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| Number | Title | Issue Date |
| 7743966 | Soldering flux and method for bonding semiconductor element The method for bonding a semiconductor element comprises the step of applying to solder bumps 10 of a semiconductor chip 12 a soldering flux 16 which contains a thermosetting resin, a polyhydric alcohol and an organic acid and in which the therm... | 06/29/2010 |
| 7481353 | Metal bonding method A hydrocarbon compound mixed with an organic peroxide is placed between a copper electrode and a solder-coated electrode, and is heated at a temperature of about 300° C. The organic peroxide is exposed to a heating energy and thermally decomposed into an organic pe... | 01/27/2009 |
| 7428979 | Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temper... | 09/30/2008 |
| 7425765 | Zinc-aluminum solder alloy A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and f... | 09/16/2008 |
| 7419085 | Optical processing apparatus The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire sol... | 09/02/2008 |
| 7401724 | Brazing flux for dry application A flux based on alkali fluoroaluminate is described which is highly suitable for dry application (“dry fluxing”). This is a flux which is free of fine-grained fraction, which is defined by a range of grain-size distribution. ... | 07/22/2008 |
| 7350686 | Method for supplying solder Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containin... | 04/01/2008 |
| 7337941 | Flux coated brazing sheet A brazing flux mixture comprised of brazing flux, a polyvinyl butyral resin binder, and an organic solvent which can be applied over an entire aluminum alloy brazing sheet, or can be applied on the brazing sheet only where metallurgical bonds or joints are required,... | 03/04/2008 |
| 7332424 | Fluxless solder transfer and reflow process Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately ... | 02/19/2008 |
| 7329828 | Method for inert gas welding or inert gas soldering of workpieces comprising identical or different metals or metal alloys by means of an additional Zn/Al metal The invention relates to a method for inert gas welding or inert gas soldering of workpieces (A) made of steel, aluminum, magnesium, copper, or the alloys thereof with workpieces (B) made of steel, aluminum, magnesium, copper, or the alloys thereof by using an addit... | 02/12/2008 |
| 7300528 | Flux binder system A welding flux that includes a flux agent and a binder. The binder includes a colloidal binder formed from small particles of silicon dioxide. The binder can be dried at lower temperatures to thereby for a greater range of fluxing agents and/or metal alloys to be in... | 11/27/2007 |
| 7241348 | Flux for solder paste and solder paste A flux for solder paste contains a dicarboxylic acid of carbon number 3 to 5 and a dicarboxylic acid of carbon number 15 to 20 as an activator, which prevents skinning or changes by aging of viscosity. In actual use, the solder paste of the present invention can mai... | 07/10/2007 |
| 7220493 | Lead-free solder, and a lead-free joint A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liq... | 05/22/2007 |
| 7213738 | Selective wave solder system The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processi... | 05/08/2007 |
| 7182241 | Multi-functional solder and articles made therewith, such as microelectronic components Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a seco... | 02/27/2007 |
| 7172106 | Printed circuit board which can be connected with pin connector and method of manufacturing the printed circuit board A printed circuit board that can be connected with a pin connector and a method of manufacturing the printed circuit board are provided. Solidified solder can be formed on the tap unit without the need for additional processes, by applying solder printing to the tap... | 02/06/2007 |
| 7169474 | Epoxy resin composition and semiconductor device An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits impr... | 01/30/2007 |
| 7170073 | Stainless steel product containing B and method for production thereof A stainless steel slab containing B, wherein a protecting material is joined onto at least two faces across the bloom from each other in a stainless steel bloom containing B of 0.3–2.5 mass %, being integrated into one-piece by forming a weld metal comprising a st... | 01/30/2007 |
| 7163137 | Method of manufacturing mounting boards The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by moun... | 01/16/2007 |
| 7156283 | Method for making a solder between metallic balls of an electronic component and mounting lands of a circuit and soldering furnace therefor A method for producing a soldered joint between the metal balls present in either a ball grid array or a chip-scale package, and the receiving pads for a circuit printed on a substrate or the receiving pads of an integrated circuit. Solder cream or an adhesive flux ... | 01/02/2007 |
