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| Number | Title | Issue Date |
| 7366740 | Systems and methods for automatic maintenance and repair of enitites in a data model The present invention is directed a logical consistency checker (LCC) working alone or in conjunction with a physical consistency checker (PCC) and/or a data reliability system (DRS) for a database files system of a hardware/software interface system. Logical data c... | 04/29/2008 |
| 7311240 | Electrical circuits with button plated contacts and assembly methods Exemplary methods for making a solder joint between two articles are disclosed. The method includes the steps of positioning a first article and a second article to be soldered together. At least one of the first article and the second article has at least one butto... | 12/25/2007 |
| 7273806 | Forming of high aspect ratio conductive structure using injection molded solder Methods of forming a conductive structure on a substrate prior to packaging, and a test probe structure generated according to the method, are disclosed. The conductive structure includes a high aspect ratio structure formed by injected molded solder. The invention ... | 09/25/2007 |
| 7197817 | Method for forming contact bumps for circuit board Disclosed is a method of forming bump electrodes on wired circuit boards. A high-concentration impurity Si template doped with boron and having a pit formed therein is prepared. A plated resist is formed on the high-concentration impurity Si template and an opening ... | 04/03/2007 |
| 7078821 | Ball film for integrated circuit fabrication and testing According to one embodiment of the invention, a method of fabricating ball grid array packages includes providing a substrate, providing a ball film that includes a plurality of metal balls movably contained within respective slots of a thin film, coupling the metal... | 07/18/2006 |
| 7045389 | Method for fabricating a semiconductor devices provided with low melting point metal bumps A semiconductor device (1) comprising electrodes formed on a semiconductor chip (2) and bumps (3) which consist of a low melting point metal ball spherically formed and having a given size and which are adhesive bonded to the electrodes (5 | 05/16/2006 |
| 7045388 | Semiconductor device provided with low melting point metal bumps A semiconductor device (1) comprising electrodes formed on a semiconductor chip (2) and bumps (3) which consist of a low melting point metal ball spherically formed and having a given size and which are adhesive bonded to the electrodes (5 | 05/16/2006 |
| 7015132 | Forming an electrical contact on an electronic component A method of constructing an electrical contact on an electronic component comprises first forming a protruding electrically conducting stud at a contact location by wire bonding a metal wire to a contact pad of the component. The stud is then contacted with solder, ... | 03/21/2006 |
| 6945448 | Method for attaching a porous metal layer to a metal substrate A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structur... | 09/20/2005 |
| 6910615 | Solder reflow type electrical apparatus packaging having integrated circuit and discrete components In a solder reflow type building of modular electrical apparatus involving integrated circuit and discrete components, fabrication operations are arranged to include the providing of a general type series of steps for each component element involving a reflow or joi... | 06/28/2005 |
| 6889890 | Brazing-filler material and method for brazing diamond When a diamond is brazed to a metal substrate, while obtaining a stable joining strength, a joined interface of the diamond is not eroded to provide a good joint with a beautiful view. A brazing-filler material containing at least one selected from a group consistin... | 05/10/2005 |
| 6783870 | Self-brazing materials for elevated temperature applications This invention describes the roll bonding of Al and Ni-bearing Cu alloys to suitable substrates to produce self-brazing materials for the elevated temperature, aggressive environment application. The Al and Ni-bearing Cu alloy for the self-brazing layers can be obta... | 08/31/2004 |
| 6732914 | Braze system and method for reducing strain in a braze joint A system for joining a pair of structural members having widely differing coefficients of thermal expansion is disclosed. A mechanically “thick” foil is made by dispersing a refractory metal powder, such as molybdenum, niobium, tantalum, or tungsten into a quant... | 05/11/2004 |
| 6726086 | Liquid phase diffusion bonding to a superalloy component A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle ... | 04/27/2004 |
| 6722558 | Method of soldering metallic terminals A system and method of joining together first and second electric terminals includes providing the second terminal with an aperture extending therethrough and a notch therein. The first and second terminals are positioned in overlapping relationship with one another... | 04/20/2004 |
| 6652677 | Process of welding gamma prime-strengthened nickel-base superalloys A process for welding superalloys, and particularly articles formed of gamma prime-strengthened nickel-base superalloys whose chemistries and/or microstructures differ. The process entails forming the faying surface of at least one of the articles to have... | 11/25/2003 |
| 6543675 | Method for soldering an exhaust gas heat exchanger The invention concerns a method whereby a soldering joint is applied on one of the surfaces of a collector plate (2, 3) before inserting the ends of the tube to be assembled thereto, in the form of a flexible adhesive previously perforated to correspond t... | 04/08/2003 |
| 6454159 | Method for forming electrical connecting structure Recesses are formed in a solder transfer plate and filled with solder. Core bumps of an electronic component are brought into contact with the solder in the recesses, and thereby the metal contained in the solder in the recesses is melted. The electrical ... | 09/24/2002 |
