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| Number | Title | Issue Date |
| 7157150 | Brazing titanium to stainless steel using layered particulate A method of bonding a stainless steel part to a titanium part by heating a component assembly comprised of the titanium part, the stainless steel part, and a compact titanium-nickel filler material placed between the two parts and heated at a temperature that is les... | 01/02/2007 |
| 7156284 | Low temperature methods of bonding components and related structures Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of bo... | 01/02/2007 |
| 7097090 | Solder ball A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder... | 08/29/2006 |
| 7088074 | System level device for battery and integrated circuit integration A system level device for battery and integrated circuit chip integration comprises at least one battery; at least one integrated circuit chip powered by the at least one battery; and a package connected to any of the at least one battery and the at least one integr... | 08/08/2006 |
| 7066378 | Filling device A delivery system a soldering paste to an electronics package includes a pressurized supply of via fill paste and a pressure head attached to the pressurized supply of via fill paste. The pressure head includes a main body and a wear portion. Attached to the wear po... | 06/27/2006 |
| 7036573 | Polymer with solder pre-coated fillers for thermal interface materials A thermal interface material made of a binder material and a fusible filler. ... | 05/02/2006 |
| 7022415 | Layered sphere braze material The invention is a method of bonding a ceramic part (6) to a metal part (4) by heating a component assembly (2) comprised of the metal part (4), the ceramic part (6), and a thin laminated interlayer material (8) placed betwe... | 04/04/2006 |
| 7017795 | Solder pastes for providing high elasticity, low rigidity solder joints Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity w... | 03/28/2006 |
| 6986454 | Electronic package having controlled height stand-off solder joint An electronic package (10) is provided which includes a circuit board (12) having a substrate (14) and circuitry (16) and a surface mount device (22) having a contact terminal (24). A mounting pad (28) is formed on th... | 01/17/2006 |
| 6974070 | Joining of advanced materials by superplastic deformation A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The me... | 12/13/2005 |
| 6940168 | Enhanced pad design for substrate A ball grid array electronic package is attached to a substrate by means of solder balls and solder paste. Connection is made between a contact on the ball grid array and a solder ball by means of a first joining medium, such as a solder paste. Connection is made be... | 09/06/2005 |
| 6915944 | Soldering flux, solder paste and method of soldering The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher density, components are further miniaturized or components are mounted with ... | 07/12/2005 |
| 6854633 | System with polymer masking flux for fabricating external contacts on semiconductor components A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contac... | 02/15/2005 |
| 6839955 | Method of making a multilayer inductor In the multilayer inductor, the substrate thereof is composed of a constituent belonging to spinel ferrite, and is furnished with internal conductors of a main constituent being silver at the interior of the substrate. The internal conductors are drawn outside of th... | 01/11/2005 |
| 6726086 | Liquid phase diffusion bonding to a superalloy component A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle ... | 04/27/2004 |
| 6659332 | Directionally solidified article with weld repair A directionally solidified nickel-base superalloy article has a defect therein extending parallel to the solidification direction. The article is repaired by removing any foreign matter present in the defect, and then heating the article to a repair tempe... | 12/09/2003 |
| 6638363 | Method of cleaning solder paste A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A ... | 10/28/2003 |
| 6541075 | Method for forming a thermal barrier coating system An article includes a substrate and an adhesion layer overlying the substrate. The adhesion layer includes a first phase including particles, and a second phase including braze alloy that bonds the particles to the substrate. The article further includes ... | 04/01/2003 |
| 6523235 | Method of manufacturing a ceramic capacitor A method of manufacturing a ceramic capacitor relates to a ceramic capacitor having metal plate terminals that absorb thermal stress and mechanical stress caused by flexure of the substrate. A ceramic capacitor element is provided with terminal electrodes... | 02/25/2003 |
| 6491207 | Weld repair of directionally solidified articles A directionally solidified nickel-base superalloy article has a defect therein extending parallel to the solidification direction. The article is repaired by removing any foreign matter present in the defect, and then heating the article to a repair tempe... | 12/10/2002 |
| 6425517 | Method for applying a brazing medium to a configuration A method for applying a brazing medium to a configuration, which includes a honeycomb body and a jacket pipe, is described. First, the honeycomb body is formed by stacking and/or winding of sheet metal layers. At least some of which are structured sheet m... | 07/30/2002 |
| 6398099 | Apparatus for manufacturing plug and method of manufacturing the same An apparatus for manufacturing a plug and the manufacturing method. The method includes the following steps. A baseplate located in the bottom of a closed printing chamber is provided. A printed circuit board and a stencil are mounted on the baseplate in ... | 06/04/2002 |
