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| Number | Title | Issue Date |
| 6638363 | Method of cleaning solder paste A cleaning apparatus for cleaning solder paste off the bottom side of a printed circuit board stencil includes a container of cleaning solution therein and a blade holder that is movable between a wiping position and the container of cleaning solution. A ... | 10/28/2003 |
| 6637641 | Systems and methods for manufacturing a circuit board A circuit board manufacturing system has a paste source, a circuit board processing apparatus, and a controller. The circuit board processing apparatus includes a carrier configured to receive a circuit board having (i) a section of circuit board material... | 10/28/2003 |
| 6607117 | Solder ball attaching system and method The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on w... | 08/19/2003 |
| 4196839 | Methods of fabricating printed circuit boards A printed circuit board is fabricated by a series of steps which eliminate the necessity of post soldering cleaning of the printed circuit assembly. The board is fabricated by positioning components on the top surface and uniformly applying a hydrophobic ... | 04/08/1980 |
