Did You Know...
...Chester Carlson was a patent agent who tired of having to make multiple copies of patent applications using the only duplication method available at the time: carbon paper. In 1959 he came up with a new copying system and took it to IBM for evaluation. The "experts" at IBM determined potential sales to be only 5,000 units because people wouldn't want to use a bulky machine when they had carbon paper. Carlson's invention was the xerography process, the company founded on the system is Xerox.
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| Number | Title | Issue Date |
| 7371988 | Methods for extending the life of alloy steel welded joints by elimination and reduction of the HAZ In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first meta... | 05/13/2008 |
| 7347354 | Metallic solder thermal interface material layer and application of the same A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert c... | 03/25/2008 |
| 7293689 | Two tier brazing for joining copper tubes to manifolds A brazing process for joining copper and copper alloy tubes to a fitting which includes first forming a layer of a high melting temperature noble metal on one end of a copper or copper alloy tube. The plated end is then brazed to a metal ferrule to form a copper all... | 11/13/2007 |
| 7238919 | Heating element movement bonding method for semiconductor components According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by... | 07/03/2007 |
| 6892927 | Method and apparatus for bonding a wire to a bond pad on a device A method of bonding a wire to a bond pad on an electronic or photonic device is provided. A section of the wire is held within a bond head of the wirebonding apparatus. A laser beam is directed onto the bond pad. Energy of the laser beam heats the bond pad to the te... | 05/17/2005 |
| 6861617 | Method of reducing distortion by transient thermal tensioning A method to minimize the distortion, such as buckling, caused in the welding of thin plate by utilizing transient thermal tensioning to induce areas of residual tensile stress. Distortion of such welded plates after stiffeners are welded to the plates is due to larg... | 03/01/2005 |
| 6779710 | Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the o... | 08/24/2004 |
| 6384366 | Top infrared heating for bonding operations A method and apparatus are provided for reliably heating the bonding areas of a substrate and/or a die or dies of a stacked die assembly or a flip-chip assembly to ensure high-quality solder or wire bonds between the substrate and the die. Embodiments inc... | 05/07/2002 |
| 6145734 | Reflow method and reflow device For reflow soldering, radiant heating is applied to one surface of a printed circuit board on which electronic components are placed and onto which cream solder is supplied and at the same time hot air is blown locally and roughly perpendicular to to-be-c... | 11/14/2000 |
| 6020571 | Welding method and apparatus therefor An apparatus and method for welding a superalloy article. The apparatus generally entails an enclosure adapted for containing a superalloy article, a polarity-reversing plasma transferred arc welder apparatus for welding a localized region of the article,... | 02/01/2000 |
| 5735450 | Apparatus and method for heating a board-mounted electrical module for rework An apparatus for heating a module mounted on a card includes a heating chamber adapted to receive the card and module, a nozzle adapted to surround the module and provide a flow of heated gas thereover, and a heated support surface for heating a bottom su... | 04/07/1998 |
| 5628448 | Process for bonding a contact layer of silver-metal oxide material and metal contact base, and suitable contact layer A contact facing is normally bonded to the carrier by brazing or welding, for which purpose, the bonding side has to have a suitable layer. According to the invention, prior to the bonding operation, the contact facings are treated without fusion in such ... | 05/13/1997 |
| 5340016 | Soldering method and apparatus A technique is provided for manually performing a soldering operation on an article with a low-solids flux-containing solder to bond an object to the article with a reduced amount of flux residues. The technique is practiced by first manually applying hea... | 08/23/1994 |
| 5306897 | Heat treatment method and apparatus for turbine blades using flexible heater sleeve Heating apparatus specifically adapted for the heat treatment of turbine blades comprises two support parts (10, 11) which may be pivotally connected by a hinge (17), the support parts (10, 11) carrying heating elements (14, 15) and a slot (20) the provis... | 04/26/1994 |
| 5222655 | Soldering method employing provision of heated gas to a soldering alloy at a soldering connection An apparatus for applying a soldering alloy to an element to be soldered including an open-channeled member having a receiving region for holding the element, a vacuum system connected to the member for creating a negative pressure through the open channe... | 06/29/1993 |
| 5196667 | Soldering and desoldering device A device for making or undoing welds between a component with several galvanic connections and a support is particularly suited for surface mounting. In order to direct a stream of hot gas or infrared radiation accurately onto the connections of the compo... | 03/23/1993 |
| 5128506 | Method and apparatus for selective infrared soldering using shielding fixtures An apparatus and method is disclosed for making additional solder joints on a printed wiring assembly which includes a printed wiring board and components soldered previously thereto. Additional components, along with additional solder to be reflowed to f... | 07/07/1992 |
| 5082164 | Method of forming superconducting joint between superconducting tapes Superconducting tapes having an inner laminate comprised of a parent-metal layer, a superconductive alloy layer on the parent-metal, a reactive-metal layer, and an outer laminate soldered thereon are joined in a superconducting joint by the method of this... | 01/21/1992 |
| 5009359 | Process for joining workpieces of metal or ceramic by boundary surface diffusion The following steps are performed for joining workpieces of metal or ceramic to each other by boundary surface diffusion at the junction location. After laying together the surfaces at which the workpieces are to be joined together, a layer is applied to ... | 04/23/1991 |
| 5000371 | Method of producing a metallic interface A method for producing a metallic interface suitable for overlaying consists of exposing the area of an alloy combination to be overlayed to a temperature above its lower critical until an element reduced zone arises. This element reduced zone more easily... | 03/19/1991 |
| 4821944 | Method for bonding a wire and bonding apparatus The method for bonding a wire of this invention comprises the steps of: positioning a metal ball or a wire on a material (to be bonded); applying a pressing force on the metal ball or the wire against the material (to be bonded) and deforming it; inducing... | 04/18/1989 |
| 4771929 | Focused convection reflow soldering method and apparatus An improved solder reflow system for mass joining with solder electrical and electronic components affixed on a circuit board is provided. The system employs a combination of IR heating, recirculating forced hot air heating, and focused forced hot air hea... | 09/20/1988 |
| 4567841 | Fairing assembly for towed underwater cables A fairing and a fairing assembly for towed underwater cables is provided, having two different embodiments of fairings. In the first embodiment, each fairing has a flexible nose portion and a substantially rigid tail portion having separable halves, with ... | 02/04/1986 |
| 3948433 | Process for the manufacture of a glazing unit A process for manufacturing a glazing unit by jointing a metallized margin of a sheet of glass to an intervening spacer strip following a course along the peripheral margin of the unit, the joint between the sheet and the strip along at least a section of... | 04/06/1976 |
