed. The method comprises aligning a fill head with a non-rectangular mold. The non-rectangular mold includes a plurality of cavitie... | 08/26/2008 |
| 7413109 | Joining of advanced materials by superplastic deformation A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The me... | 08/19/2008 |
| 7410092 | Fill head for injection molding of solder A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further include... | 08/12/2008 |
| 7410090 | Conductive bonding material fill techniques A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit sup... | 08/12/2008 |
| 7389903 | Device and method for soldering contacts on semiconductor chips A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A flushing device, h... | 06/24/2008 |
| 7360679 | Method for the production of a soldered connection A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 04/22/2008 |
| 7350686 | Method for supplying solder Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containin... | 04/01/2008 |
| 7347355 | Method for brazing metal components for use in medical equipment, metal assembly produced by the method and endoscope provided with the metal assembly A method for brazing two or more of stainless steel components for use in medical equipment, in which one component is joined to other component using a brazing material containing Au of which amount is 62.5 wt % or higher, the method comprising the steps of: a firs... | 03/25/2008 |
| 7347349 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 03/25/2008 |
| 7322511 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 01/29/2008 |
| 7316062 | Solder extraction tool and method Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus thereto where the electrical connector has at least one electrical co... | 01/08/2008 |
| 7300823 | Apparatus for housing a micromechanical structure and method for producing the same Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a photo-resist material structure surrounding the micromechanical structure ... | 11/27/2007 |
| 7234237 | Method for producing a protective cover for a device In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device an... | 06/26/2007 |
| 7216727 | Drilling bit for drilling while running casing A drill bit for drilling casing in a well bore. The drill bit is constructed from a combination of relatively soft and relatively hard materials. The proportions of the materials are selected such that the drill bit provides suitable cutting and boring of the well b... | 05/15/2007 |
| 7195144 | Method for production of a component On production of a component, two primary pieces must often be fixed together to give one piece. In order to achieve the above, it is important that the two primary pieces are oriented in a particular manner during the fixing process, which provides some difficultie... | 03/27/2007 |
| 7195145 | Electrical circuit apparatus and method for assembling same A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the g... | 03/27/2007 |
| 7086577 | Method of manufacturing a miniature X-ray device An emitter for a miniature X-ray apparatus comprises an insulating shell, an anode, and a cathode. The insulating shell includes a conical brazing surface, brazed to a conical brazing surface on the anode. The braze consists of a pure titanium layer and a pure tin l... | 08/08/2006 |
| 7073700 | Process and apparatus for applying brazing material to a metallic structure through the use of vibration A process and an apparatus for applying a brazing material to a metallic structure, especially a honeycomb body, include bringing the metallic structure into contact with a pulverulent brazing material in such a way that the brazing material at least partially adher... | 07/11/2006 |
| 7028882 | Process and apparatus for boiler tube panel welding and straightening An apparatus and process for depositing an overlay weld on a boiler tube panel comprising a plurality of tubes with adjacent tubes joined together with membranes therebetween, and then straightening the panel in response to bowing that occurs as a result of depositi... | 04/18/2006 |
| 7004376 | Solder printing mask, wiring board and production method thereof, electrooptical apparatus and production method thereof and electronic device and production method thereof There is provided a mask for use in printing solder on a plurality of terminals formed on a substrate so as to correspond to a plurality of terminals of an IC package. The mask has openings through which the solder is applied, and the openings are larger than the te... | 02/28/2006 |
| 6991150 | Method of build up welding to thin-walled portion A recess formed in close contact with a thin-walled portion 3a of a workpiece to store molten metal at a surfaced portion, a jig 4 manufactured from a material with a higher heat-resisting temperature than that of the molten metal and a satisfac... | 01/31/2006 |
| 6945447 | Thermal solder writing eutectic bonding process and apparatus A chip or die attachment process and related apparatus, in which a desired quantity of solder (7 or 17) is dispensed onto each, in turn, of a number of desired locations on a substrate (4 or 18), and then an integrated-circuit chip (10... | 09/20/2005 |
| 6939147 | Junction box and soldering method for printed circuit board of the junction box A printed circuit board junction box including an outer case and a printed circuit board. The outer case has a top cover and a bottom cover. The printed circuit board has female and male electrical terminals mounted in through-holes that extend from an upper surface... | 09/06/2005 |
| 6936494 | Processes for hermetically packaging wafer level microscopic structures A process for hermetically packaging a microscopic structure including a MEMS device is provided. The process for the present invention includes the steps of depositing a capping layer of sacrificial material patterned by lithography over the microscopic structure s... | 08/30/2005 |
| 6915942 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted ... | 07/12/2005 |
| 6910613 | Device and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 06/28/2005 |
| 6871775 | Process for soldering and connecting structure A barrier metal layer is provided on at least one of two electrodes, with one formed on a substrate and the other connected to an electronic component, so as to coat a base material of the electrode, which base material is made of a material containing Cu. Soldering... | 03/29/2005 |
| 6832714 | Heated filling device A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a beating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill ma... | 12/21/2004 |
| 6827254 | Turbine engine component having wear coating and method for coating a turbine engine component A turbine engine component includes a substrate and a wear coating on the substrate. The wear coating includes wear-resistant particles in a matrix phase, the wear-resistant particles being formed of chrome carbide or a cobalt alloy. Methods for forming a turbine en... | 12/07/2004 |
| 6820798 | Method for producing circuit arrangments The aim of the invention is to simplify and improve the production method for circuit arrangements that are mounted on a support element (5), said element having thermal through-platings (7) which are at least partially scaled by a screen printing proc... | 11/23/2004 |
| 6811073 | Method for connecting conductive members A method for connecting conductive members includes a step of providing a first conductive member, a step of providing a second conductive member, and a step of jetting droplets of molten metal so as to form a connecting portion which electrically connects the first... | 11/02/2004 |