| 6390355 | Method for forming a metallic contact on an electronic printed circuit board and a product therefrom A method for forming a metallic contact and manufacturing a product having an electronic component 101 and a printed circuit board 100 (PCB) includes dispensing a slurry solder paste mixture 104 including a metallic powder 105 and an acidic fluid 106, pla... | 05/21/2002 |
| 6390354 | Adhesive composition for bonding different kinds of members A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two ... | 05/21/2002 |
| 6390356 | Method of forming cylindrical bumps on a substrate for integrated circuits A method of forming cylindrical bumps on a substrate for integrated circuits includes the steps of: forming copper circuits on a board of a substrate by means of electroplating; covering said board with a screening material; forming openings in said scree... | 05/21/2002 |
| 6383305 | Method for the making soldering flux and resulting weld joint To improve the resistance of a solder to strains, especial thermal strains, superelastic particles are incorporated into the solder in a proportion by volume of 10 to 30% approximately. So that this incorporation can be done, the particles are coated with... | 05/07/2002 |
| 6360939 | Lead-free electrical solder and method of manufacturing A method of manufacturing a lead-free electrical solder paste having primary solder powder and an additive metal powder component that does not melt during the soldering process. Metal powders may be either elemental metal or a metal alloy. The primary po... | 03/26/2002 |
| 6340113 | Soldering methods and compositions Soldering methods and compositions are disclosed to provide electrical connections between surfaces with reduced likelihood of short circuits or solder-starved joints. Two component solder compositions are employed to preferably form "metallic foam" joint... | 01/22/2002 |
| 6331681 | Electrical connection device for forming and semiconductor device having metal bump electrical connection Electrical connection device for forming electrical connection between a first portion and a second portion of a semiconductor device. The first portion is set near or in contact with the second portion. The first and second portions are electrically conn... | 12/18/2001 |
| 6276597 | Tip cap hole brazing and oxidation resistant alloy therefor A tip cap hole is loaded with a first composition comprising particles of a first alloy having a solidus temperature above the brazing temperature. The first composition is covered with a second composition comprising particles of a second alloy having a ... | 08/21/2001 |
| 6247640 | Conductive particle arranging device and conductive particle transferring method using the same A device for arranging conductive particles in a preselected pattern for the connection of electric circuit boards or electric parts is disclosed. Particularly, a device capable of surely and efficiently transferring, e.g., solder bumps to the electrode p... | 06/19/2001 |
| 6223976 | Process for the assembly or refacing of titanium aluminide articles by diffusion brazing A process for assembling titanium aluminide articles by diffusion brazing comprises the following steps: (a) Preparation of a homogenous mixture of a titanium aluminide powder A of 40 to 90 weight % and a powder B chemically wetting A and having an apprec... | 05/01/2001 |
| 6193144 | Paste providing method, soldering method and apparatus and system therefor An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each... | 02/27/2001 |
| 6186392 | Method and system for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder... | 02/13/2001 |
| 6099935 | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices An apparatus for use in manufacturing a semiconductor device having input-output (IO) lands arranged in an IO array on an IO face includes a body having a plurality of cavities extending from an operating face into the body; the cavities are arranged in a... | 08/08/2000 |
| 6027012 | Method for making metal frameworks for dental protheses The present invention relates to a method for making metal frameworks for dental protheses: of the type comprising metallic cops, optionally coated with resin or ceramic material, designed to be anchored in the mouth directly onto the stump of the tooth o... | 02/22/2000 |
| 5975407 | Method using a thick joint for joining parts in SiC-based materials by refractory brazing and refractory thick joint thus obtained A method of joining at least two parts in silicon carbide based material by refractory brazing in which these parts are brought into contact with an intermetallic braze alloy and said parts and braze alloy are heated to a braze temperature equivalent to t... | 11/02/1999 |
| 5855314 | Abrasive tool containing coated superabrasive grain An abrasive grit for a metal bonded Single Layer abrasive tool includes abrasive grains coated with a first active component. The active component is mechanically-bound to the surface of the superabrasive grains. Preferably the abrasive is a superabrasive... | 01/05/1999 |
| 5806751 | Method of repairing metallic alloy articles, such as gas turbine engine components A method of repairing a metallic alloy article having a defect cavity greater than about 0.010 inches (2.5×10-4 m) in maximum width is disclosed. One aspect of the invention includes providing a first metallic filler material (10) in the defec... | 09/15/1998 |
| 5803340 | Composite solder paste for flip chip bumping Composite solder paste compositions adapted to be deposited using a dry film photoresist mask to form solder joints for flip chip integrated circuit devices. The composite solder paste compositions are characterized by the ability to flow at a first tempe... | 09/08/1998 |
