"There is practically no chance communications space satellites will be used to provide better telephone, telegraph, television, or radio service inside the United States."
T. Craven, FCC Commissioner ; 1961
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| Number | Title | Issue Date |
| 8104668 | Method and apparatus providing fine alignment of a structure relative to a support A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fu... | 01/31/2012 |
| 8052036 | Tab lead soldering apparatus and tab lead soldering method A tab lead soldering apparatus soldering a tab lead to a front face and a rear face of a solar cell has a first pressing mechanism pressing the tab lead toward the front face of the solar cell, a second pressing mechanism pressing the tab lead toward the rear face o... | 11/08/2011 |
| 8006892 | Method for forming a tight-fitting silver surface on an aluminium piece The invention relates to a method for forming a highly electroconductive surface on an aluminum piece. A highly conductive layer of silver is formed on the piece by means of a eutectic join. The temperature of the aluminum piece is raised gradually and the oxide lay... | 08/30/2011 |
| 7900811 | Method for producing components with internal architectures, such as micro-channel reactors, via diffusion bonding sheets This invention relates to a method for producing components with internal architectures, and more particularly, this invention relates to a method for producing structures with microchannels via the use of diffusion bonding of stacked laminates. Specifically, the me... | 03/08/2011 |
| 7861913 | Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor In a soldering method for mounting a semiconductor device on a wiring board, a plurality of solid-phase solders are provided between the semiconductor device and the wiring board, and are thermally melted to thereby produce a plurality of liquid-phase solders thereb... | 01/04/2011 |
| 7857195 | Method and apparatus providing fine alignment of a structure relative to a support A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fu... | 12/28/2010 |
| 7841510 | Method and apparatus providing fine alignment of a structure relative to a support A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fu... | 11/30/2010 |
| 7562806 | Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device A reflow process is provided for multiple units which improves productivity. A reflow furnace is moved along a transport direction of a tape substrate and is fixed at a position matching the product pitch of a circuit substrate. Any of a plurality of heating blocks ... | 07/21/2009 |
| 7309400 | Methods of improving uniformity in additive manufacturing processes This invention improves upon existing approaches by providing a method for improving the uniformity of additive manufacturing processes of the type wherein material increments are consolidated to produce a three-dimensional object. According to one aspect of the inv... | 12/18/2007 |
| 7181821 | Joining expandable tubulars A method of joining expandable tubulars includes joining the tubulars by forge welding and flushing a reducing flushing gas around the heated tubular ends during at least part of the forge welding operation such that oxides are removed from the forge welded tubular ... | 02/27/2007 |
| 6926971 | Bonded metal components having uniform thermal conductivity characteristics and method of making same Cookware having improved uniform heat transfer over the entire cross section thereof, the cookware formed from a multi-layered composite metal having a layer of titanium roll bonded at or near the core of the composite. The titanium layer is roll bonded to layers of... | 08/09/2005 |
| 6915945 | Method for contact-connecting an electrical component to a substrate having a conductor structure For the purpose of contact-connecting an electrical component, in particular a semiconductor component, on a substrate having a conductor structure, a joining temperature is chosen in such a way that the substrate, with a pressure being exerted on the electrical com... | 07/12/2005 |
| 6659332 | Directionally solidified article with weld repair A directionally solidified nickel-base superalloy article has a defect therein extending parallel to the solidification direction. The article is repaired by removing any foreign matter present in the defect, and then heating the article to a repair tempe... | 12/09/2003 |
| 6644534 | Process for joining metals A process for joining metals is provided, by which a core wire of a coated electric wire can be securely joined to a metal having a plated layer on the surface thereof. The process is to assemble a wiring module 1. The wiring module 1 has a metal piece 2,... | 11/11/2003 |
| 6596131 | Carbon fiber and copper support for physical vapor deposition target assembly and method of forming The invention includes a method of forming an assembly of a physical vapor deposition target and support. A physical vapor deposition target is provided. The physical vapor deposition target has a coefficient of thermal expansion of less than 10×10-... | 07/22/2003 |
| 6491207 | Weld repair of directionally solidified articles A directionally solidified nickel-base superalloy article has a defect therein extending parallel to the solidification direction. The article is repaired by removing any foreign matter present in the defect, and then heating the article to a repair tempe... | 12/10/2002 |
| 6419806 | Insert target assembly and method of making same Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic mate... | 07/16/2002 |