| 6427903 | Solder ball placement apparatus An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern... | 08/06/2002 |
| 6371360 | Method for applying brazing material to metal structures with an adhesive material having different states A method for applying brazing material to metal structures is used, in particular, for honeycomb bodies of exhaust gas catalytic converters. The brazing material is applied in the form of a powder and is firmly held to the metal structures through the use... | 04/16/2002 |
| 6276599 | Method and apparatus for forming solder bumps A method of forming solder bumps on pads formed on a surface of a base material includes the steps of supplying solder to a template having a number of through holes formed to correspond to the pads of the base material respectively so that the through ho... | 08/21/2001 |
| 6260754 | Method of making a vacuum-tight continuous cable feedthrough device A vacuum-tight cable feedthrough device includes a metallic first flange that is penetrated by a slot. Passing through the slot is a flat stripline cable that includes a plurality of conductive signal channels encompassed by a dielectric material on whose... | 07/17/2001 |
| 6254923 | Solder particle deposition Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 an... | 07/03/2001 |
| 6193139 | Method for joining metals by soldering The invention relates to a method for joining coated metallic conductors and the application of the method to production of very high density microjoints as well as to the fabrication of macrojoints. It is characteristic for the invention that the surface... | 02/27/2001 |
| 6193143 | Solder bump forming method and mounting apparatus and mounting method of solder ball To present a method and apparatus for forming favorable solder bumps on a substrate of electronic component or the like, in which metal paste is applied on the lower surface of solder balls attracted by a suction tool, and the solder balls are positioned ... | 02/27/2001 |
| 6170737 | Solder ball placement method An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern... | 01/09/2001 |
| 6112976 | Method of manufacturing wire segments of homogeneous composition The disclosed invention provides for a method of manufacturing solder columns for particular use in attaching substrates to a printed circuit board. The method results in columns of homogeneous composition and thus overcomes problems associated with the p... | 09/05/2000 |
| 6068176 | Brazing alloy transfer tape having a visually distinctive carrier A brazing transfer alloy tape which includes a carrier layer that may be easily seen by the operator so that it may be removed before brazing is provided. The brazing tape consists essentially of a brazing alloy layer having two opposing surfaces, a press... | 05/30/2000 |
| 6056191 | Method and apparatus for forming solder bumps The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a sol... | 05/02/2000 |
| 6056190 | Solder ball placement apparatus An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern... | 05/02/2000 |
| 6029882 | Plastic solder array using injection molded solder Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry... | 02/29/2000 |
| 6021940 | Method and apparatus for reflow soldering metallic surfaces The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed include (1) the metallic substrate on which an at least par... | 02/08/2000 |
| 6015082 | Method for joining metals by soldering The invention relates to a method for joining coated metallic conductors and the application of the method to production of very high density microjoints as well as to the fabrication of macrojoints. It is characteristic for the invention that the surface... | 01/18/2000 |
| 5971255 | Process and apparatus for production of metallic honeycomb body for supporting catalyst In the production of a metallic honeycomb body for use as a metallic carrier, for supporting a catalyst, in the purification of an exhaust gas from automobiles or the like, a desired joint site for each layer constituting the metallic honeycomb body is pr... | 10/26/1999 |
| 5941449 | Method of making an electronic package having spacer elements A method of precisely positioning a quantity of conductive spacers (e.g., spherically shaped solder balls) on respective conductive pads (e.g., copper pads) of an underlying substrate (e.g., an FR4 printed circuit board or flexible circuit member) wherein... | 08/24/1999 |
| 5788143 | Solder particle deposition Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 an... | 08/04/1998 |
| 5765744 | Production of small metal bumps A process of producing small metal bumps includes the steps of simultaneously holding small metal balls on an arrangement baseplate in the positions corresponding to those of electrodes of a semiconductor chip, a film carrier, or a substrate; aligning the... | 06/16/1998 |
| 5749510 | Semiconductor chip bonding method A chip mounting section "H", defined on a flush surface of a substrate 1, is dissected into a plurality of subsections "E"--"E". Bond 2 is applied within the chip mounting section "H" on the flush surface of substrate 1 in a discrete manner so that a plur... | 05/12/1998 |
| 5718361 | Apparatus and method for forming mold for metallic material The present invention relates generally to a new apparatus and method for molding metallic materials, such as, for example, solder. More particularly, the invention encompasses an apparatus that is used to form metallic interconnections, such as, for exam... | 02/17/1998 |
| 5680985 | Reflow process for mixed technology on a printed wiring board This invention relates to a method of combining a plurality of surface mount technology components and at least one plated through-hole component on a printed wiring board. The method includes applying to a secondary side of the printed wiring board a fir... | 10/28/1997 |
