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| Number | Title | Issue Date |
| 8348139 | Composite solder alloy preform Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating l... | 01/08/2013 |
| 8328077 | PV cell mass reflow In one embodiment, a method for soldering photovoltaic solar cells includes providing a first and second PV cell, a holder, soldering ribbon and a mass reflow oven. The method further includes placing the soldering ribbon in a fixture groove in the holder. The metho... | 12/11/2012 |
| 8322596 | Wiring substrate manufacturing method A wiring substrate manufacturing method includes: preparing a wiring substrate including a core layer having a principal surface, a resin insulating layer and a conductor layer alternately laminated to form at least one laminated layer on the one principal surface o... | 12/04/2012 |
| 8141770 | Conductive ball mounting method and surplus ball removing apparatus A surplus ball removing apparatus including a substrate stage, a substrate including a connection pad, a mask with opening to supply conductive ball onto the substrate, a surplus ball adhering head for removing surplus ball mounted on the substrate, adhering head mo... | 03/27/2012 |
| 8091766 | Method and apparatus for loading solder balls A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board... | 01/10/2012 |
| 7971772 | Method of brazing pipe member to counterpart member A method of brazing a pipe member to a counterpart member includes steps of mounting in a circumferential direction an engaging portion in a ring shape to an outer periphery of the pipe end portion proximate an endmost portion of the pipe member, engaging a brazing-... | 07/05/2011 |
| 7845549 | MIM braze preforms A method of making a braze preform includes: providing a mixture of a brazing alloy in metallic powder form and a binder; melting the binder and forming the mixture into a preform having a preselected shape; removing a majority of the binder from the preform; and he... | 12/07/2010 |
| 7793820 | Solder preform and a process for its manufacture A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded... | 09/14/2010 |
| 7717317 | Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method The present invention relates to a ball capturing apparatus and method of capturing one ball from plural balls having the same size, and to a solder ball disposing apparatus and method of disposing a solder ball containing solder in a predetermined position on a cir... | 05/18/2010 |
| 7717316 | Method and device for applying a solder to a substrate A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by the action of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has... | 05/18/2010 |
| 7703663 | Device and method for brazing a heat pipe The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an... | 04/27/2010 |
| 7658315 | Process of brazing superalloy components A process for brazing components formed of superalloys that contain elements prone to oxidation during brazing. At least one braze tape is applied to at least one faying surface of at least a first of the components being joined by brazing. The braze tape comprises ... | 02/09/2010 |
| 7654438 | Copper-based brazing alloy and brazing process The invention proposes a brazing alloy, which can be produced in particular as a homogenous, ductile, amorphous brazing foil and consists of 2 to 20 atom % of nickel, 2 to 12 atom % of tin, 0.5 to 5.0 atom % of zinc, 6 to 16 atom % of phosphorus, remainder copper an... | 02/02/2010 |
| 7644856 | Solder ball mounting method and solder ball mounting apparatus A solder ball mounting method includes a step of providing a flux on electrodes of a substrate, a step of arranging a plurality of solder ball mounting masks in which ball feeding openings are formed in positions opposing to the electrodes and opening areas of the b... | 01/12/2010 |
| 7644855 | Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a β′ phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed when the above described special ... | 01/12/2010 |
| 7614541 | Method and apparatus for placing conductive balls An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arran... | 11/10/2009 |
| 7565996 | Transient liquid phase bonding using sandwich interlayers Systems and methods for transient liquid phase bonding are described herein. Embodiments of these systems and methods utilize sandwich interlayers to produce stronger, more homogeneous bonds than currently possible. These sandwich interlayers have a middle bonding l... | 07/28/2009 |
| 7559455 | Diebond strip A titanium alloy strip which has a reduced cross section in the central region of the strip. By concentrating heat in this central region the process of bonding laser devices to a substrate is greatly improved. Furthermore, the titanium alloy strip allows for the po... | 07/14/2009 |
| 7523852 | Solder interconnect structure and method using injection molded solder Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have... | 04/28/2009 |
| 7475803 | Solder ball loading method and solder ball loading unit background of the invention Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder balls 78s are gathered by sucking air from a loading cylinder 24 located above a ball arranging mask 16. The gathered solder balls 78... | 01/13/2009 |
