Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7070085 | Water soluble protective paste for manufacturing printed circuit boards An improved water soluble protective paste and a method for protecting metal circuits and pads on the surface of an electronic board during the manufacturing steps. A densifier is added to the paste making it easier and more efficient the dispensing of the paste. Af... | 07/04/2006 |
| 6613397 | Method and apparatus for manufacturing an aluminum clad product In a method for manufacturing an Al clad product, first, cladding material is fused and coated on base material having Al. Then, slurry material is coated on the cladding material coated on the base material, the slurry material including mixture of a flu... | 09/02/2003 |
| 6568582 | Application of friction stir welding to superplastically formed structural assemblies The superplastically formed structural assembly includes first and second structural members having facing surfaces. The first and second structural members can include a first outer structural member, a second outer structural member or at least one inte... | 05/27/2003 |
| 6332567 | Piezoelectric element, manufacturing method thereof, and mounting apparatus of piezoelectric resonators An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and g... | 12/25/2001 |
| 6073829 | Method and arrangement for attaching a component The invention is related to a method of fabricating an attachment bump of a component (11). In accordance with the invention, a flexible preform (13a) is fabricated, which is plated with materials (13b) appropriate for metallurgical bonding. The invention... | 06/13/2000 |
| 5961031 | Method and apparatus for forming hydrogen fluoride A method of forming hydrogen fluoride (HF), to allow fluxless soldering, from a solid source such as potassium hydrogen fluoride (KF.HF) using a specialized apparatus, including a cartridge which is heated in a controlled atmosphere apparatus. The gaseous... | 10/05/1999 |
| 5881947 | Method for soldering A method for soldering components to opposite sides of a receptive element includes the steps of applying a solder formulation to both sides of the receptive element (201) and placing components on a first side of the receptive element (204). The solder f... | 03/16/1999 |
| 5820015 | Process for improving the fillet-forming capability of brazeable aluminum articles A process for improving the fillet-forming capability of brazeable aluminum articles includes providing a brazeable aluminum article, having at least one surface; and contacting the surface with a dilute, aqueous solution of fluoridic compounds, for at le... | 10/13/1998 |
| 5816478 | Fluxless flip-chip bond and a method for making A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughene... | 10/06/1998 |
| 5735451 | Method and apparatus for bonding using brazing material High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to components, which are under atmo... | 04/07/1998 |
| 5609290 | Fluxless soldering method A fluxless soldering method utilizing a strongly internally bonded fluorine containing gas such as hydrogen fluoride (HF). The solder surface is exposed to the gas in place of a flux treatment, resulting in a modified surface layer which allows reflow or ... | 03/11/1997 |
| 5284290 | Fusion welding with self-generated filler metal NiAl is preheated to a temperature between 1530° C. and 1638° C. causing some of the aluminum to evaporate along the faying surfaces thereby forming a glazed layer of nickel rich self-generated filler metal. The glazed faying surfaces are placed in cont... | 02/08/1994 |
| 5186982 | Pin transfer applicator and method A method and an assembly useful for dispensing small quantities of liquid materials onto a workpiece. The assembly includes an applicator having a pin movable along a passageway from a retracted position to an extended position. As the pin moves to the ex... | 02/16/1993 |
| 5176749 | Preflux coating composition for copper A preflux composition suitable for use as a preflux for protecting the solderability of copper during a heating cycle comprising rosin, antioxidant, and a solvent system comprised of glycol ether and terpene and further including a dibasic acid, process f... | 01/05/1993 |
| 5150830 | Method of bonding a sheet of metal, such as copper, on an aluminum nitride substrate A method of bonding a sheet of metal such as copper on a substrate of aluminum nitride, the method comprising the following steps known per se: i) growing a layer of alumina on the aluminum nitride substrate by means of heat treatment; and ii) placing the... | 09/29/1992 |
| 5009360 | Metal-to-metal bonding method and resulting structure A method and resulting structure is disclosed in which a metal-to-metal bond is formed by heating the surfaces to be bonded in an oxidizing ambient atmosphere until the desired bond is achieved. Heating takes place at 700° C.-1200° C. and bonding may be... | 04/23/1991 |
| 5000371 | Method of producing a metallic interface A method for producing a metallic interface suitable for overlaying consists of exposing the area of an alloy combination to be overlayed to a temperature above its lower critical until an element reduced zone arises. This element reduced zone more easily... | 03/19/1991 |
| 4723597 | Heat exchanger core A heat exchanger core having a tube of aluminum material and heat transfer fins of aluminum material joined to each other with a brazing filler, which has at least part of the surface thereof coated with an inorganic sintered layer incorporating therein a... | 02/09/1988 |
| 4613069 | Method for soldering aluminum and magnesium Aluminum, magnesium, or their alloys are soldered by means of a tin-lead system following initial application of a thin coating of nickel-copper alloy.... | 09/23/1986 |
| 4463060 | Solderable palladium-nickel coatings and method of making said coatings A permanently solderable palladium-nickel electroplated coating is formed on electrically conductive surfaces. The coating has a first alloy layer of 46 to 82 atomic percent palladium and 18 to 54 atomic percent nickel. This first layer is covered by a co... | 07/31/1984 |
| 4167240 | Method of treating an electroplating solution comprising ions of gold and cyanide prior to electroplating and thermocompression bonding A method of treating a solution comprising ions of gold and cyanide is disclosed. The method comprises treating the solution with metallic gold to precipitate therefrom metallic silver.... | 09/11/1979 |
| 4157154 | Method for forming patterns of brazing alloy Brazing alloy on detailed aluminum parts is formed in an exact pattern of the joints to be brazed. An aluminum sheet having brazing alloy coated on one or both sides (e.g., a brazing sheet) is plated with electroless nickel and electrolytic copper which a... | 06/05/1979 |
| 4025036 | Process for fabrication of high impact strength composites An improved method for treating surfaces of aluminum sheets, and in particular, boron reinforced aluminum sheets, to render such sheets more amenable to diffusion bonding which consists in contacting the sheets prior to such diffusion bonding with an aque... | 05/24/1977 |