| 6409071 | Method for assembling, by welding, a coil with an integrated circuit or an electronic unit of small dimensions Method for welding two end portions (6, 8) of a coil (not shown) onto two electric contact pads or bumps (24, 26) of an integrated circuit (2) or an electronic unit of small dimensions. This welding method is characterised in that, prior to the actual wel... | 06/25/2002 |
| 6364971 | Apparatus and method of repairing turbine blades A method of repairing a metallic member, such as a superalloy turbine blade, includes the step of preparing the blade by stripping the protective coatings from the blade. The blade is then pre-conditioned for welding by a first hot isostatic process. Once... | 04/02/2002 |
| 6329625 | Method of making a seal An improved seal and method of making is disclosed for sealing a filter element to a filter mounting. The improved seal comprises a bonding pad formed from a sintered matrix of randomly oriented metallic fiber. The bonding pad is disposed between the filt... | 12/11/2001 |
| 5660742 | Insulated wire termination, method, and machine A method, machine and termination for connecting two or more insulated wire ends includes placing them in a metal tube held between fusing electrodes. The electrodes are shaped to deform the tube and wires therein with the application of fusing pressure. ... | 08/26/1997 |
| 5370753 | Process for cladding precious metals to precipitation hardenable materials A process for cladding precious metals to precipitation hardenable materials. In accordance with one aspect of the present invention, are the steps of (i) placing a precious metal layer of a first selected thickness atop a selected beryllium-copper alloy ... | 12/06/1994 |
| 5236116 | Hardfaced article and process to provide porosity free hardfaced coating There is provided an improved coated composite article and an improved process for making the article. A cloth-like flexible preform is brazed to a metallic substrate to make the article. The article is then subjected to a uniform high pressure and temper... | 08/17/1993 |
| 4940180 | Thermally stable diamond abrasive compact body A method of producing a thermally stable diamond compact having a metal layer bonded to a surface thereof is provided. The thermally stable diamond compact comprises a mass of diamond particles containing diamond-to-diamond bonding and a second phase unif... | 07/10/1990 |
| 4883219 | Manufacture of ink jet print heads by diffusion bonding and brazing A first surface of a first metal component of an ink jet print head is bonded to a second surface of a second metal component of the ink jet print head, the first and second surfaces being of materials having the same or similar coefficients of thermal ex... | 11/28/1989 |
| 4830266 | Method of producing weld metal tubing empoying a reusable mandrel A method of producing substantially distortion-free weld metal tubing wherein a mandrel and a thin metal layer covering the mandrel are used to provide structural support for a starter tube while a weld metal is being deposited on the exterior surface of ... | 05/16/1989 |
| 4818323 | Method of making a void free wafer via vacuum lamination A silicon wafer bonding technique is described utilizing low pressures and a dissolvable gas to substantially eliminate voids formed between the bonding surfaces of two wafers.... | 04/04/1989 |
| 4724120 | Method for the assembly of and the interconnection by diffusion of bodies of metal alloys A method for the assembly and connection of bodies, massive parts or powder grains, of alloys comprising at least 50% of nickel, cobalt or iron, comprises a preliminary operation of deposition at the interface of the said bodies of a product of the type M... | 02/09/1988 |
| 4684057 | Heat insulated cooking utensil Disclosed is a vacuum-heat-insulated cooking utensil and a method of manufacturing the same. Inner and outer containers are prepared each having a tubular side wall and an end wall closing the end of the side wall. The inner container is positioned in the... | 08/04/1987 |
| 4540115 | Flux-free photodetector bonding A method of bonding photodetector devices to heatsinks, which devices can be damaged above 250° C., using a gold-tin eutectic solder which has a melting point of 280° C., is disclosed. The process comprises heating the heatsink and solder past the solde... | 09/10/1985 |
| 4511077 | Cookware and method of making the same The outer surface of a stainless steel utensil and one surface of an aluminum disk are cleaned and then separately heated at different temperatures. Thereafter, the disk is superimposed over the utensil and metallurgically bonded directly thereto by the a... | 04/16/1985 |
| 4089106 | Method for producing electrical contacts A method and apparatus is provided to produce a gold, inlaid contact surface for an electrical contact device by welding gold ribbon segments to the contact device wire base prior to the coining, trimming, slotting and various other forming operations whi... | 05/16/1978 |
| 4055451 | Composite materials The invention concerns a method of fabricating ceramic/metal or ceramic/ceramic composites. A porous surface region is produced on a ceramic material by sintering a granular substance onto the latter. Metal infiltrated into the porous region is then firml... | 10/25/1977 |
| 3963163 | Method for bonding bodies made of metallic material A method for bonding bodies made of metallic material is described herein, which method is characterized in that one ends of metallic bodies are butted against each other with a light mechanical load applied to the butted portion, and under such a loaded ... | 06/15/1976 |