| 7150797 | Filler material for use in welding of Mg-contained aluminum alloy die-cast members, welding method, and welded article An aluminum alloy filler material for use in welding of metal members including at least one aluminum die-cast member containing Mg includes an aluminum or an aluminum alloy as base material and Al—K—F series flux. The Al—K—F series flux is contained by 2 to... | 12/19/2006 |
| 7105432 | Method of locating conductive spheres utilizing screen and hopper of solder balls Methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop throu... | 09/12/2006 |
| 7094993 | Apparatus and method for heating and cooling an article An apparatus for heating and cooling an article is provided. The apparatus comprises an enclosure having top, bottom, and side walls and an entrance and an exit. A first belt system comprising one or more belts extends from a loading position through a portion of th... | 08/22/2006 |
| 7070085 | Water soluble protective paste for manufacturing printed circuit boards An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. Af... | 07/04/2006 |
| 7051435 | Process for repairing turbine components A process for repairing a turbine component comprises overlaying a preform of a brazing material onto a surface of the turbine component, wherein the surface comprises a damaged portion; securing the preform of a brazing material to the surface; and heating the turb... | 05/30/2006 |
| 7004374 | Process of making a shaped product A process of making a shaped product consisting of aluminium or an aluminium alloy comprising the steps of producing an intermediate object by extrusion or rolling and having at least one flat surface, coating the at least one flat surface with a brazing flux retain... | 02/28/2006 |
| 6974069 | Solder ball attaching system and method The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base t... | 12/13/2005 |
| 6971163 | Adhesive and encapsulating material with fluxing properties The attachment of an electrical component to an electrical termination on a component-carrying substrate by a solder bump technique of a thermally curable adhesive composition for encapsulating purposes is described which comprises a thermosetting polymer and a chem... | 12/06/2005 |
| 6969638 | Low cost substrate for an integrated circuit device with bondpads free of plated gold Disclosed herein is a process for assembling an integrated circuit, as well as the assembly resulting from the process, employing a surface treatment of bondpad surfaces. In one aspect, a method of assembling an integrated circuit includes providing a substrate havi... | 11/29/2005 |
| 6953711 | Flip chip on lead frame There is disclosed a flip-chip-type method of assembling semiconductor devices. A one-step encapsulation process promotes adhesion of the die to the lead fingers and prevents the potential of shorts developing between the adjacent bumps or lead fingers. Conventional... | 10/11/2005 |
| 6926191 | Process for fabricating external contacts on semiconductor components A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contac... | 08/09/2005 |
| 6915944 | Soldering flux, solder paste and method of soldering The present invention relates to a soldering flux, a soldering paste and a soldering method that achieve a sufficient degree of bonding strength even when components are mounted at a higher density, components are further miniaturized or components are mounted with ... | 07/12/2005 |
| 6915942 | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted ... | 07/12/2005 |
| 6905059 | Solder ball attachment system A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the ... | 06/14/2005 |
| 6904673 | Control of flux by ink stop line in chip joining Ink jet printing apparatus is employed to form a non-polar ink stop line around a chip site on the polar surface of an organic laminate substrate. The non-polar ink stop line acts to confine polar liquid flux from spreading after application of the flux to the chip ... | 06/14/2005 |
| 6902102 | Soldering method and solder joint member In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated ... | 06/07/2005 |
| 6902097 | Electrically conductive wire A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second ... | 06/07/2005 |
| 6902100 | Method of improving the quality of soldered connections The invention relates to a method for improving the quality of soldered connections between large-area SMD components and wiring carriers, in the case of which the parts to be joined are electrically and mechanically connected to one another by reflow soldering, a f... | 06/07/2005 |
| 6896977 | Method of brazing aluminum or aluminum alloy materials and aluminum alloy brazing sheet A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and ... | 05/24/2005 |
| 6880746 | Fluorostannate-containing brazing or soldering fluxes and use thereof in brazing or soldering aluminum or aluminum alloys Fluxing agents comprising potassium fluorostannate and/or cesium fluorostannate which can be used for brazing or soldering components of aluminum or of an aluminum alloy, even by solderless brazing or soldering. Conventional fluxing agents or other fluorometallates,... | 04/19/2005 |