| 7458499 | Apparatus and method for filling a ball grid array template An apparatus and method for filling a ball grid array template is disclosed. The apparatus comprises a normally horizontal base plate with the ball grid array template being mounted onto the base plate at one end. A solder ball supply bin is slidably mounted over th... | 12/02/2008 |
| 7441688 | Methods and device for controlling pressure in reactive multilayer joining and resulting product The invention includes a method of joining two components. The method includes providing at least two components to be joined, a reactive multilayer foil, and a compliant element, placing the reactive multilayer foil between the at least two components, applying pre... | 10/28/2008 |
| 7434720 | Gold/nickel/copper/titanium brazing alloys for brazing WC-Co to titanium alloys A brazing material including about 20 to about 60 percent by weight gold, about 6 to about 16 percent by weight nickel, about 16 to about 60 percent by weight copper and about 6 to about 16 percent by weight titanium. ... | 10/14/2008 |
| 7431792 | Method and apparatus for placing conductive balls Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member a... | 10/07/2008 |
| 7410088 | Solder preform for low heat stress laser solder attachment A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, t... | 08/12/2008 |
| 7392924 | Automated ball mounting process and system with solder ball testing An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are... | 07/01/2008 |
| 7368814 | Surface mount adapter apparatus and methods regarding same An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e.g., having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package)... | 05/06/2008 |
| 7364063 | Thermally coupling an integrated heat spreader to a heat sink base The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating w... | 04/29/2008 |
| 7360679 | Method for the production of a soldered connection A method for the production of a soldered joint between at least two contact partners (22, 23) of a bonding arrangement (21), with a formed piece of solder material (27) being arranged at a distance to the bonding arrangement. The formed piece o... | 04/22/2008 |
| 7357291 | Solder metal, soldering flux and solder paste Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities. ... | 04/15/2008 |
| 7357293 | Soldering an electronics package to a motherboard In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of... | 04/15/2008 |
| 7357414 | Closure for a gas supply system A seal for a gas supply system of metal, in particular for sealing an airbag conduit, wherein, during operation, the gas supply system has a gas-conducting cross-section and a wall of metal, wherein in the area which seals the cross-section of the gas supply system,... | 04/15/2008 |
| 7357295 | Solder ball supplying method and supplying device After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a ... | 04/15/2008 |
| 7347975 | Bead dispensing system A bead dispensing system is provided for delivering small amounts of substances onto substrates. The system can include, for example, a movable support structure having an array of spaced-apart projections depending from its lower side. An attraction source, such as... | 03/25/2008 |
| 7348515 | Solder dispenser A solder dispenser provides a cylindrical dispensing container which has a solder inlet for introducing a solder member, and an opening portion for discharging the above-mentioned solder member to the external, and forms an internal space where the solder member can... | 03/25/2008 |
| 7331498 | Method for refining and homogeneously distributing alloying partners and for removing undesirable reaction products and slags in or from soft solder during the production of fine solder powder Method for refining and homogeneously distributing alloying partners and for removing undesired reaction products such as oxides and/or slag in or from soft solder during the production of fine solder powder, in which the solder alloy is melted in a high temperature... | 02/19/2008 |
| 7329828 | Method for inert gas welding or inert gas soldering of workpieces comprising identical or different metals or metal alloys by means of an additional Zn/Al metal The invention relates to a method for inert gas welding or inert gas soldering of workpieces (A) made of steel, aluminum, magnesium, copper, or the alloys thereof with workpieces (B) made of steel, aluminum, magnesium, copper, or the alloys thereof by using an addit... | 02/12/2008 |
| 7329598 | Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device has: preparing a semiconductor wafer having electrode pads formed on the main surface; forming contact portions, which connect to the electrode pads, on the main surface; forming a sealing resin over the main surface;... | 02/12/2008 |
| 7293567 | Application of acoustic and vibrational energy for fabricating bumped IC die and assembly of PCA's A method and apparatus are disclosed for improving a screen printing process by applying vibrational energy to assist in the print release, cleaning, and drying processes. The vibrational energy or acoustic pressure waves may be created by a transducer where the wav... | 11/13/2007 |
| 7293354 | Apparatus for mounting columns for grid array electronic packages A vacuum controlled fixture is provided for positioning columns on sites of an electronic substrate. The fixture includes an internal chamber having spaced apart first and second surfaces extending beneath its principal face. A regular array of column receiving hole... | 11/13/2007 |
