Quotables
"Fooling around with alternating current is just a waste of time. Nobody will use it, ever."
Thomas Edison ; 1889
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7434719 | Addition of Dto Hto detect and calibrate atomic hydrogen formed by dissociative electron attachment A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be... | 10/14/2008 |
| 7413109 | Joining of advanced materials by superplastic deformation A method for utilizing superplastic deformation with or without a novel joint compound that leads to the joining of advanced ceramic materials, intermetallics, and cermets. A joint formed by this approach is as strong as or stronger than the materials joined. The me... | 08/19/2008 |
| 7353982 | Diffusion bonding for metallic membrane joining with metallic module This invention relates to a method of bonding a metallic membrane with metallic part involving pressing a smooth surface of the metallic membrane against the smooth surface of the metallic part, and heating the metallic membrane and metallic part to a temperature ab... | 04/08/2008 |
| 7347355 | Method for brazing metal components for use in medical equipment, metal assembly produced by the method and endoscope provided with the metal assembly A method for brazing two or more of stainless steel components for use in medical equipment, in which one component is joined to other component using a brazing material containing Au of which amount is 62.5 wt % or higher, the method comprising the steps of: a firs... | 03/25/2008 |
| 7329951 | Solder bumps in flip-chip technologies A solder bump structure and method for forming the same. The structure includes (a) a dielectric layer including a dielectric layer top surface (b) an electrically conducting bond pad on and in direct physical contact with the dielectric layer top surface; (c) a pat... | 02/12/2008 |
| 7328830 | Structure and method for bonding to copper interconnect structures An integrated circuit structure and a method for fabricating the structure. The method comprises forming a copper bond pad for attaching the integrated circuit to a package. Copper oxide is removed from the pad by reduction in a hydrogen ion atmosphere. For attachin... | 02/12/2008 |
| 7208340 | Semiconductor device manufacturing method The invention is directed to improving of a yield and reliability of a BGA type semiconductor device having ball-shaped conductive terminals. A semiconductor wafer having warped portions is supported by a plurality of pins, being spaced from a heated stage. The semi... | 04/24/2007 |
| 7181821 | Joining expandable tubulars A method of joining expandable tubulars includes joining the tubulars by forge welding and flushing a reducing flushing gas around the heated tubular ends during at least part of the forge welding operation such that oxides are removed from the forge welded tubular ... | 02/27/2007 |
| 7134199 | Fluxless bumping process A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. P... | 11/14/2006 |
| 7135396 | Method of making a semiconductor structure Methods of making a semiconductor structure are disclosed. A refractory metal layer containing W, TiW, Ta, or TaN and semiconductor layer are formed on a substrate that contains copper in, for example, a via therein. A portion of the refractory metal layer and semic... | 11/14/2006 |
| 7128980 | Composite component for fusion reactors A highly heat-resistant laminated component for a fusion reactor has at least of a plasma-facing area made of tungsten or a tungsten alloy, a heat-dissipating area of copper or a copper alloy with a mean grain size of more than 100 μm, and an interlayer of a refrac... | 10/31/2006 |
| 7021521 | Bump connection and method and apparatus for forming said connection A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is obtained by forming the metallic balls using metallic wires. An apparatu... | 04/04/2006 |
| 7012334 | Semiconductor chip with bumps and method for manufacturing the same A method for manufacturing a semiconductor chip with bumps comprises providing a semiconductor chip, which defines an active surface and a back surface and has a plurality of pads disposed on the active surface, and a plurality of preformed solder balls. A passivati... | 03/14/2006 |
| 6945447 | Thermal solder writing eutectic bonding process and apparatus A chip or die attachment process and related apparatus, in which a desired quantity of solder (7 or 17) is dispensed onto each, in turn, of a number of desired locations on a substrate (4 or 18), and then an integrated-circuit chip (10... | 09/20/2005 |
| 6945448 | Method for attaching a porous metal layer to a metal substrate A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structur... | 09/20/2005 |
| 6905063 | Method of manufacturing semiconductor device A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then p... | 06/14/2005 |
| 6805279 | Fluxless bumping process using ions A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. P... | 10/19/2004 |
| 6776330 | Hydrogen fluxless soldering by electron attachment A method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the t... | 08/17/2004 |
| 6742702 | Gas injection type soldering method and apparatus After a reducing gas is mixed with an inert gas by a mixer, a resultant mixed gas is heated by a heater and made to a hot mixed gas which is dehumidified and dried and the temperature of which is increased. The mixed gas is injected to a subject from an injection po... | 06/01/2004 |
| 6739204 | Velocity measuring apparatus to establish purge gas velocity prior to welding Velocity/flow measuring of purge gas when welding pipe, is accomplished by providing a controllably fixed orifice at the distal end of the pipe being welded. The purge gas passes through a pressure regulator, a flow meter, and a purifier. An isolation/control valve ... | 05/25/2004 |
