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| Number | Title | Issue Date |
| 8136716 | Soldering work piece, soldering method and heat exchanger The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the soldering work piece is provided with an artificially applied oxide layer... | 03/20/2012 |
| 8123111 | Production method of solder circuit board A method for producing a solder circuit board includes imparting tackiness to a surface of a conductive circuit electrode provided on a printed wiring board to form a tackiness-imparted area. depositing solder powder on the tackiness-imparted area and heating the pr... | 02/28/2012 |
| 8109432 | Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet pr... | 02/07/2012 |
| 8038051 | Method for production of electronic circuit board A method for the deposition of a soldering powder to an electronic circuit board includes the steps of imparting stickiness to an exposed metal surface of a substrate and depositing a soldering powder to the resultant sticking part in a liquid body. The method can f... | 10/18/2011 |
| 7926700 | Solder pastes comprising nonresinous fluxes According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel accor... | 04/19/2011 |
| 7918382 | Method for attaching a porous metal layer to a metal substrate A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, c... | 04/05/2011 |
| 7891540 | Soldering work piece, soldering method and heat exchanger The invention relates to a soldering work piece made of aluminium and/or aluminium compounds, to a soldering method, in addition to a heat exchanger soldered in said manner. One surface of the soldering work piece is provided with an artificially applied oxide layer... | 02/22/2011 |
| 7775417 | Method of producing conductive circuit board A method of producing a conductive circuit board including imparting tackiness through the use of a tackiness-imparting compound to the surface of the conductive circuit on a printed wiring board, attaching a solder powder to the tacky area and then heating the prin... | 08/17/2010 |
| 7775416 | Microwave brazing process A process for heating a braze alloy by microwave radiation so that heating of the alloy is selective and sufficient to cause complete melting of the alloy and permit metallurgical bonding to a substrate on which the alloy is melted, but without excessively heating t... | 08/17/2010 |
| 7770781 | Bonding method At a comparatively early stage, members to be bonded are pressurized together by an applied pressure that is a comparatively low pressure. Under an applied pressure condition (a gas venting process) of the comparatively low pressure, an organic protective film is va... | 08/10/2010 |
| 7766218 | Pasty silver particle composition, process for producing solid silver, solid silver, joining method, and process for producing printed wiring board To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the li... | 08/03/2010 |
| 7681779 | Method for manufacturing electric connections in wafer A method for manufacturing electrical connections in wafer is provided. A plurality of openings is formed on the upper surface of a wafer by dry etching or laser drilling and then solder paste is applied to the openings. Next, the wafer is positioned in a vacuum env... | 03/23/2010 |
| 7624910 | Perforated composites for joining of metallic and composite materials Embodiments in the present invention provide a system and method of joining structural members. This method involves aligning the first structural member to a metallic substrate when the first structural member has at least one tapered hole or cavity. A metallic or ... | 12/01/2009 |
| 7604154 | Thermosetting flux and solder paste The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste cont... | 10/20/2009 |
| 7604153 | Forming solder balls on substrates A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverte... | 10/20/2009 |
| 7419086 | Low cost brazes for titanium A braze material and method of brazing titanium metals. The material may consist of Ti, Ni, Cu Zr, PM and M where PM is a precious metal and M may be Fe, V, Cr, Co, Mo, Nb, Mn, Si, Sn, Al, B, Gd, Ge or combinations thereof, with the (Cu+PM)/Ni ratio around 0.9. Opti... | 09/02/2008 |
| 7416106 | Techniques for creating optimized pad geometries for soldering A technique for processing a circuit board involves placing a mask layer on the circuit board, where the mask layer defines a set of pad profiles for a component mounting location. Each pad profile has a set of rounded corners. The technique further involves forming... | 08/26/2008 |
| 7416108 | High strength diffusion brazing utilizing nano-powders A braze material (10) including nano-sized filler material particles (14). The nano-sized particles will melt at a temperature significantly lower than the micron-sized particles used in prior art braze materials, thereby eliminating or reducing the ne... | 08/26/2008 |
| 7413109 | Joining of advanced materials by superplastic deformation A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The me... | 08/19/2008 |
| 7410091 | Method of integrated circuit assembly A method of integrated circuit assembly before encapsulation including at least one step of soldering, under mechanical pressure, a first element on a second element, including temporarily maintaining a predetermined spacing, at least partially without solder paste,... | 08/12/2008 |
