Bizarre Patents
Dining Table Having Integral Dishwasher
A space-saving dishwasher, which may be installed within a counter top or table, having a dish-carrying rack that is vertically shiftable through the open top of the dishwasher for facilitating loading and unloading of the dishes.
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| Number | Title | Issue Date |
| 8016184 | Method for manufacturing electronic component module A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective substrate including a plurality of electronic component modules includi... | 09/13/2011 |
| 7673786 | Welding shield for coupling heaters Systems for coupling end portions of two elongated heater portions and methods of using such systems to treat a subsurface formation are described herein. A system may include a holding system configured to hold end portions of the two elongated heater portions so t... | 03/09/2010 |
| 7661577 | Imidazole compound and use thereof A water-based composition for treating copper or copper alloy surface for lead-free soldering, the composition comprising a compound represented by general formula (1): wherein R1 is hydrogen or methyl, and eithe... | 02/16/2010 |
| 7425118 | Mask for shielding impellers and blisks during automated welding A mask is provided for shielding a radially extending edge of an impeller vane during a weld repair process, where the impeller vane extends radially and axially outwardly from a shaft. The mask comprises a hub and a flange. The hub has an outer surface and an openi... | 09/16/2008 |
| 7350686 | Method for supplying solder Obtained are fine-pitched pad electrodes and also solder bumps with a large amount of solder and a less difference in the amount. First, in an inert liquid in a liquid tank, a substrate is positioned with a surface facing up. Subsequently, the inert liquid containin... | 04/01/2008 |
| 7303939 | Electro- and electroless plating of metal in the manufacture of PCRAM devices Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a method of the invention, a memory device can be fabricated by depositing a chalcogenide material onto a ... | 12/04/2007 |
| 7282387 | Electro- and electroless plating of metal in the manufacture of PCRAM devices Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a method of the invention, a memory device can be fabricated by depositing a chalcogenide material onto a ... | 10/16/2007 |
| 7264988 | Electro-and electroless plating of metal in the manufacture of PCRAM devices Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a method of the invention, a memory device can be fabricated by depositing a chalcogenide material onto a ... | 09/04/2007 |
| 7249955 | Connection of package, board, and flex cable In some embodiments an apparatus includes a board, a package coupled to the board, and a flex cable coupled to the package and extending between the board and the package. Other embodiments are described and claimed. ... | 07/31/2007 |
| 7246736 | Supplying shielding gas A flexible articulate tubular device has a shank, a plurality of pivot rings, and a terminus with heat sensors and a fiber optic device. The flexible articulate tubular device is initially positioned, either manually or automatically, near a target weld path with th... | 07/24/2007 |
| 7211466 | Stacked die semiconductor device A stacked multichip package (100) has a base carrier (102) having a top side (108) and a bottom side (110), a bottom integrated circuit die (104) having a bottom surface (112) attached to the base carrier top side (108 | 05/01/2007 |
| 7170073 | Stainless steel product containing B and method for production thereof A stainless steel slab containing B, wherein a protecting material is joined onto at least two faces across the bloom from each other in a stainless steel bloom containing B of 0.3–2.5 mass %, being integrated into one-piece by forming a weld metal comprising a st... | 01/30/2007 |
| 7150390 | Flip chip dip coating encapsulant A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip e... | 12/19/2006 |
| 7134592 | Method and protection apparatus for installation of a temperature-sensitive electronic component Temperature-sensitive electrical and electronic components which are connected to a board by soldering during the installation process are protected from the heat during the soldering process in order to prevent permanent damage to the components. The solder connect... | 11/14/2006 |
| 7129573 | System having semiconductor component with encapsulated, bonded, interconnect contacts A semiconductor component includes a die having a pattern of die contacts, and interconnect contacts bonded to the die contacts and encapsulated in an insulating layer. The component also includes terminal contacts formed on tip portions of the interconnect contacts... | 10/31/2006 |
| 7109056 | Electro-and electroless plating of metal in the manufacture of PCRAM devices Non-volatile, resistance variable memory devices, integrated circuit elements, and methods of forming such devices are provided. According to one embodiment of a method of the invention, a memory device can be fabricated by depositing a chalcogenide material onto a ... | 09/19/2006 |
| 7098126 | Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints A method of fabricating electroplate solder on an organic circuit board for forming flip chip joints and board to board solder joints is disclosed. In the method, there is initially provided an organic circuit board including a surface bearing electrical circuitry t... | 08/29/2006 |
| 7070085 | Water soluble protective paste for manufacturing printed circuit boards An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. Af... | 07/04/2006 |
| 7066375 | Aluminum coating for the corrosion protection of welds A method for coating and an associated assembly including such a coating are provided. The assembly includes a workpiece defining a weld portion, such as a friction weld joint and a heat affected zone. A coating is disposed on the weld portion to at least partially ... | 06/27/2006 |
| 6997370 | Optical pickup device A method for assembling an optical disk apparatus involves disposing first and second short-cutting terminals at different faces of a housing and in parallel with a laser diode of the apparatus. In a first state of assembling, the first short-cutting terminal is sho... | 02/14/2006 |
