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| Number | Title | Issue Date |
| 7980449 | Thermal stir welding apparatus A welding method and apparatus are provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the e... | 07/19/2011 |
| 7328831 | Method of making a brazed metal article and the article formed thereby A method of making an article that is comprised of a metal foam in contact with a base metal by an intermediate braze composition, in particular, a method of brazing a metal foam to a base metal via a braze composition. In one preferred method, a polymeric foam is c... | 02/12/2008 |
| 7325716 | Dense intermetallic compound layer Apparatus and methods of fabricating a bump limiting metallization structure including a two-step bump reflow process that reduces intermetallic compound porosity, increases bump strength, improve die yield, and device reliability. The first step comprises annealing... | 02/05/2008 |
| 7293689 | Two tier brazing for joining copper tubes to manifolds A brazing process for joining copper and copper alloy tubes to a fitting which includes first forming a layer of a high melting temperature noble metal on one end of a copper or copper alloy tube. The plated end is then brazed to a metal ferrule to form a copper all... | 11/13/2007 |
| 7238919 | Heating element movement bonding method for semiconductor components According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by... | 07/03/2007 |
| 7159309 | Method of mounting electronic component on substrate without generation of voids in bonding material When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electr... | 01/09/2007 |
| 7129446 | Reflow device A device is provided to heat the whole heated surface of a carried member carried intermittently with a temperature change over time maintained constant. The device controls the driving of a belt-conveyer so that a heater moves in a carrying direction at a carry tim... | 10/31/2006 |
| 7047612 | Method for repairing a casting This invention relates generally to a method for repairing a casting, and more specifically to a method of repairing a casting by pouring melted filler material into a damaged portion of the original casting. Damaged cast metal components, such as a cylinder head of... | 05/23/2006 |
| 7032403 | Method of controlling spray distances in a spray unit A method of controlling spray distances in a spray unit for efficiently thermally managing one or more electronic devices. The method of controlling spray distances in a spray unit includes a first portion and a second portion positioned with the first portion. The ... | 04/25/2006 |
| 6786390 | LED stack manufacturing method and its structure thereof A LED stacking manufacturing method and its structure thereof, mainly uses a stacking method to integrate the epitaxial layer and the high-thermal-conductive substrate by twice bonding process, and the converted epitaxial layer of the temporary bonded substrate repl... | 09/07/2004 |
| 6695201 | Stress relieved lower shell for sealed compressors A lower shell for a sealed compressor includes a shape with a plurality of intricate bends. In particular, u-shaped sections are stamped into a plainer sheet of material to form the lower shell. This stamping process can cause brittleness in the lower she... | 02/24/2004 |
| 6686565 | Method of an apparatus for heating a substrate A method of uniformly or substantially uniformly heating at least one surface of a substrate, comprises the steps of supporting a substrate, generating a heated air flow, directing the heated air flow to heat a strip of a first surface of the substrate, a... | 02/03/2004 |
| 6648209 | Process for producing welded steel pipes with a high degree of strength, ductility and deformability In a process for producing welded steel pipes, a pipe is molded cold from a TM-rolled sheet, welded together and sized to the desired diameter, whereby the sheet includes steel with (in wt. %) 0.02 to 0.20% carbon, 0.05 to 0.50% silicon, 0.50 to 2.50% man... | 11/18/2003 |
| 6625886 | Manufacturing method of heat exchanger In a manufacturing method of a heat exchanger including a core portion having a plurality of tubes and a plurality of radiation fins connected to surfaces of the tubes, and a tank portion communicating with the tubes, a preheating step, a brazing step, a ... | 09/30/2003 |
| 6607847 | Bonded niobium silicide and molybdenum silicide composite articles using brazes An article, such as an airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermeta... | 08/19/2003 |
| 6586118 | Bonded niobium silicide and molybdenum silicide composite articles using semi-solid brazes An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a... | 07/01/2003 |
| 6565989 | Bonded niobium silicide and molybdenum silicide composite articles using germanium and silicon based brazes An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a... | 05/20/2003 |
| 6565990 | Bonded niobium silicide and molybdenum silicide composite articles and method of manufacture An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined at a bonded region to the first piece by a diffusion bond. The first piece comprises one of a first niobium-based refractory metal i... | 05/20/2003 |
| 6502739 | Method of manufacture of a structural body The rotary tools are disposed to weld along two spaced welding lines. The two rotary tools are inserted into respective welding joints and moved at the same time along the respective welding lines. At a position P1 of a portion of a window one rotary tool... | 01/07/2003 |
| 6434946 | Method for making an article assembly with a brazed joint and brazed assembly and preform An article assembly comprising a plurality of members includes a multi-layered brazed joint provided in the assembly between a first member that can be affected adversely by thermal exposure at a limiting and a second member requiring exposure, such as fo... | 08/20/2002 |
| 6419806 | Insert target assembly and method of making same Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic mate... | 07/16/2002 |
