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| Number | Title | Issue Date |
| 7934635 | Method for manufacturing a body A body has at least one first metallic body part and one second metallic body part. The first body part is coated with a nickel-phosphor layer. The first and second body parts are assembled. The first and second body parts are heated such that a soldered connection ... | 05/03/2011 |
| 7874475 | Method for the planar joining of components of semiconductor devices and a diffusion joining structure A method for the planar joining of components of semiconductor devices involves coating the components with diffusion materials on their upper sides and rear sides, respectively. Subsequently, the components to be joined one on the other are introduced into a reduci... | 01/25/2011 |
| 7380698 | Method of connecting module layers suitable for the production of microstructure modules and a microstructure module A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base materia... | 06/03/2008 |
| 7381016 | Uncoated cutting tool using brazed-in superhard blank An uncoated cutting tool that comprises a body containing a pocket. A polycrystalline cubic boron nitride blank has a cutting tip. The blank is brazed into the pocket using a blaze alloy whereby there is a braze joint between the body and the polycrystalline cubic b... | 06/03/2008 |
| 7368035 | Method for brazing and adhesive bonding An improved method for joining together the edge portions of first and second panels includes applying a heat curable adhesive along the edge portion of the first panel and then abutting the edge portion of the second panel with the edge portion of the first panel s... | 05/06/2008 |
| 7368326 | Methods and apparatus to reduce growth formations on plated conductive leads A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal... | 05/06/2008 |
| 7367489 | Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time suff... | 05/06/2008 |
| 7364622 | Method and apparatus for fabricating a device, and the device and an electronic equipment The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has... | 04/29/2008 |
| 7361593 | Methods of forming vias in multilayer substrates Exemplary embodiments of the present invention illustrate methods to electrically connect multiple layers of a substrate. A first and second layer each has at least one electrical trace on a surface thereof. The substrate includes an interposer structure attached to... | 04/22/2008 |
| 7360677 | Spot joining method of metal members and spot joining apparatus of metal members In a spot joining method and apparatus, pressing force of a rotating tool is maintained at a first pressing force, the frictional heat due to the rotation of the rotating tool is generated on a surface of an aluminum plate, and the aluminum plate is softened by this... | 04/22/2008 |
| 7361988 | Apparatuses and methods to route line to line Various methods and apparatuses are described in which a printed circuit board has trace lines. Input/output pads on the printed circuit board may have approximately the same width dimension as a trace line connected to those input/output pads. A first group of vias... | 04/22/2008 |
| 7357293 | Soldering an electronics package to a motherboard In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of... | 04/15/2008 |
| 7353976 | Wire bonder A Wire Bonder contains a bondhead and a rocker arranged on the bondhead that is rotatable on a horizontal axis. A horn with a flange is attached to the rocker in which a capillary is clamped. At least one sensor is attached to the bondhead that detects vibrations of... | 04/08/2008 |
| 7353954 | Tray flipper and method for parts inspection Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconduc... | 04/08/2008 |
| 7350684 | Apparatus and method for forming bump A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal... | 04/01/2008 |
| 7347349 | Apparatus and method for printing micro metal structures A method and device for printing liquid material such as liquid solder is provided. C4 structures as small as 10 microns in diameter can be produced using devices and methods described above. Further, devices and methods provided are able to operate at temperatures ... | 03/25/2008 |
| 7348270 | Techniques for forming interconnects A method for forming interconnects onto attachment points of a wafer includes the steps of providing a mold with a plurality of cavities having a predetermined shape, depositing a release agent on surfaces of the cavities, filling the cavities with an interconnect m... | 03/25/2008 |
| 7348261 | Wafer scale thin film package A chip module having a chip with a flexible multilayer redistribution thin film attached thereto for connection to a substrate. The thin film acts as both a redistribution medium with multiple layers of redistribution metallurgy for chip power and signals and as a c... | 03/25/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7347348 | Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stenci... | 03/25/2008 |
| 7341175 | Bonding of light emitting diodes having shaped substrates Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do... | 03/11/2008 |
| 7332424 | Fluxless solder transfer and reflow process Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately ... | 02/19/2008 |
| 7331502 | Method of manufacturing electronic part and electronic part obtained by the method In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be co... | 02/19/2008 |
| 7328831 | Method of making a brazed metal article and the article formed thereby A method of making an article that is comprised of a metal foam in contact with a base metal by an intermediate braze composition, in particular, a method of brazing a metal foam to a base metal via a braze composition. In one preferred method, a polymeric foam is c... | 02/12/2008 |
| 7321172 | Selective plating of package terminals In one embodiment, a method including providing a semiconductor pad package having a first pad and a second pad is disclosed. A first layer comprising a first metal is deposited on the first pad using a first process. A second metal is then deposited on the first pa... | 01/22/2008 |
| 7311242 | Design of an insulated cavity The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two silicon wafers [WA]... | 12/25/2007 |
| 7311239 | Probe attach tool A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the ... | 12/25/2007 |
| 7293689 | Two tier brazing for joining copper tubes to manifolds A brazing process for joining copper and copper alloy tubes to a fitting which includes first forming a layer of a high melting temperature noble metal on one end of a copper or copper alloy tube. The plated end is then brazed to a metal ferrule to form a copper all... | 11/13/2007 |
| 7288471 | Bumping electronic components using transfer substrates A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic compo... | 10/30/2007 |
| 7275676 | Apparatus for locating conductive spheres utilizing screen and hopper of solder balls Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop thr... | 10/02/2007 |
| 7273806 | Forming of high aspect ratio conductive structure using injection molded solder Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention ... | 09/25/2007 |
| 7268303 | Circuit board, mounting structure of ball grid array, electro-optic device and electronic device In a circuit board including a pad for mounting a ball grid array and a wiring, a mounting structure of the ball grid array, an electro-optic device, and an electronic device, the circuit board includes a pad for mounting the ball grid array, a wiring for connecting... | 09/11/2007 |
| 7261784 | Method of making a coating on a metal substrate and/or an article, such a coating, such a metal substrate and/or an article, and a cam forming such an article The method of the invention enables a coating to be made on at least one face to be protected of a metal substrate and/or article in order to improve its performance in terms of resistance to wear by friction, in particular at high temperature. The method comprises ... | 08/28/2007 |
| 7259033 | Flip-chip bonding of light emitting devices Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submoun... | 08/21/2007 |
| 7256069 | Wafer-level package and methods of fabricating A carrier for use in a chip-scale package, including a polymeric film with apertures defined therethrough. The apertures, which are alignable with corresponding bond pads of a semiconductor device, each include a quantity of conductive material extending substantial... | 08/14/2007 |
| 7249411 | Methods for mounting surface-mounted electrical components Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. E... | 07/31/2007 |
| 7242099 | Chip package with multiple chips connected by bumps A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pil... | 07/10/2007 |
| 7222772 | Flip chip bonder A flip chip bonder including a substrate holding mechanism and a chip die bonder for bonding a semiconductor chip having a plurality of electrodes projecting from its front surface to a substrate held on the substrate holding means. The flip chip bonder includes a c... | 05/29/2007 |
| 7211890 | Integrating thermoelectric elements into wafer for heat extraction An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bond... | 05/01/2007 |
| 7211888 | Encapsulation of pin solder for maintaining accuracy in pin position Solder joints coupling pins to a microelectronic package substrate are enshrouded with an encapsulation material. In this manner, pin movement is limited even if the pin solder subsequently melts. ... | 05/01/2007 |