| 6712260 | Bump reflow method by inert gas plasma A method of forming reflowed bumps comprising the following sequential steps. A wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side walls and top surfaces and organic residue over the initial bump side ... | 03/30/2004 |
| 6382501 | Furnace brazing A brazing method for joining to or more pieces of metal together includes running a molten brazing solder into a space between the pieces, heating at least the adjacent surfaces of the pieces to be joined to brazing temperature in a reducing atmosphere an... | 05/07/2002 |
| 6367687 | Method for preparing a plate rim for brazing A method is provided for treating cooperating, juxtaposed substantially uncoated alloy substrate surfaces in preparation for brazing, for example an inner wall of the radially outer open end of a turbine engine blading member with the rim of an end plate ... | 04/09/2002 |
| 6352195 | Method of forming an electronic package with a solder seal A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid... | 03/05/2002 |
| 6332567 | Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and g... | 12/25/2001 |
| 6180253 | Brazing or soldering material and production method thereof The present invention provides a joining, brazing or soldering material wherein solderability is effectively improved without using a flux, and a production method thereof. In production of a joining material, a halogen compound is mixed, a film is formed... | 01/30/2001 |
| 6119927 | Method and apparatus for placing and attaching solder balls to substrates A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pat... | 09/19/2000 |
| 6078031 | Method and device for joining oilfield tubulars A method for joining well and other oilfield tubulars by amorphous bonding comprises the steps of positioning a body of amorphous material (16) between adjacent and surfaces of a pair of oilfield tubulars (3, 4) that are to be joined and using induction h... | 06/20/2000 |
| 5961031 | Method and apparatus for forming hydrogen fluoride A method of forming hydrogen fluoride (HF), to allow fluxless soldering, from a solid source such as potassium hydrogen fluoride (KF.HF) using a specialized apparatus, including a cartridge which is heated in a controlled atmosphere apparatus. The gaseous... | 10/05/1999 |
| 5918354 | Method of making a piezoelectric element A piezoelectric resonator is provided which is formed of an element piece. This element piece further includes a piezoelectric material and an electrode formed on the surface of the piezoelectric material. A plug for mounting the element piece and a case ... | 07/06/1999 |
| 5845838 | Process for remelting a contact surface metallization Process for remelting a contact surface metallization (13) applied to a strate (10) in an inert or reducing medium, wherein the medium (18) is formed as alcoholic medium whose boiling point is the same as or above the melting point of the contact surface... | 12/08/1998 |
| 5770468 | Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere A method of producing a semiconductor chip on a chip carrier includes preparing a semiconductor chip having opposite front and rear surfaces and an active element on the front surface, applying solder to the rear surface of the semiconductor chip to a pre... | 06/23/1998 |
| 5720425 | Method of splicing rolled plates and aparatus for the same The invention provides a method of splicing rolled plates with each other, including the steps of (a) positioning a rear end portion of a leading rolled plate above a front end portion of a following rolled plate by a distance slightly greater than a diam... | 02/24/1998 |
| 5615825 | Fluorinated fluxless soldering A method for pretreating a solder surface for fluxless soldering is disclosed. The method uses a noble fluorine gas to remove surface oxides from solder surfaces, without the use of external stimulation. A noble fluorine gas is suffused across the solder ... | 04/01/1997 |
| 5609290 | Fluxless soldering method A fluxless soldering method utilizing a strongly internally bonded fluorine containing gas such as hydrogen fluoride (HF). The solder surface is exposed to the gas in place of a flux treatment, resulting in a modified surface layer which allows reflow or ... | 03/11/1997 |
| 5531372 | Moisture-free atmosphere brazing of ferrous metals The present invention discloses a novel, moisture-free atmosphere for brazing carbon steels that provides good braze flow and brazed joint quality with minimum or no formation of soot on brazed joints. According to the present invention, carbon steels are... | 07/02/1996 |
| 5509600 | Hot pressure welding of hot steel stock A method of hot pressure welding of hot steel stock, in which the ends of the steel stock are descaled mechanically and pressure joined under a reducing flame. Since re-oxidation after descaling is prevented and the feasible temperature for hot pressure j... | 04/23/1996 |
| 5492265 | Method for soldering printed-circuit boards under low pressure The invention relates to a method for soldering electronic components to printed circuit boards or other elements to be connected by soldering, as well as suitable continuous soldering systems. The use of electronic modules, designed in the form of printe... | 02/20/1996 |
| 5433372 | Process for the application of solder composition on the pins of electronic components A solder composition is applied to the pins of an electronic component. The pins of the component are brought into contact with solder at a soldering station having a bath exposed to a controlled atmosphere of low oxygen content maintained in a hood enclo... | 07/18/1995 |
| 5397871 | Light beam heating system with inert gas shield A light beam heating system is suited for use in performing local heating. The light beam heating system includes a light source for emitting light, an optical lens assembly for converging the light emitted from the light source on an object to be heated,... | 03/14/1995 |