| 6395972 | Method of solar cell external interconnection and solar cell panel made thereby A method of solar cell external interconnection and a solar cell panel (1) made thereby are disclosed. An assembly (2) including a solar cell module (4), a flexible lead frame (5) to which the solar cell module is to be interconnected and a solder located... | 05/28/2002 |
| 6320155 | Plasma enhanced wire bonder A method and apparatus for simultaneously cleaning and bonding a wire to a bonding surface is presented. In accordance with the invention, a gas is energized to form a plasma, which is then directed in a directional pressurized flow at the wire and bondin... | 11/20/2001 |
| 6259036 | Method for fabricating electronic assemblies using semi-cured conductive elastomeric bumps A method for fabricating bumped semiconductor components and electronic assemblies, such as multi chip modules, is provided. The method includes forming semi cured, electrically conductive, elastomeric bumps on electrodes of a semiconductor component (e.g... | 07/10/2001 |
| 6119921 | Bonding of aluminum oxide components to silicon substrates The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by... | 09/19/2000 |
| 6095403 | Circuit board component retention A method and implementing system is provided in which a gas, such as oxygen, is injected on to area of a circuit board to which an electronic component is being mounted. The injected gas causes a formation of a coating or surface alloy layer such as tin-o... | 08/01/2000 |
| 6032851 | Vertical pipe column assembly method A vertical pipe column assembly procedure involves the simultaneous welding and ultrasonic testing activity by using a plurality of welders progressing peripherally around a joint with the ultrasonic testing work similarly progressing peripherally around ... | 03/07/2000 |
| 5948549 | Sinter joining method and sintered composite member produced by same A sinter-joining method for forming a sinter of high quality at low cost and a sintered composite member produced by the sinter-joining method. A tubular copper-base material is forced into a tubular iron-base material and these materials are sintered at tempe... | 09/07/1999 |
| 5871592 | Solder and soldering method Soldering paste obtained by mixing solder material with photosetting flux, which hardens by the irradiation of ultraviolet light, is used for reflow soldering. The photosetting flux contains flux base material, flux base material solvent, a photopolymeriz... | 02/16/1999 |
| 5758816 | Method for attaching small components to each other A method is provided to heat a plurality of components to a preselected temperature that creates a tackiness at the surface of a preformed solder component and permits the preformed solder component to adhere to a first metallic surface of a first compone... | 06/02/1998 |
| 5579575 | Method and apparatus for forming an electrical connection A method and apparatus of forming a solder connection between a plurality of elongate bodies, comprises: (i) forming an initial connection between the elongate bodies by inserting them into an induction heatable connecting element of a connector, the conn... | 12/03/1996 |
| 5540379 | Soldering process A soldering process using two different types of solder alloys is disclosed. The first solder alloy (115) undergoes a solid-to-liquid transition at a first temperature. The second solder alloy (120) undergoes this solid-to-liquid transition at a second te... | 07/30/1996 |
| 5222652 | Non-corrosive double walled tube and process for making the same A seamless double-walled tube having high corrosion resistance and relative flexibility prepared by a process for brazing non-ferritic steel surfaces such as nickel chromium or stainless steel to which a suitable brazing alloy such as copper has been mech... | 06/29/1993 |
| 5161730 | Method for fabricating a weldment The invention is an improved method for fabricating apparatus weldments such as, for example, wheeled end trucks for overhead cranes. The apparatus has a pair of spaced, wheeled end modules, a pair of beams extending between the modules and at least one r... | 11/10/1992 |
| 5111991 | Method of soldering components to printed circuit boards The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless compon... | 05/12/1992 |
| 5099573 | Method of making hollow articles A method of making a hollow article, for example, a hollow airfoil, from first and second preformed sections involves a first precursor (seal) bonding step where a low external pressure and internal vacuum are utilized to form a substantially gas impermea... | 03/31/1992 |
| 4988036 | Vacuum braze cycle for clad aluminum sheet An improved heating cycle for brazing an assembly of clad aluminum sheet components having a hypoeutectic aluminum-silicon braze alloy cladding comprises a dwell at a temperature slightly above the eutectic melting point and effective to partially melt th... | 01/29/1991 |
| 4955524 | Extrusion die construction and its method of manufacture In accordance with a preferred embodiment, a monolith extrusion die is formed by a plurality of individual tube elements bonded together as a tube stack defining a plurality of extrudable material feed holes and reference guides for a plurality of individ... | 09/11/1990 |
| 4895291 | Method of making a hermetic seal in a solid-state device A method of making a hermetic seal for a solid-state device is disclosed. The device includes a ceramic housing having a cavity for an element such as an image sensor. A cover formed of a transparent material is sealed to the housing to close the cavity. ... | 01/23/1990 |
| 4883219 | Manufacture of ink jet print heads by diffusion bonding and brazing A first surface of a first metal component of an ink jet print head is bonded to a second surface of a second metal component of the ink jet print head, the first and second surfaces being of materials having the same or similar coefficients of thermal ex... | 11/28/1989 |