| 7410090 | Conductive bonding material fill techniques A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit sup... | 08/12/2008 |
| 7404511 | Laser trimming problem suppressing semiconductor device manufacturing apparatus and method A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer subs... | 07/29/2008 |
| 7401725 | System and method for improving hard drive actuator lead attachment A system and method are disclosed for improving hard drive actuator lead attachment. In one embodiment, an actuator board is coupled to an actuator flexible cable by a bonding agent, such as an anisotropic conductive film (ACF). In one embodiment, an actuator flexib... | 07/22/2008 |
| 7401726 | Brazing method For integrally bonding a first member and a second member made of copper or a copper alloy by brazing, a paste brazing material composed essentially of copper (Cu), tin (Sn), nickel (Ni) and phosphorus (P) is beforehand applied to at least one of the first and secon... | 07/22/2008 |
| 7398912 | Different materials bonded member and production method thereof A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given... | 07/15/2008 |
| 7392930 | Iron-based braze filler metal for high-temperature applications Brazing filler metal compositions have excellent wettability to nickel/cobalt/iron-based base metals and produce braze joints with high strength and heat/corrosion resistance. The iron-based braze filler metal includes chromium in amounts between about 20 to 35 perc... | 07/01/2008 |
| 7387230 | Brazing filter metal sheet and method for production thereof In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form the brazing filler metal composition. By powder roll compaction of the ... | 06/17/2008 |
| 7387690 | Repair process In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium a... | 06/17/2008 |
| 7380700 | Paste composition for brazing and brazing method using the same The invention provides a paste composition for brazing, which upon brazing, does not cause brazing insufficiency such as residual carbon in any type of industrial brazing furnace, can achieve an excellent outward appearance of a brazed portion after brazing and can ... | 06/03/2008 |
| 7377417 | Repair process In accordance with the present invention, a process for repairing metal workpieces, such as turbine engine components, is provided. The process comprises the steps of forming a braze paste containing a first nickel base alloy material containing boron and chromium a... | 05/27/2008 |
| 7371988 | Methods for extending the life of alloy steel welded joints by elimination and reduction of the HAZ In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first meta... | 05/13/2008 |
| 7367099 | Method for assembling two parts having accurate dimensions and use for brazing of a linac RFQ accelerator A method of assembling two parts of which the dimensions of one of the parts or the final assembly are to be adhered to with precision. In the part whose dimensions are to be adhered to with the highest level of precision, a groove is machined to have a depth greate... | 05/06/2008 |
| 7360307 | Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit ... | 04/22/2008 |
| 7357294 | Method for mounting a semiconductor package onto PCB A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed... | 04/15/2008 |
| 7354659 | Method for fabricating large dimension bonds using reactive multilayer joining A method for joining component bodies of material over bonding regions of large dimensions by disposing a plurality of substantially contiguous sheets of reactive composite materials between the bodies and adjacent sheets of fusible material. The contiguous sheets o... | 04/08/2008 |
| 7347348 | Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece Stenciling machines and methods for forming solder balls on microelectronic workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stenci... | 03/25/2008 |
| 7342749 | Method of removing lead-free solder from slider pad and magnetic disk drive A method for removing a lead-free solder from a slider pad is provided to permit re-utilization of a head/slider used in a magnetic disk drive. In one embodiment, a slider pad formed on a head/slider and a lead pad are connected to each other through a lead-free sol... | 03/11/2008 |
| 7331500 | Solder bumps formation using solder paste with shape retaining attribute Method of forming solder bumps of an integrated circuit package is described. A solder paste is formed from a material having a characteristic that the deposited instances thereof substantially retain their geometric shape upon exposure to electromagnetic radiation.... | 02/19/2008 |
| 7331499 | Manufacturing method for a ceramic to metal seal A method of bonding a ceramic part to a metal part by heating a component assembly including the metal part, the ceramic part, and a thin essentially pure interlayer material placed between the two parts heated at a temperature that is greater than the temperature o... | 02/19/2008 |
| 7331503 | Solder printing process to reduce void formation in a microvia In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the seco... | 02/19/2008 |