| 6977213 | IC chip solder bump structure and method of manufacturing same Disclosed herein are a method of manufacturing a solder bump on a semiconductor device, a solder bump structure formed on a substrate, and an intermediate solder bump structure. In one embodiment, the method includes creating a bonding pad over a semiconductor subst... | 12/20/2005 |
| 6959855 | Carbon-based weld blanket, methods of making and methods of use A non-woven weld blanket for protecting automobile exteriors and interiors and industrial equipment from weld spatter, comprising a needle punched webbing of pre-oxidized, polyacrylonitrile (PAN) fibers. The fabric is assembled using these carbon precursor fibers th... | 11/01/2005 |
| 6955285 | Apparatus for aligning and dispensing solder columns in an array An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate includes a plurality of longitudinal guide grooves. A transparent co... | 10/18/2005 |
| 6942791 | Apparatus and method for recycling of dross in a soldering apparatus An apparatus and method for eliminating dross in a solder pot of a soldering machine by converting the dross into usable solder. The conversion apparatus is comprised of an impeller, a shroud, an electric motor for driving the impeller, a vacuum source operatively c... | 09/13/2005 |
| 6926191 | Process for fabricating external contacts on semiconductor components A polymer masking flux for fabricating external contacts on semiconductor components includes a polymer resin, a fluxing agent and a curing agent. The flux is configured to clean contact pads for the external contacts, and to hold the external contacts on the contac... | 08/09/2005 |
| 6923364 | Method for manufacturing air compressor assembly A method for manufacturing an air compressor assembly including, between a tank welding step and a final assembling step, a step of submerging a welded tank into a dip tank that contains cooling liquid treated with a corrosion inhibitor. In a preferred embodiment, i... | 08/02/2005 |
| 6921015 | Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder A method for protecting tin oxide coated solder surfaces against further oxidation and a method for fluxless solder joining of such surfaces is provided. ... | 07/26/2005 |
| 6918167 | Method of attaching and aligning a closure panel A method of aligning and duplicating alignment includes welding a washer over a larger opening in a hinge once in an aligned position relative to a vehicle door. The door is mounted into an alignment fixture and the hinges are installed over threaded studs extending... | 07/19/2005 |
| 6902102 | Soldering method and solder joint member In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated ... | 06/07/2005 |
| 6896977 | Method of brazing aluminum or aluminum alloy materials and aluminum alloy brazing sheet A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and ... | 05/24/2005 |
| 6854638 | Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed The solder paste printing method of the present invention mounts a solder paste containing therein as a solder material a Sn—Zn system solder on a mask, and urges the solder paste to make rolling over the mask from one end thereof toward the opposite thereof by me... | 02/15/2005 |
| 6772937 | Method and apparatus for applying viscous material By using an application unit having: a storage chamber for a viscous material; a discharge hole, for the viscous material, provided so as to communicate with the storage chamber, where a viscous-material feeding device for feeding the viscous material to the storage... | 08/10/2004 |
| 6691912 | Methods of avoiding blowhole formation by conditioning through holes and glass A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and c... | 02/17/2004 |
| 6648212 | Components coated with an aluminum-silicon alloy Components composed of aluminum or an aluminum alloy with a coating comprising an aluminum-silicon alloy deposited thereon by applying an alkali metal fluorosilicate and heating the resulting treated material. The alloy layer is effectively protected agai... | 11/18/2003 |
| 6635360 | Aluminum alloy brazing sheet A brazing sheet comprises a thin covering material and a core material as well as an Al--Si alloy brazing material inserted between the thin covering material and the core material. The brazing material further contains Mg, Bi and/or Zn, Sn, In. When the ... | 10/21/2003 |
| 6625873 | Method of making an injection molding nozzle with tip insert A method of making a heated injection molding nozzle with an integral tip insert. First, an inner portion, an outer collar portion, and an electrical heating element are made and integrally brazed together in a vacuum furnace using a first nickel alloy br... | 09/30/2003 |
| 6616410 | Oxidation resistant and/or abrasion resistant squealer tip and method for casting same The present invention provides for a squealer tip to include some proportion of a highly oxidation-resistant material, and a method for casting same, such that if any environmental coating were removed, the tip would retain some increased level of environ... | 09/09/2003 |
| 6605370 | Method of manufacturing an aluminium joined product Disclosed is a method of manufacturing an aluminium or aluminium alloy joined product, such as a shaped and hollow member, comprising the sequential steps of: (a) providing two parts made of aluminium or aluminium alloy, each part having a peripheral flan... | 08/12/2003 |
| 6592018 | Sealant against potting compound The present method relates to the use of a peelable anti-solder mask as a sealant against potting compound. In certain electrical apparatus, a modular component (300) must be attached to a side of a printed circuit board (PCB) (110) which has previously b... | 07/15/2003 |
| 6592020 | Lead-free solder paste The invention relates to a lead-free solder paste comprising a solder paste flux and solder alloy particles that are substantially lead-free wherein the solder paste flux comprises resin dissolved in a solvent and also includes undissolved resin particles... | 07/15/2003 |
