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| Number | Title | Issue Date |
| 7413110 | Method for reducing stress between substrates of differing materials A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (... | 08/19/2008 |
| 7124931 | Via heat sink material The invention provides thermally conductive material so that less heat traveling from one side of a layer will reach connection material on another side of a layer. Rather, some of the heat will be conducted away by the thermally conductive material and dissipated. | 10/24/2006 |
| 7047612 | Method for repairing a casting This invention relates generally to a method for repairing a casting, and more specifically to a method of repairing a casting by pouring melted filler material into a damaged portion of the original casting. Damaged cast metal components, such as a cylinder head of... | 05/23/2006 |
| 6915942 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted ... | 07/12/2005 |
| 6726087 | Process and device for soldering electrical components on a plastic sheet The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the ... | 04/27/2004 |
| 6259036 | Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps A method for fabricating bumped semiconductor components and electronic assemblies, such as multi chip modules, is provided. The method includes forming semi cured, electrically conductive, elastomeric bumps on electrodes of a semiconductor component (e.g... | 07/10/2001 |
| 4568014 | Bonding of metallic glass to crystalline metal A method of bonding a first thin crystalline metal to a second thin metal ch as metallic glass is disclosed. Initially, the metallic glass is coated with a thin thermal barrier layer. Next, the first metal is heated to a temperature sufficient for diffusi... | 02/04/1986 |
| 4540115 | Flux-free photodetector bonding A method of bonding photodetector devices to heatsinks, which devices can be damaged above 250° C., using a gold-tin eutectic solder which has a melting point of 280° C., is disclosed. The process comprises heating the heatsink and solder past the solde... | 09/10/1985 |
| 4373657 | Devices and method for delivery of solder and brazing material A soldering device having a guide body for receiving and delivering a filler metal to form a weldment. The guide body has an end portion which is positioned in the path of the heat from the burner to preheat the filler metal therein. The temperature of th... | 02/15/1983 |
| 4039802 | Method of automatic or semi-automatic welding with gases The invention relates to an improved method of automatic or semi-automatic welding with gas, or brazing, effected by using a coil of fillet wire brought to the welding point by continuously passing through the center of a gas flame, (oxy-acetylene, oxygen... | 08/02/1977 |
| 3960308 | Apparatus for affixing surface enlarging members in the form of coherent transversally corrugated metal strips to elongate metal basic profiles Apparatus for affixing surface enlarging, transversally corrugated metal strips to elongate metal basic profiles which are advanced in the direction of their longitudinal axes whilst simultaneously being joined by a joining compound to the wave crests on ... | 06/01/1976 |
